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| Amazon considering entering semiconductor market |
4/13/2026 |
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Amazon might enter the semiconductor merchant market, making it, by revenue, the fourth-largest chip company, according to CEO Andy Jassy. Amazon's chip business, including Graviton and Trainium, has an annual run rate of $20 billion and could reach $50 billion if it sold chips externally, Jassy says.
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| Global semiconductor revenue to hit $1.3T |
4/13/2026 |
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Global semiconductor revenues are expected to surpass $1.3 trillion this year, marking the highest growth in two decades, according to a report by Gartner. Memory revenue is projected to triple amid "memflation," with DRAM and NAND flash prices rising 125% and 234%, respectively. AI semiconductors are set to constitute 30% of total revenue, driven by strong hyperscaler investments in AI infrastructure.
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| Reports: Nvidia Rubin GPUs face delays |
4/10/2026 |
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Nvidia's Rubin GPUs are expected to face delays and reduced shipment volumes due to a memory shortage and technical challenges, according to TrendForce. The challenges include validating HBM4 memory, migrating to ConnectX-9 network interface cards, higher power consumption and advanced cooling requirements.
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| Samsung moves forward with Texas semiconductor fab |
4/9/2026 |
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Samsung Electronics has begun the equipment installation and commissioning phase at its Taylor, Texas, semiconductor fab. This phase includes testing extreme ultraviolet lithography equipment, a key component of semiconductor manufacturing, marking a pivotal step in the facility's operational readiness.
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| Alibaba, China Telecom open AI-focused data center |
4/9/2026 |
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Alibaba and China Telecom have opened a data center in Shaoguan, China, powered by 10,000 of Alibaba's Zhenwu AI chips, with plans to expand to 100,000 chips. The data center supports AI models with hundreds of billions of parameters and is part of China's push for self-sufficiency in AI and semiconductor technology amid US restrictions.
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| SK Hynix supplies 321-layer QLC SSD to Dell |
4/9/2026 |
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SK Hynix has started supplying a 321-layer quad-level cell consumer solid-state drive to Dell Technologies, expanding its NAND flash portfolio. The PQC21 drive, available in 1-terabyte and 2-terabyte capacities, uses a 2230 form factor and features a Periphery Under Cell architecture to reduce die size.
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| Renesas rad-hard ICs play key role in Artemis II |
4/7/2026 |
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Renesas' radiation-hardened ICs are integral to NASA's Artemis II mission. The Intersil-branded devices are used in the Orion capsule and Space Launch System rocket, regulating power and maintaining signal integrity.
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| February chip sales up 61.8% YoY |
4/7/2026 |
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“Global chip sales remained very strong in February, exceeding January’s totals and far outpacing sales from February of last year,
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| Mistral AI is seeking Samsung memory |
4/7/2026 |
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Mistral AI is in discussions with Samsung Electronics to secure its advanced memory chips as it expands its AI infrastructure, sources say. Mistral CEO Arthur Mensch recently visited Samsung's Hwaseong campus and met with Jun Young-hyun, Samsung's vice chairman of semiconductors, and Samsung Chairman Lee Jae-yong. Mistral is building a data center outside Paris, slated to start operations in the second quarter.
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| Rapidus steps up 1nm development as Japan seeks to close gap with TSMC |
4/6/2026 |
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Japan’s Rapidus is accelerating its push into advanced semiconductor manufacturing, with the company aiming to reduce its technology gap with Taiwan Semiconductor Manufacturing Company (TSMC) to roughly six months at the 1nm node, according to comments made by Chief Technology Officer Kazunari Ishimaru.
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| TSMC reportedly eyes major expansion in Arizona |
4/6/2026 |
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TSMC is reportedly considering a significant expansion in Arizona, potentially increasing its capacity to 12 fabrication plants, four advanced packaging facilities and a research-and-development center. This expansion is said to be part of a $500 billion investment agreement between the US and Taiwan.
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| Micron developing stacked GDDR for AI inference, with prototype targeted for 2027 |
4/3/2026 |
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Micron Technology is working on what could be the first stacked graphics dynamic random-access memory for AI inference and high-performance graphics, with a prototype expected in 2027, according to reports. The stacked GDDR could offer a cost-effective alternative to high-bandwidth memory, although it won't match HBM in raw performance.
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