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| PCIe 8.0 Expected to Deliver 256 GT/s |
9/22/2025 |
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Anticipated to arrive by 2028, the PCI-SIG's PCIe 8.0 spec will likely double bandwidth to 256 GT/s to drive next-gen future applications.
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| ST to invest $60m in PLP line at Tours |
9/19/2025 |
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ST announced it will install a Panel-Level-Packaging (PLP) production line at its site in Tours, France. The line is expected to be operational in Q3 2026.The $60m investment adds a second PLP line to its existing line in Muar, Malaysia.
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| SMIC tests domestic DUV tool, eyes EUV development |
9/19/2025 |
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Semiconductor Manufacturing International Corp. is testing an immersion deep-ultraviolet lithography machine from government-backed Yuliangsheng, which is expected to take at least two years to be ready for chip production. Yuliangsheng's parent company, Si Carrier, is developing an extreme-ultraviolet tool, while Shanghai Micro Electronics Equipment, China's other DUV developer, has created a 193-nanometer argon fluoride system capable of 28-nanometer production.
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| DRAM Revenue Jumps 17% in 2Q 2025 |
9/18/2025 |
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Rising contract prices, robust shipments growth, and expanding HBM volumes, have fueled the 17.1% global DRAM revenue growth in 2Q.
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| US, UK plan $42B Tech Prosperity Deal for AI, quantum |
9/18/2025 |
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The US and UK are expected to announce a $42 billion Tech Prosperity Deal aimed at advancing AI and quantum computing. Nvidia will deploy 120,000 graphics processing units in the UK as part of the Stargate project with OpenAI, while Microsoft is investing in the expansion of cloud and AI infrastructure and Google is investing in the construction of a data center.
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| Deca, Microchip's SST partner on NVM chiplet package |
9/15/2025 |
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Deca Technologies and Silicon Storage Technology, a Microchip subsidiary, have partnered to develop a nonvolatile memory chiplet package for modular, multi-die systems. The collaboration combines Deca's M-Series fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology.
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| SK Hynix ready to mass produce HBM4 |
9/15/2025 |
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SK Hynix is set to start mass production of HBM4, a memory product for ultra-high-performance AI applications. HBM4 features 2,048 I/O terminals, doubling the bandwidth of the previous generation and improving power efficiency by more than 40%. The company has exceeded the JEDEC standard for operating speed of 8 gigabits per second, achieving 10 Gbps operating speed.
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