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| HBM in the Spotlight Again |
4/11/2025 |
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HBM technology continues its relentless march in 2025 with the imminent arrival of more advanced HBM4 memory devices.
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| Global Chip Sales Up 17% in February |
4/10/2025 |
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Global semiconductor sales reached $54.9 billion in February 2025, up by 17.1% year-on-year but down by almost 3% from the previous month.
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| FMC, Neumonda introduce DRAM+ technology |
4/9/2025 |
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Ferroelectric Memory Co. has partnered with Neumonda to produce DRAM+, a nonvolatile memory using ferroelectric hafnium oxide, in Germany. The technology combines DRAM performance with solid-state drive-like data retention, targeting applications in AI, automotive and industrial sectors. Neumonda will support with advanced testing systems, aiming to revive semiconductor capabilities in Europe.
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| YMTC patents highlight advances in 3D NAND technology |
4/8/2025 |
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Yangtze Memory Technologies has published almost 20 patents for processes to enhance computing efficiency and optimize chip stacking, showcasing its technological prowess in 3D NAND. The patents include innovations in stacking structures, electromagnetic interference shielding and data refreshing methods
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| GUC debuts HBM4 IP with advanced monitoring |
4/8/2025 |
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Global Unichip has completed the first tape-out of an HBM4 controller and PHY IP, using Taiwan Semiconductor Manufacturing Co.'s N3P process and CoWoS-R packaging. The HBM4 IP supports data rates up to 12 Gbps, offering 2.5 times the bandwidth of HBM3, and integrates proteanTecs' monitoring for enhanced reliability.
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| US Investment Accelerator seeks to revamp CHIPS deals |
4/8/2025 |
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President Donald Trump has signed an executive order to create the US Investment Accelerator, aiming to negotiate better deals under the CHIPS and Science Act. Commerce Secretary Howard Lutnick will oversee the initiative, which could alter environmental protections and increase private contributions for fab construction.
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| UMC Inaugurates New Fab in Singapore |
4/7/2025 |
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The new facility is equipped for manufacturing with UMC's 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore's semiconductor sector.
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| Intel, TSMC plan US manufacturing JV |
4/7/2025 |
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Intel and Taiwan Semiconductor Manufacturing Co. have reportedly reached a preliminary agreement to form a joint venture to operate Intel's US fabs, with TSMC owning 20%, according to The Information. The US government is said to have influenced the deal to stabilize Intel amid operational challenges.
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