Industry News
CST News
Member Area
Tester Brochure
Demo Library
Tester FAQs

biology medicine news product technology definition

Wednesday, March 21, 2018
Memory Industry News
Email ArticlePrinter Format PreviousNext

Micron call quit on 3D stack NAND cooperation with Intel

Tuesday, January 09, 2018

Intel Corp. and Micron Technology Inc. have announced that after the completion of their current generation of 3D-NAND flash memory technology the two companies will develop 3D-NAND flash memory independently.

However, the parting of the ways does not apply to the phase-change based 3D-XPoint memory. The two companies said they will continue to cooperate on 3D-XPoint memory at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah, which they also disclosed is now entirely focused on the production of 3D-XPoint memory.

The Intel-Micron third generation of 3D-NAND flash memory is due to be delivered towards the end of 2018 or early in 2019. Beyond that node the two companies will work independently "to better optimize the technology and products for their individual business needs," the companies said in a statement.

The two companies are currently ramping products based on their second-generation of 3D NAND technology based on 64 layers.

"Micron's partnership with Intel has been a long-standing collaboration, and we look forward to continuing to work with Intel on other projects as we each forge our own paths in future NAND development," said Scott DeBoer, executive vice president of Technology Development at Micron. "Our roadmap for 3D NAND technology development is strong, and we intend to bring highly competitive products to market based on our industry-leading 3D NAND technology."

By: DocMemory
Copyright 2018 CST, Inc. All Rights Reserved

Email ArticlePrinter Format PreviousNext
Latest Industry News
Rambus and IBM to develope hybrid memory system for servers3/21/2018
Apacer Technology achieved DDR4-2666 module production3/21/2018
IBM Power 9 processor outperforms X86 servers3/21/2018
KLA-Tencor acquires diverse Israel company, Orbotech3/21/2018
Server DRAM prices continue to rise due to high demand in China3/20/2018
Special foundry customized to niche process3/20/2018
China is certain that it can meet its own semiconductor production needs3/20/2018
5G and AI could lead semi industry to $500 billion3/20/2018
Notebook shipment recovers some3/19/2018
Micron's CEO Sanjay Mehrotra cites high barriers to entry for Chinese suppliers3/19/2018

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2018 CST, Inc. All Rights Reserved