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Thursday, March 27, 2025

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Strong DRAM HBM Demand Propels Chip Equipment Manufacturers’ 2024 Revenue 3/27/2025
Net revenue of the top five IC equipment manufacturers increased by 8% YoY, with strong growth coming from both systems and service segments.
Samsung Co-CEO Han Jong-hee Dies of Heart Attack at 63 3/27/2025
The executive at the consumer electronics giant had just named a co-CEO to join him a week before his death.
Foundry 2.0 to grow 11% this year 3/27/2025
The Foundry 2.0 market — defined as encompassing foundry, non-memory IDM, OSAT, and photomask making —is projected to reach a market size of $298 billion in 2025, with year-over-year growth of 11%.
Russian Hackers Are Trying to Break Into Signal Chats 3/27/2025
Days before we learned about the 'war plans' Signal chat, the Pentagon sends a department-wide email warning that Russian hackers are exploiting Signal's 'linked devices' feature.
Hyundai to invest $21B in US manufacturing 3/26/2025
The automaker plans to build a $5.8 billion steel plant in Louisiana as part of the investment.
Ant Group reportedly reduces AI costs 20% with Chinese chips 3/26/2025
The company still uses Nvidia but now relies mainly on Chinese chips.
Euro semi firms push for 'Chips Act 2.0' to expand beyond manufacturing 3/26/2025
Industry leaders want broader strategy, citing supply chain gaps, investment needs, and global trade uncertainty.
Samsung, SK Hynix compete for HBM4 dominance 3/26/2025
Samsung Electronics and SK Hynix will compete for dominance in the high-bandwidth memory market this year, aiming to strengthen their positions in the AI chip sector. SK Hynix has showcased a prototype of the 12-layer HBM4 at GTC 2025 and plans mass production in the second half of the year. Samsung has moved up its HBM4 launch by six months and plans to start mass production in the second half as well.
SK Hynix releases HBM4 samples, with eye on mass production this year 3/25/2025
According to the chipmaker, it recently provided samples of its 12-layer HBM4 to major clients for qualification tests. HBM4 is the sixth generation of HBM, which plays a critical role in accelerating processes for graphics processing units (GPUs) and other AI accelerator chips.
TSMC 2nm yields nearly ready for mass production 3/25/2025
Taiwan Semiconductor Manufacturing Co. is close to mass-producing 2-nanometer chips, with potential output reaching 50,000 wafers per month by year-end. TSMC's fabs in Baoshan and Kaohsiung in Taiwan, at full capacity, can run 80,000 wafers per month, which would meet initial demand.
Apple May Add Cameras and AI to Apple Watches by 2027 3/25/2025
Bloomberg predicts the eventual plan for the cameras is to enable Visual Intelligence-style features, which allow users to leverage AI to get more information about their environment.
SpaceX is developing New Starlink Dishes for Gigabit Speeds 3/25/2025
SpaceX is developing a new Starlink dish meant to offer gigabit internet to customers, a big boost from current download speeds, which are closer to 200Mbps.
FCC Moves To Further Kick Out Huawei, ZTE From US 3/24/2025
The FCC is concerned Huawei, ZTE and other Chinese firms are trying to conduct business in the country, despite regulations blocking new equipment sales to US clients.
Small Business Administration launches ‘Made in America’ manufacturing effort 3/24/2025
As part of the effort, the agency said it will cut $100 billion in regulation through the Office of Advocacy and launch a Red Tape Hotline for small business owners and manufacturers to share feedback and call out what they believe to be unnecessary regulations.
Imec, Zeiss extend partnership for sub-2nm semiconductor R&D 3/24/2025
Imec, the research and innovation hub, and ZEISS Semiconductor Manufacturing Technology (SMT), a technology company that specialises in optoelectronics and is a supplier of key components for microchips, are intensifying their collaboration.
Micron, SK Hynix, Samsung debut SOCAMM 3/24/2025
Micron Technology, SK Hynix and Samsung Electronics have introduced small outline compression attached memory modules using LPDDR5X, targeting AI and low-power servers. These modules, debuting with Nvidia's GB300 Grace Blackwell Ultra Superchip systems, offer up to 128GB capacity and lower power consumption compared with DDR5.
TSMC pitched Intel foundry joint venture to Nvidia, AMD, Broadcom: sources 3/13/2025
Under the proposal, the Taiwanese chipmaking giant would run the operations of Intel's foundry division, which makes chips adapted for the needs of customers, but it would not own more than 50 percent.
A Rivian software update released today adds a new self-driving system for highways 3/13/2025
Enhanced Highway Assist is Level 2 autonomous tech that works on 135,000 miles of highway, with plans to expand off-highway over the next year.
Foxconn launches own AI model 3/13/2025
The “FoxBrain” large language model was initially designed to support the contract electronics manufacturer’s in-house functions, including data analysis, reasoning and problem solving.
Memory Safety is Key to Addressing Cyber Security 3/13/2025
CHERI aims to enhance cybersecurity by tackling memory safety vulnerabilities.
Lattice Targets Low Power Edge AI with New Small FPGA 3/12/2025
Lattice recently released small FPGA platform targeting embedded edge AI applications is Lattice Semiconductor’s Nexus 2 platform.
ASML to open Beijing facility despite US sanctions on China 3/12/2025
Center will reuse and recondition systems returned from field.
Huawei reportedly acquired two million Ascend 910 AI chips from TSMC last year through shell companies 3/12/2025
Huawei reportedly acquired 2 million Ascend 910 AI chips from Taiwan Semiconductor Manufacturing Co. last year using shell companies, according to a report.
Elon Musk Blames X Outage on 'Massive Cyberattack' 3/12/2025
A 'pro-Palestinian hacktivist group' known as Dark Storm takes responsibility for the DDoS attack, which started early Monday morning.
Keysight and MediaTek Achieve Near 12Gbps 5G IP Data Throughput 3/11/2025
This achievement ensures MediaTek’s solutions are prepared for next-generation applications, including immersive gaming, ultra-high-definition streaming, and low-latency cloud computing.
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