Friday, February 23, 2007
To meet the needs of PC design engineers and systems integrators, Legacy Electronics has developed a 4-Gbyte DDR2 fully buffered dual in-line memory module (FB-DIMM) in a JEDEC-standard pin-out.
The 4-Gbyte DDR2 FB-DIMM is offered in a low-profile (1.18 inch or 30mm) PCB height in speeds ranging from PC2-3200 to PC2-5300.
As a result, Apple- and Intel-platform designers, and more specifically any high-speed, high-density blade server and 1U-Chassis designers, can address their applications' needs without stacking or using dual die devices.
"We believe Legacy is first to market with a qualified 4GB FB-DIMM for both the Apple and Intel platforms. Our design meets the height restrictions necessary for a 1U server chassis, and the popular MacPro," said Jason Engle, president of Legacy Electronics, in a statement.
The 4-Gbyte FB-DIMM supports the Advanced Memory Buffer (AMB), which replaces registers and phase lock loops (PLLs) used on other DIMMs. The AMB buffers the DRAM devices from the channel, and uses a high-speed, point-to-point differential interface to communicate with the controller. This process translates to increased system memory capacity, reduced memory channel pin count, and higher reliability.
By: DocMemory
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