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SpaceX Eyes 15,000 More Satellites for Cellular Starlink, Hints at Carrier Plans 9/22/2025
After the $17 billion EchoStar deal, SpaceX requests to build a constellation of 'up to 15,000' satellites to bolster its cellular Starlink system.
PCIe 8.0 Expected to Deliver 256 GT/s 9/22/2025
Anticipated to arrive by 2028, the PCI-SIG's PCIe 8.0 spec will likely double bandwidth to 256 GT/s to drive next-gen future applications.
Grinn seals strategic partnership with MediaTek 9/22/2025
Grinn, a specialist in the design and development of advanced IoT and embedded solutions, has announced a strategic partnership with MediaTek.
Nvidia to buy $5B stake in Intel, develop custom chips 9/22/2025
The partnership and investment came after the U.S. government and Softbank recently purchased billions of dollars in Intel stock to support domestic semiconductor manufacturing.
Advanced Process, Packaging Drive 19% YoY Growth in Global Chip Foundry 2.0 Market 9/19/2025
Global semiconductor "foundry 2.0" market's revenue surged by 19% YoY in the 2Q 2025, largely driven by robust and sustained AI demand on both advanced process and advanced packaging.
China targets brain computer interface race with new standard 9/19/2025
Groundwork could lead to breakthroughs as soon as 2027.
ST to invest $60m in PLP line at Tours 9/19/2025
ST announced it will install a Panel-Level-Packaging (PLP) production line at its site in Tours, France. The line is expected to be operational in Q3 2026.The $60m investment adds a second PLP line to its existing line in Muar, Malaysia.
SMIC tests domestic DUV tool, eyes EUV development 9/19/2025
Semiconductor Manufacturing International Corp. is testing an immersion deep-ultraviolet lithography machine from government-backed Yuliangsheng, which is expected to take at least two years to be ready for chip production. Yuliangsheng's parent company, Si Carrier, is developing an extreme-ultraviolet tool, while Shanghai Micro Electronics Equipment, China's other DUV developer, has created a 193-nanometer argon fluoride system capable of 28-nanometer production.
DRAM Revenue Jumps 17% in 2Q 2025 9/18/2025
Rising contract prices, robust shipments growth, and expanding HBM volumes, have fueled the 17.1% global DRAM revenue growth in 2Q.
US faces shortfall of 5.3M college-educated workers by 2032 9/18/2025
Nursing, teaching and engineering would experience the largest gaps, per a study from Georgetown University’s Center on Education and the Workforce.
Infineon expands XENSIV MEMS microphone lineup 9/18/2025
Infineon Technologies has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F.
US, UK plan $42B Tech Prosperity Deal for AI, quantum 9/18/2025
The US and UK are expected to announce a $42 billion Tech Prosperity Deal aimed at advancing AI and quantum computing. Nvidia will deploy 120,000 graphics processing units in the UK as part of the Stargate project with OpenAI, while Microsoft is investing in the expansion of cloud and AI infrastructure and Google is investing in the construction of a data center.
MediaTek develops first chipset using TSMC’s 2nm technology, expected in late 2026 9/17/2025
MediaTek has become among the first companies to partner with TSMC to successfully develop a chip featuring the enhanced N2P process.
Spotify Finally Lets Free Users Search for and Listen to Specific Songs 9/17/2025
You can only listen to one song at a time before Spotify begins shuffling, but it's a big upgrade if you know exactly what you want to hear.
SpaceX's Starlink Can Deliver 10Gbps on This Cruise Ship 9/17/2025
The Star of the Seas is the first confirmed cruise ship outfitted with a Starlink Community Gateway, which costs $1.25 million to install.
Preorder Demand for iPhone 17 Much Higher Than iPhone 16 9/17/2025
The Pro Models and the base variant have performed well, but the iPhone Air is lagging behind, says analyst Ming-Chi Kuo.
Lam Research Deposition Tool Tackles Critical Advanced Packaging Challenges in IC Manufacturing 9/16/2025
Lam Research's TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration.
SEMICON Taiwan 2025 Marks 30 Years of Innovation 9/16/2025
SEMICON Taiwan is celebrating its 30th anniversary with its largest-ever scale this year, under the theme "Leading with Collaboration. Innovating with the World."
TSMC gets into the honey business after working with local beekeepers to establish hives around its fabs 9/16/2025
TSMC branded honey is available in several flavors, depending on the flora around a particular fab.
Scientists develop 'full-spectrum' 6G chip that could transfer data at 100 gigabits per second 9/16/2025
Researchers have developed a 6G chip that uses a dual electro-photonic approach to send signals across nine radio-frequency bands — 10,000 times faster than 5G
US Electric Car Sales Hit Record High in August, But It Might Not Last 9/15/2025
Tesla's market share plummets to an eight-year low as shoppers opt for other brands ahead of the federal tax credit expiring on Sept. 30.
Nvidia and Kioxia target 100 million IOPS SSD in 2027 9/15/2025
AI server drives aim to deliver 33 times more performance
Deca, Microchip's SST partner on NVM chiplet package 9/15/2025
Deca Technologies and Silicon Storage Technology, a Microchip subsidiary, have partnered to develop a nonvolatile memory chiplet package for modular, multi-die systems. The collaboration combines Deca's M-Series fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology.
SK Hynix ready to mass produce HBM4 9/15/2025
SK Hynix is set to start mass production of HBM4, a memory product for ultra-high-performance AI applications. HBM4 features 2,048 I/O terminals, doubling the bandwidth of the previous generation and improving power efficiency by more than 40%. The company has exceeded the JEDEC standard for operating speed of 8 gigabits per second, achieving 10 Gbps operating speed.
Lam Research Deposition Tool Tackles Critical Advanced Packaging Challenges in IC Manufacturing 9/12/2025
Lam Research's TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration.
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