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| Samsung to offer 1nm process with fork sheet tech |
3/31/2026 |
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Samsung Electronics is setting out to introduce a 1-nanometer process by 2031, using fork sheet technology to increase transistor density, according to reports. By placing a non-conductive wall between transistors, Samsung aims to increase the number of transistors per chip area.
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| Apple adds new suppliers to boost US component production |
3/30/2026 |
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Apple has expanded its American Manufacturing Program by partnering with Bosch, Cirrus Logic, TDK and Qnity Electronics to produce iPhone components domestically. Apple has earmarked $400 million through 2030 for the new partners. The components will be sent overseas for assembly; iPhones will not be assembled in the US.
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| Intel releases Xeon 600, Panther Lake CPUs with vPro |
3/27/2026 |
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Intel has launched the Xeon 600 central processing units and Core Ultra Series 3 processors, also known as Panther Lake, featuring the updated vPro platform. The Xeon 600, with up to 86 cores, supports up to 4TB of ECC memory, while the Core Ultra Series 3, certified for business use, includes the NPU 5 AI accelerator and the Xe3 iGPU.
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