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Friday, March 24, 2017
Industry News
Globalfoundries offer 45nm RFSOI process acquired from IBM 2/23/2017
Designers can stack RF FETs in the process to achieve higher power and reliability. Active FETs can be “tuned for very high Ft/Fmax” for mmwave circuits in 5G products and front-ends for car radar.
U.S. Government clears Renesas/Intersil merger to go ahead 2/23/2017
The investigation of the merger transaction under which Renesas will acquire Intersil is complete and that there are no unresolved national security concerns with respect to the transaction.
Supreme Court: U.S. patent law does not cover export of a single component 2/23/2017
The justices ruled unanimously on Wednesday that the company's shipment of a single part of a patented invention for assembly in another country did not violate patent laws.
Foxconn starts massive recruit of college grads in China 2/22/2017
It marks the biggest college recruitment campaign undertaken by the giant electronics firm, which employs more than a million workers in its factories across China.
Micron to complete R & D facility in Boise 2/22/2017
Micron needs space because of a wider product base the company supports globally, including products from former Japanese chip maker Elpida Memory Inc., which Micron bought in 2013.
Pure-play foundries partner with memory companies on new process technology 2/22/2017
Pure-play foundries are partnering with their fabless clients to fabricate next-generation memory types, such as 3D NAND, MRAM and ReRAM, while memory chipmakers are developing the next-generation technologies in-house.
Toshiba wants $8.8 billion for semiconductor unit 2/22/2017
The company wants to take time negotiating the best price possible without setting a concrete deadline, although it aims to reach an agreement before the end of the next fiscal year.
Server memory demand drive memory module prices up 2/21/2017
Contract prices of server DRAM modules will increase by almost 40% sequentially on average this first quarter. The contract market for server DRAM modules is expected to see another sequential price hike of 10% in the second quarter.
Xiaomi to announce its own "Pinecone" AP chip 2/21/2017
Rather than fully relying on the likes of Qualcomm and MediaTek, Xiaomi can take advantage of Leadcore's cellular radio technology for its own chipsets, thus keeping costs down in the long term.
2016 R & D spending ranked 2/21/2017
Intel Corp. came first with R&D expenditures of $12.7 billion, followed by Qualcomm Inc. with $5.1 billion and Broadcom Ltd. with $3.1 billion.
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