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| Chip export controls emerge as US-China summit flashpoint |
5/13/2026 |
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Export controls on semiconductors are a key point of contention as the US continues to restrict China's access to advanced AI chips, lithography equipment, and high-bandwidth memory in a bid to slow Beijing's technological progress. In response, China is tightening export management of critical minerals and accelerating its domestic semiconductor development. This tit-for-tat approach has institutionalized export controls as a central feature of the ongoing rivalry, with the summit expected to address how both sides can manage these controls to avoid escalating into broader conflict while safeguarding their strategic
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| SK hynix Turns to Intel’s EMIB Packaging as TSMC CoWoS Bottlenecks Squeeze the AI Supply Chain |
5/12/2026 |
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As the race for the AI buildout continues to intensify, a shortage in the packaging industry has led memory manufacturer SK hynix to team up with Intel for chip packaging technology. After a strong comeback under CEO Lip-Bu Tan, Intel is now aiming to expand its presence in the packaging industry. The firm and SK hynix are collaborating on 2.5D packaging technology and Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology as shortages create tightness in the current packaging supply chain.
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| TSMC, Sony partner on image sensor development |
5/12/2026 |
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Taiwan Semiconductor Manufacturing Co. and Sony have signed a nonbinding memorandum of understanding to form a partnership for next-generation image sensor development and manufacturing. The companies plan to establish a joint venture, with Sony as the majority shareholder, at Sony's new fab in Kumamoto, Japan.
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| Memory capacity issue at SK Hynix has customers scrambling |
5/11/2026 |
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Major tech companies are reportedly offering to invest in SK Hynix's chip production lines and purchase ASML's extreme ultraviolet lithography machines amid a severe memory shortage driven by AI demand. The proposals, which include funding dedicated memory production lines, are unprecedented in the memory industry.
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| La Luce Cristallina begins 200mm BaTiO3 wafer production |
5/5/2026 |
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La Luce Cristallina has begun producing 200-millimeter barium titanate wafers at a new facility in Austin, Texas, becoming the second US manufacturer of such wafers. Barium titanate is gaining interest for modulators and photonic ICs due to its efficiency and performance, with applications in telecommunications, AI data centers and quantum computing
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| Qualcomm debuts custom silicon for AI, agentic phones |
5/4/2026 |
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Qualcomm has announced plans for custom silicon, including a dedicated central processing unit for "agentic experiences" and "agentic smartphones." The company will supply custom products to "a leading hyperscaler," with shipments expected in the December quarter, and expects to win 70% of Samsung's system-on-chip business this year and next.
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