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Wednesday, October 31, 2018 |
TSMC projected to tape out 5nm by April 2019 |
10/8/2018 |
TSMC taped out its first chip in a process making limited use of extreme ultraviolet lithography and will start risk production in April on a 5-nm node with full EUV. |
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Xilinx offers AI accelerator card |
10/5/2018 |
According to the company, customers can expect breakthrough performance improvement at low latency when running key data centre applications like real-time machine learning inference as well as video processing, genomics, and data analytics, among others. |
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TSMC ramps 7nm with EUV layers |
10/5/2018 |
TSMC announced that it taped out a customer chip in an N7+ node that can use EUV on up to four layers. EUV aims to lower costs by reducing the number of masks required for leading-edge designs.
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New flash production line at SK Hynix |
10/5/2018 |
The company said the new M15 line in Cheongju, covers some 60,000 square meters and will play a key role in bolstering the competitiveness of South Korea's chip industry as a whole.
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Winbond breaks ground for it new memory fab. |
10/4/2018 |
“The investment is the largest scale in the history of the park in Kaohsiung’s Lujhu District, surpassing all capital that has been invested over the past 15 years,” |
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North Korea steals from banks globally |
10/4/2018 |
North Korean group has stolen hundreds of millions of dollars by infiltrating the computer systems of banks around the world since 2014 through highly sophisticated and destructive attacks that have spanned at least 11 countries. |
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