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| The U.S.-China Summit Signals a New Asian Order |
5/14/2026 |
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U.S. President Donald Trump and Chinese President Xi Jinping are expected to engage in strategic talks on supply chains, Taiwan, and global security issues during their May 14–15 Beijing summit.
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| imec showcases 3D CCD memory breakthrough for AI applications |
5/14/2026 |
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Imec has launched its first functional 3D charge-coupled device for memory applications, a breakthrough that could meet the increasing AI data demands. The 3D CCD device uses an indium gallium zinc oxide channel and achieves charge transfer speeds exceeding 4 MHz.
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| NASA, Microchip collaborate on next-gen spaceflight chips |
5/14/2026 |
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NASA has partnered with Microchip Technology to develop next-generation spaceflight chips, aiming to deliver processors with 100 times the computing power of current models. The chips will come in radiation-hardened and radiation-tolerant versions, supporting missions to Mars, the moon and low-Earth orbit. The system-on-a-chip design will enhance power efficiency and allow for some autonomy, and potential Earth-based applications include medical equipment and AI.
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| Chip export controls emerge as US-China summit flashpoint |
5/13/2026 |
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Export controls on semiconductors are a key point of contention as the US continues to restrict China's access to advanced AI chips, lithography equipment, and high-bandwidth memory in a bid to slow Beijing's technological progress. In response, China is tightening export management of critical minerals and accelerating its domestic semiconductor development. This tit-for-tat approach has institutionalized export controls as a central feature of the ongoing rivalry, with the summit expected to address how both sides can manage these controls to avoid escalating into broader conflict while safeguarding their strategic
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| SK hynix Turns to Intel’s EMIB Packaging as TSMC CoWoS Bottlenecks Squeeze the AI Supply Chain |
5/12/2026 |
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As the race for the AI buildout continues to intensify, a shortage in the packaging industry has led memory manufacturer SK hynix to team up with Intel for chip packaging technology. After a strong comeback under CEO Lip-Bu Tan, Intel is now aiming to expand its presence in the packaging industry. The firm and SK hynix are collaborating on 2.5D packaging technology and Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology as shortages create tightness in the current packaging supply chain.
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| TSMC, Sony partner on image sensor development |
5/12/2026 |
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Taiwan Semiconductor Manufacturing Co. and Sony have signed a nonbinding memorandum of understanding to form a partnership for next-generation image sensor development and manufacturing. The companies plan to establish a joint venture, with Sony as the majority shareholder, at Sony's new fab in Kumamoto, Japan.
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| Memory capacity issue at SK Hynix has customers scrambling |
5/11/2026 |
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Major tech companies are reportedly offering to invest in SK Hynix's chip production lines and purchase ASML's extreme ultraviolet lithography machines amid a severe memory shortage driven by AI demand. The proposals, which include funding dedicated memory production lines, are unprecedented in the memory industry.
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