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| Foldable Phones Needs to Change |
12/30/2024 |
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Cool doesn’t cut it anymore. Foldable phones must tackle their flaws to revolutionize mobile tech further. Whether the breakthrough comes from Apple, Samsung, or Google is anyone's guess.
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| Chasing chip talent to keep the semiconductor boom alive |
12/23/2024 |
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China has built a sizable pool over the past two decades, fuelled by government policies that have driven rapid growth in the sector, but there is still a shortage of skilled employees in high-level strategic roles
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| Japan’s Kioxia Valued at $5.8 Billion After IPO Surge |
12/23/2024 |
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Kioxia's shares rose 14% on their first day of trading after a $5.8 billion initial public offering. The IPO, Japan's third-largest this year, reflects investor interest even though market uncertainties exist globally. Kioxia, formerly Toshiba Memory, has become a major memory chip market company since being acquired by a Bain Capital-led consortium in 2018.
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| SK Hynix secures $458M CHIPs Act grant |
12/23/2024 |
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SK Hynix has secured a $458 million grant from the Department of Commerce to help support the construction of a packaging plant and R&D facility in West Lafayette, Ind. The project is supported by the CHIPS Act and aligns with the goal to enhance semiconductor production in the US.
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| IDC’s Semiconductor Trends For 2025 |
12/20/2024 |
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The semiconductor industry is poised for major growth in 2025, with memory expected to grow by more than 24% and nonmemory by 13%, driven by high-bandwidth memory and advanced node ICs for AI and mobile, according to IDC.
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| SK Hynix intros 61TB SSD designed for AI data centers |
12/19/2024 |
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SK Hynix has developed the PS1012 U.2 solid-state drive, a 61TB drive for AI data centers, using quad-level cell technology to meet the increasing demand for high-performance enterprise SSDs. The SSD features 5th generation PCIe, doubling bandwidth and achieving a data transfer speed of 32GT/s.
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| German government approves TSMC's Dresden fab financing plan |
12/19/2024 |
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The German government has signed an agreement with the four companies co-investing in European Semiconductor Manufacturing Company (ESMC) - TSMC, Bosch, Infineon, and NXP. On December 13, Germany's Federal Minister for Economic Affairs Robert Habeck formally announced the launch of this joint investment project.
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| Marvell debuts custom HBM architecture for AI data centers |
12/19/2024 |
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Marvell Technology has introduced a custom high-bandwidth memory architecture in partnership with SK Hynix, Micron Technology and Samsung Electronics to enhance AI data center performance. The architecture aims to address bottlenecks in AI applications by optimizing performance, power and cost, and Marvell Chief Operations Officer Chris Koopmans says the company has seen growth in data center revenue, driven by the demand for custom silicon.
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