Friday, August 12, 2022

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Industry News
US to tighten all EDA software shipment for ICs based on gate all-around transistors 8/11/2022
US President Joe Biden is said to have OK’d the ban which is with the Office of Management and Budget while details are completed.
India Government Offers Free Use of Indigenous 5G Test Bed 8/11/2022
Indian Government has decided to offer the use of indigenous 5G test bed free of cost to the government-recognized start-ups and MSMEs for the next six months, up to January 2023. It is available at a very nominal rate to all other stakeholders.
DRAM prices decline 8/11/2022
3Q consumer DRAM price drop from the original estimate of 8~13% to a quarterly decline of 13-18%.
Siemens was selected to participate in the Rapid Assured Microelectronics Prototypes (RAMP) Phase II initiative 8/11/2022
A program established by the United States Department of Defense (DoD) to develop secure design and prototyping capabilities to demonstrate how the DoD can securely leverage state-of-the-art microelectronics technologies without depending on a closed-security architecture fabrication process or facility.
Nvidia announce that second quarter revenue would be about 17% below forecast. 8/10/2022
The chip maker primarily blamed weakness in its videogaming business, which is mostly made up of graphics processors used in PC gaming rigs.
China is expanding EV charging points 8/10/2022
China’s electric vehicle (EV) charging points increased by 56% year-on-year (YoY) in 2021, according to Counterpoint Technology Market Research’s latest China Electric Vehicle and Charging Points Tracker.
Newsight Imaging receives Technology Innovation Leadership Award from Frost & Sullivan 8/10/2022
Newsight Imaging specializes in developing high-performance complementary metal-oxide-semiconductor (CMOS) image sensors for three-dimensional (3D) machine vision systems and spectral analysis applications, offering superior image quality and cost-effective solutions to its customers.
Micron to invest $40 billions in U.S. manufacturing based on passage of Chip Act 8/10/2022
U.S. President Joe Biden is expected to sign the act today, which will provide about $52 billion in subsidies and research grants to semiconductor companies that invest in the nation and limit their expansion in China.
STMicroelectronics’ latest multi-zone sensors can detect and track multiple targets 8/9/2022
Time-of-Flight (ToF) multi-zone sensors continuously scan their field of view to map the scene and gather intelligence without using a camera or recording images. By using ToF technology, the sensors can detect and track multiple targets, calculating at high speed their X/Y/Z coordinates and motion.
InnovationLab achieved breakthrough in additive manufacturing (AM) of printed circuit boards (PCBs) 8/9/2022
Funded by Horizon 2020, InnovationLab and its partner ISRA have developed a novel manufacturing process for copper-based solderable circuits. The circuits are screen printed and are compatible with conventional reflow processes.
Keysight collaborated with Nokia to demonstrate the first public 800GE test 8/9/2022
With the move to the 800GE pluggable optics on front panel ports, interconnect and link reliability requires a new round of validation cycles to support carrier-class environments. These high-speed interfaces create a unique challenge as new 800GE capable silicon devices, optical transceivers and high bandwidth Ethernet speeds must be accurately tested.
Qualcomm extends foundry contract with GlobalFoundries 8/9/2022
The announcement, following the passage of the U.S. CHIPS and Science Act last week, secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF’s most advanced semiconductor manufacturing facility in Malta, New York.
Intel cancels ts orders from TSMC for N3 wafers in 2023 8/8/2022
Intel is cancelling the bulk of its orders from TSMC for N3 wafers in 2023 because of design and verification delays on the GPU tile for the Meteor Lake mobile processor.
Microchip offers Portfolio of MPU-based System on Modules 8/8/2022
The SOM, based on the SAM9X60D1G System in Package (SiP), is a small 28-by-28 mm hand-solderable module that includes the MPU and DDR in a single package, along with power supplies, clocks and memory storage. The SAM9X60D1G-SOM is Microchip’s first SOM equipped with 4GB SLC NAND Flash to maximize memory storage of data in application devices, while the on-board DDR reduces the supply and price risks associated with memory chips.
Lip-Bu Tan receives Semiconductor Industry Association’s (SIA) highest honor, the Robert N. Noyce Award 8/8/2022
Lip-Bu Tan, is executive chairman and former CEO of Cadence Design Systems Inc., founder and chairman of venture capital firm Walden International, and founding managing partner of Walden Catalyst Ventures
Silicon photonics integration enables cost-effective optical interconnects in HPC systems and data centers 8/8/2022
Scintil Photonics was founded in 2018 to develop and commercialize a technology for integrating lasers onto silicon ICs developed by CEA-Leti.
AMD reported revenue growth by 70% 8/5/2022
Non-GAAP net income for the quarter was $1.707 billion, or $1.05 a share, beating expectations of $1.05 a share on revenues of $6.5 billion on a non-GAAP basis. AMD’s shares are down 3.7% to $95.55 a share in after-hours trading.
Pelosi to meet chairman of TSMC face-to-face 8/5/2022
House Speaker Nancy Pelosi (D-Calif.) will meet with the chairman of Taiwan’s biggest semiconductor manufacturer during her visit to the island, in a sign of how vital computer chips are to the U.S. economy and national security.
Arm is leveraging Cadence Design Systems Inc.’s to enhance the quality of its embedded memory 8/5/2022
With Liberate MX Trio Characterization, Arm achieved its accuracy and capacity requirements and reduced memory liberty variation format (LVF) characterization validation runtime by 7X when compared with brute-force Monte Carlo simulation.
Intel's mass production of the tGPU chipset in Meteor Lake to be postponed 8/5/2022
Intel Corp. plans to outsource the tGPU (tiled GPU) chipset in Meteor Lake to Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) for manufacture, according to TrendForce research. Mass production of this product was initially planned for the second half of the year (2H22) but was later postponed to 1H23 due to product design and process verification issues.
IC market recorded its first-ever June sequential sales decline 8/4/2022
Based on data from WEMA, SIA, and WSTS dating back to 1976. Typically, high single-digit or double-digit sales gains have been the pattern for June IC sales. Even in its previously weakest year (1985), June IC sales increased 1%. Never, until this year, have June IC sales declined.
Apacer will return to AGE Australia and showcase its industrial PCIe SSDs 8/4/2022
The Australian Gaming Expo (AGE), which has been postponed for two years due to the worldwide pandemic, officially returns this year. Industrial storage and memory brand Apacer will return to participate in the AGE in Sydney, Australia from August 9–11,
Semtech Corp. to acquire Sierra Wireless Inc for a total enterprise value of $1.2 billion. 8/4/2022
The acquisition will significantly expand Semtech’s addressable market and is expected to approximately double Semtech’s annual revenue and create a strong and diverse portfolio of connectivity solutions for the growing IoT market, making it easier for customers to find innovative end to end solutions for any segment.
Infineon has reported another robust quarter 8/4/2022
Despite the challenging macroeconomic and geopolitical situation, Infineon has reported another robust quarter with revenue of €3.6 billion, up 10% sequentially and 33% year over year, in the third quarter of its fiscal year 2022. The Munich, Germany-based chipmaker has raised its revenue forecast for the full year 2022.
SK hynix discloses 238-layer 4D NAND Flash product 8/3/2022
According to the company, the latest achievement follows development of the 176-layer NAND product in December 2020. The latest 238-layer product is most layered and smallest in area at the same time.
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