Fix Your Memory Module
 
Home
News
Products
Shop
Memory
Corporate
Contact
 

News
Industry News
Publications
CST News
Help/Support
Member Area
Tester Brochure
Demo Library
Software
Tester FAQs

biology medicine news product technology definition

Thursday, November 23, 2017
Memory Industry News
Email ArticlePrinter Format PreviousNext

China foundry SMIC to enter 7nm race


Wednesday, March 15, 2017

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) is looking to start R&D for 7nm process technology later in 2017, according to company CEO and executive director Tzu-Yin Chiu.

SMIC will join the world's major chipmakers including Intel, Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Globalfoundries capable of making 7nm chips, said Chiu, adding that the China-based foundry has in recent years put increased focus on advance-node technologies with annual R&D expenses accounting for as high as 12-13% of revenues.

SMIC spent nearly US$2.7 billion in 2016 capex which was relatively high compared to previous years levels, Chiu indicated. During the year, the company had record revenues of US$2.9 billion with 30.3% on-year growth.

SMIC is developing advanced-node technologies with Huawei and nano-electronics research institute Imec, Chiu noted. The foundry is also working with many IC design service providers including Brite Semiconductor, Cadence Design Systems, Synopsys, ARM and Mentor Graphics, and is partnering with equipment and materials suppliers such as Applied Materials, Advanced Micro-Fabrication Equipment (AMEC), ASML, Shin-Etsu Handotai and Sumco.

As for the backend, SMIC is teaming up with Jiangsu Changjiang Electronics Technology (JCET), and the pair has set up a joint venture to provide a more complete supply chain for advanced-node manufacturing, Chiu said. Besides, SMIC is looking to further expand its 12-inch lines, Chiu added.

In addition, Chiu expressed optimism about chip demand for emerging IoT applications in China. SMIC plans to roll out 40ULP process technology later in 2017 for higher-end products to further expand its offerings for the segment, according to Chiu.

By: DocMemory
Copyright 2017 CST, Inc. All Rights Reserved

Email ArticlePrinter Format PreviousNext
Latest Industry News
Goepel Electronics offers boundary scan method for testing memory modules11/22/2017
Toshiba is inching towards a settlement with Western Digital11/22/2017
Chinese government continue to invest big into Semiconductor11/22/2017
Qualcomm put IIoT projects in Taiwan on hold11/22/2017
Samsung: "Data is new oil,11/21/2017
Founder of SMIC to establish pure play CIDM in China11/21/2017
Samsung takes the lead followed by Intel, SK Hynix and Micron11/21/2017
Marvell to buy rival Cavium 11/21/2017
Major DRAM suppliers revenue up 25%11/20/2017
Intel committed to provide 5G modem chip by 201911/20/2017

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2017 CST, Inc. All Rights Reserved