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| Elon Musk Reveals Grok 3 AI Chatbot |
2/19/2025 |
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The model was trained on 200,000 GPUs and beats its rivals in math, science, and coding benchmarks, Musk says. It appears to coincide with a price hike on X Premium+ accounts.
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| Micron plans 12-layer HBM3E production for Nvidia |
2/19/2025 |
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According to reports from Seoul Economic Daily and Business Korea, Micron is making significant progress with its 12-layer HBM3E technology. Following sample distribution to customers in 2024, Micron's CFO Mark Murphy highlighted at a Wolfe Research event that their 12-layer HBM3E products achieve 20% less power consumption while delivering 50% more capacity compared to competitors' 8-layer versions.
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| Nvidia in talks to commercialize memory standard |
2/19/2025 |
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Nvidia is said to be in confidential discussions with Samsung Electronics and SK Hynix to commercialize SOCAMM, a new memory standard being called the "second high-bandwidth memory." SOCAMM, a DRAM module, enhances performance for personal AI supercomputers with superior cost performance and a compact design.
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| Intel's strategy shifts aimed at turning company arond |
2/18/2025 |
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“Intel’s new co-CEOs hosted their first conference call with commentary balanced and realistic, highlighting the meaningful challenges ahead at Intel and the view that there are no quick fixes, unfortunately,”
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| SK Hynix's North American revenue more than double in 2024 |
2/17/2025 |
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Semiconductor companies saw the largest revenue growth. SK Hynix's cumulative North American revenue from the first three quarters of 2023 totaled KRW9.7 trillion and more than doubled in the first three quarters of 2024, reaching KRW27.3 trillion.
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| Arm reportedly plans to become a chip manufacturer |
2/17/2025 |
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Arm’s CPU architecture is simpler, customizable and energy efficient, enabling it to garner a 99% market share in mobile devices because it’s better for battery-powered gadgets. In contrast, x86 is meant for higher-performance computing.
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| Chinese memory manufacturer advanced to 16nm DDR5 |
2/14/2025 |
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A detailed analysis by TechInsights of the Gloway DDR5-6000 UDIMM (32GB Kit) found 16 CXMT 16Gb DDR5 chips, each with a 66.99mm² die size, 0.239Gb/mm² bit density, and an estimated 16nm circuit linewidth.
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| Apple, Alibaba partner to bring AI to iPhones in China |
2/14/2025 |
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Apple has partnered with Alibaba to introduce Apple Intelligence AI features to iPhones in China, using Alibaba's Qwen model to meet government preferences. Alibaba Group Chairman Joe Tsai announced the collaboration, which aims to improve Apple's performance in China, where iPhones have fallen to third place.
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| China's chipmaking tool buying to likely drop |
2/14/2025 |
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China's investment in chipmaking tools is expected to decline by 6% to $38 billion this year due to US sanctions and overcapacity, according to TechInsights. Domestic toolmakers such as AMEC and Naura are gaining ground, but Chinese chipmakers still rely heavily on foreign suppliers for advanced lithography machines
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