Home News Products Corporate Contact

Tuesday, April 28, 2026

News Industry News Publications CST News Help/Support Software Tester FAQs

SK Group Signs MOUs to Advance Vietnam’s AI Ecosystem and Infrastructure Development 4/28/2026 SK Group will collaborate with Vietnam to develop the country’s AI ecosystem and infrastructure. Rambus SOCAMM2 Server Module Chipset Enables Power-efficient AI Platforms 4/28/2026 Rambus's SOCAMM2 chipset is designed to enable low-power, high-performance LPDDR5X-based memory modules for AI server platforms. Smart Glasses Propel Growth of XR Market in 2025 4/28/2026 The rapid adoption of smart glasses fueled the 44.4% year-over-year growth of the global extended reality (XR) device shipments in 2025. TSMC Launches A13 Process and Advanced Technologies 4/28/2026 A13 maintains full backward compatibility with A14 design rules, enabling faster customer migration to the company’s nanosheet transistor architecture... Skydio pledges $3.5B to expand US drone manufacturing 4/27/2026 The funds will go toward establishing a fifth facility that will be “five times larger” than its other facilities in California, the Silicon Valley-based company said. Data center boom continues to buoy Texas Instruments 4/27/2026 On an earnings call, the company reported net income of $1.55 billion and gross profit of $2.8 billion. YouTuber Tackles the RAM Crisis by Making It Himself in a Home Clean Room 4/27/2026 This is not an affordable solution, but Dr. Semiconductor built a clean room in a backyard shed and used it to build his own RAM. Meta Informs Staff It Will Cut 8,000 Jobs Next Month 4/27/2026 Meta will also close 6,000 open positions. The company is taking these actions to offset its other investments, according to a leaked memo. Elon Musk Confirms Millions of Tesla Cars Need New Hardware For Full Self-Driving 4/24/2026 After years of selling vehicles that would one day run Full Self-Driving (FSD) features, Tesla has now confirmed that the hardware isn’t up to the task on millions of cars. TSMC plans to open chip packaging plant in Arizona by 2029 4/24/2026 TSMC said it ?was applying for permits to begin construction of its first advanced packaging ?plant in an existing Arizona facility, but did not give a ?timeline for when it will come online. Elon Musk says his TeraFab facilities will use Intel's 14A process technology to make AI chips 4/24/2026 SpaceX will be responsible for high-volume chip manufacturing in likely Intel tech licensing deal. JEDEC's LPDDR6 standard boosts AI workloads 4/24/2026 JEDEC has previewed its LPDDR6 memory standard, featuring SOCAMM2 modules and capacities up to 512 gigabytes. The standard aims to enhance performance and efficiency for AI data centers, PCs and mobile platforms, with memory makers already sampling LPDDR6 modules. Intel-Google Alliance Signals CPU Resurgence in AI Infrastructure Era 4/23/2026 Intel's CPU-centric tie-up with Google comes weeks after Arm launched a processor for agentic AI. Broadcom agrees to support development of Meta’s next-generation AI chips 4/23/2026 The “multiyear, multigenerational” deal builds on the companies’ existing AI chip partnership to support Meta Training and Inference Accelerator chips, Broadcom said. Apple Eyes Product Engineering Revival with CEO Transition 4/23/2026 The upcoming CEO, John Ternus, is known for engineering competence and spearheading in-house silicon into Apple products. OpenAI patent details AI chip with advanced HBM integration 4/23/2026 OpenAI has unveiled a patent for a custom AI chip featuring multiple compute chiplets and 20 high-bandwidth memory stacks, connected using embedded logic bridges similar to Intel's Embedded Multi-Die Interconnect Bridge. The design strives to overcome current packaging limitations by extending communication distances from 6 millimeters to 16 millimeters, potentially supporting larger AI models and high-performance computing. Foundry 2.0 Market Projected to Grow 17% in 2026 Amid AI Compute Boom 4/22/2026 The broadly defined Foundry 2.0 market is projected to surpass $360 billion in 2026, representing 17% YoY growth, according to IDC. Tim Cook to Step Down as Apple CEO, Hand the Reins Over to John Ternus 4/22/2026 Ternus, senior vice president of hardware engineering, will officially become Apple's new CEO in September. Cook will remain as the company's executive chairman. SK Hynix begins work on first US chip plant in Ind. 4/22/2026 SK Hynix has started building its first semiconductor facility in the US, located in Indiana, to expand advanced packaging for AI memory and enhance its global supply chain. The $3.87 billion project is set to begin mass production in 2028, focusing on high-bandwidth memory products. The plant's proximity to Purdue University is expected to foster collaboration. Pasta and pizza sauce company Prego has launched a recording devic to capture mealtime chats 4/21/2026 Made in partnership with StoryCorps, Prego's puck-like 'Connection Keeper' device is designed to preserve key family conversations. Silicon Motion unveils SM8008 PCIe Gen5 controller for enterprise boot SSDs 4/21/2026 Silicon Motion has introduced a PCIe Gen5 x4 NVMe controller for enterprise boot solid-state drives, targeting power-sensitive storage in data centers. Built on Taiwan Semiconductor Manufacturing Co.'s 6-nanometer process, it offers up to 14 GB/s throughput and 2.3 million input-output operations per second, while consuming less than 5 watts. GlobalFoundries & AMD Working Together on Co-Packaged Optics Hardware For Instinct MI500 Accelerators 4/21/2026 AMD will be leveraging GlobalFoundries for the development of its MRM Co-packaged Optic solution for the next-gen Instinct MI500 AI accelerators. Tesla Pulls 2nm AI Chip Production Onto US Soil 4/21/2026 Elon Musk lays out the plans for Tesla's future AI ecosystem, utilizing both Samsung & TSMC 2nm tech for AI6 & AI6.5 chips. Foundry 2.0 Market Projected to Grow 17% in 2026 Amid AI Compute Boom 4/20/2026 The broadly defined Foundry 2.0 market, comprising pure-play foundry, non-memory IDM, outsourced semiconductor assembly and test (OSAT), and photomask fabrication, is projected to surpass $360 billion in 2026, representing 17% year-over-year growth, according to International Data Corp.’s (IDC) latest Global Semiconductor Supply Chain Tracking Intelligence, AGIBOT deploys semi-humanoid robots in electronics manufacturing 4/20/2026 AGIBOT said it has achieved large-scale industrial implementation of embodied AI systems within core production workflows in consumer electronics manufacturing.  1  |  2  |  3  |  4  |  5  |  6  |  7  |  8  |  9  |  10

Copyright © 1994 - 2023 CST, Inc. All Rights Reserved