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Friday, May 25, 2018
Industry News
STMicro steps up enviromental saving effort 5/23/2018
Absolute energy consumption decreased by 12% compared to 2016 in normalized terms. By the end of 2017, 26% of energy purchased by ST came from renewable sources. More than 91% of waste was reused, recovered or sent for recycling
Global demand on mobile DRAM surged in Q1 5/23/2018
According to DRAMeXchange, the worldwide market for DRAMs reached US$8.43 billion in the three-month period, up 5.3 percent from a year earlier.
Micron/Intel JV to announce Quad Level NAND 5/22/2018
Micron is now shipping the first solid state drive based on QLC NAND: an enterprise SATA drive branded the 5210 ION series.
Infineon to build $1.9 billion chip facility in Austria 5/22/2018
The plant will become the firm’s second facility after one in the east German city of Dresden that can make power chips on 300 millimeter-diameter wafers.
Samsung Foundary to setup R&D 5/22/2018
Samsung opened the R&D center under the crucial device solution arm, which oversees the company's critical chip business. The new center is focused on bolstering Samsung's capabilities in the foundry business.
Facebook agreed to use Qualcomm's 60GHz WiFi 5/22/2018
Facebook has agreed to use 60GHz technology from Qualcomm Technologies that harnesses unlicensed spectrum, and the pair will work with other partners — such as telecom operators and manufacturers — to ready the system for deployment.
Intel's 10nm Cannon Lake processors debutes 5/21/2018
Intel's first 10nm silicon was originally slated for release in late 2016, but technical challenges encountered in shrinking transistors to ever smaller scales led to the launch being delayed until 2017. The firm confessed that the company was pushing back volume production from the second half of 2018 to some point in 2019 after suffering "yield issues".
U.S. asked ZTE to change management as a condition 5/21/2018
Chinese telecom company ZTE Corp. will have to change its management, including by possibly appointing new board members, to win a reprieve from U.S. sanctions that shut it off from key suppliers.
Tsinghua Unigroup to expand cloud center 5/21/2018
Tsinghua Unigroup just signed a strategic cooperation pact with the Tianjin government to build a CNY12 billion (US$1.88 billion) base in the northern Chinese city as its national headquarters for cloud business.
Applied Materials see revenue below estimate 5/21/2018
The company’s forecast added to investor concerns over a slowing smartphone market, which had powered much of the boom in demand for high-end flash memory chips.
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