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| Intel undergoes executive shake-up; Holthaus steps down |
9/10/2025 |
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Michelle Johnston Holthaus, executive vice president and general manager of the Client Computing Group at Intel Corp., speaks during the Intel AI Everywhere launch event in New York, US, on Thursday, Dec. 14, 2023. Intel Corp. announced new chips for PCs and data centers that the company hopes will give it a bigger slice of the booming market for artificial intelligence hardware. Photographer: Victor J. Blue/Bloomberg via Getty Images
Johnston Holthaus (Bloomberg/Getty Images)
Intel is undergoing another executive shake-up with the departure of Michelle Johnston Holthaus, CEO of products. She joined Intel nearly 30 years ago and took on the role of CEO of products just 10 months ago. Other executive moves include Kevork Kechichian, previously of Arm, leading Intel's Data Center Group, and Jim Johnson heading the Client Computing Group.
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| U.S. Export Waiver Revocations Put Samsung and SK hynix in Limbo |
9/9/2025 |
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The end of VEU status—materializing in 120 days—means that Intel, Samsung, and SK hynix will have to seek licenses to purchase American chip fabrication gear for their manufacturing facilities in China. It will lead to case-by-case reviews, which could take three to six months to obtain a license.
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| TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs |
9/9/2025 |
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The change comes as U.S. lawmakers advance the Chip EQUIP Act, a proposal that would prohibit companies receiving American subsidies from buying tools from “foreign entities of concern,” including Chinese firms such as AMEC and Mattson Technology.
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| Chinese tech firms continue to eye Nvidia chips |
9/9/2025 |
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Chinese tech companies remain interested in Nvidia's AI chips despite Beijing's discouragement, sources say. The companies are particularly monitoring the H20 model, which Nvidia recently regained permission to offer in China, and a more powerful chip, known as the B30A, which could be twice as expensive.
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| US considers annual export approvals in China |
9/9/2025 |
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The US is considering yearly approvals for the export of chipmaking supplies to SK Hynix and Samsung Electronics factories in China, according to Bloomberg reports. The proposal, presented by the US Commerce Department to South Korean officials, would replace indefinite authorizations previously granted to the companies
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| TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs |
9/4/2025 |
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The change comes as U.S. lawmakers advance the Chip EQUIP Act, a proposal that would prohibit companies receiving American subsidies from buying tools from “foreign entities of concern,” including Chinese firms such as AMEC and Mattson Technology.
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| Toshiba debuts 650V SiC MOSFETs with TOLL packaging |
9/3/2025 |
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Toshiba has introduced three industrial 650V silicon carbide metal-oxide-semiconductor field-effect transistors in TO-leadless packaging, with on-resistance as low as 27 milliohms. The TOLL package, a nine-pin, four-terminal design, reduces switching losses by minimizing parasitic impedance.
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| Qualcomm to add Single Photon Active Sensor tech to Snapdragon |
9/1/2025 |
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Qualcomm plans to integrate VoxelSensors' Single Photon Active Event Sensor technology into the Snapdragon AR2 Gen 1 Platform to enhance 3D sensing for robotics and extended-reality applications. The SPAES sensors can detect single photons and generate high-resolution 3D data at a rate of up to 100 million points per second.
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