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Sunday, October 22, 2017
Industry News
Alexia application development kit now available 10/11/2017
This is the first far-field linear mic array solution available on the market, the kit has been designed for developers who are looking to integrate Alexa into smart panels, kitchen appliances, and other commercial and industrial electronics.
Intel sets up to do AI development in India 10/11/2017
Intel India has trained 9,500 developers, students and professors across 90 organisations in the past six months in the emerging field of artificial intelligence (AI).
Tech Gurus to rebuild Puerto Rico with innovative approach 10/10/2017
Google’s Loon project is to set up ballon-based communications in Puerto Rico and Tesla’s Elon Musk has discussed with the Governor the possibility of restoring power supplies by installing solar power infrastructure.
Japan to build 37 petaflops supercomputer 10/10/2017
The machine will use 1,088 servers, 2,176 Intel CPUs and 4,352 Nvidia graphics processing units.
Improving Li Battery charge time with asphalt carbon 10/10/2017
We can bring them from zero charge to full charge in five minutes, rather than the typical two hours or more needed with other batteries.
Proposed TSMC fab to cost $20 billion 10/10/2017
TSMC is now racing to meet the future demand it anticipates from computers and connected devices in the so-called Internet of Things, from cars to home appliances and voice-activated speakers.
Qualcomm to make concesstion with EU on NXP acquisition 10/10/2017
EU concerned the combined company may use incentives to squeeze out rivals and raise prices, as well change NXP’s intellectual property licensing model.
Apple reports iPhone 8 battery issue 10/9/2017
There were reports about the Apple’s latest iPhone 8 and 8 Plus are swelling up due to faulty batteries. There have been at least six cases from Japan, China, Hong Kong and Taiwan.
Intel debutes 14nm Coffee Lake 10/9/2017
Intel has released its Coffee Lake-based 14nm desktop processors including Core i7-8700K/8700, Core i5-8600K/8400 and Core i3-8350K/8100, as well as the corresponding Z370 chipsets.
Spin Transfer Technologies receives funding to develope ST-MRAM 10/9/2017
STT believes these superior specifications could accelerate the replacement of existing SRAM and DRAM memory, in particular in the faster growing Mobile and Enterprise segments
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