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Thursday, April 27, 2017
Industry News
IBM/Tokyo Electron to put AI into semi manufacturing 3/27/2017
IBM and Tokyo Electron Ltd (TEL) have signed a joint development programme to add cognitive capabilities to TEL’s chip manufacturing equipment to track down anomalies so that the equipment keeps running smoothly.
Google calls for expansion in optical communications while controlling cost 3/27/2017
Urs Hölzle, vice president of technical infrastructure at Google, called for 2x cost reductions, 10x capacity gains, and more programmability on optical technologies.
Japanese government to scrutinize acquisition of Toshiba's memory chip business 3/27/2017
Japanese law requires advance notice of foreign acquisitions of Japanese companies in certain fields so the government can gauge the impact on national security. The government can recommend that a given deal be changed or scrapped if necessary.
Intel formed AI product development unit 3/27/2017
The Artificial Intelligence Products Group will focus on the development of chips and software products tied to machine learning, algorithms, and deep learning.
Thanks to DRAM prices, Micron is far ahead on quarterly revenue 3/24/2017
Global memory chip makers are on the cusp of what analysts call an ultra-super-cycle as supply bottlenecks created by efforts to make smaller yet more efficient chips weigh, while demand soars for data storage from smartphones and artificial intelligence to autonomous driving and the Internet of Things.
Samsung to work with eSilicon and Rambus to create HBM2 memory to network interface chip 3/24/2017
Samsung said I-Cube solution will be essential to network applications for high-speed signaling in networks, and will likely be adopted for other areas such as computing where high-speed processing power is required.
Japanese start-up to manufacture power diodes with gallium oxide process 3/24/2017
The firm is aiming to commercialise crystalline á-Ga2O3 (corundum/sapphire/ruby structure) in power transistors and Schottky diodes – with the intention of manufacturing 600V TO-220 diodes in 2018 to compete against silicon carbide power devices.
Flash storage is taking over 3/24/2017
‘It has reached a point in its technology development to be able to scale hugely to drive a transformational shift in computing and information processing, as it is radically faster than a traditional spinning disk, with much higher capacity,’
China/s aggressive expansion will drain tech telents globally 3/23/2017
China’s IC manufacturers are affecting the movement of industry talents worldwide as they continue to aggressively headhunt for senior managers and engineers. The competition for human resource is becoming fiercer and will reach a critical point this year
UMC to run 28nm in Xiamen 3/23/2017
UMC's transfer of 28nm process technology to subsidiary United Semiconductor (Xiamen) has been approved by the Investment Commission of Taiwan's Ministry of Economic Affairs
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