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Monday, April 22, 2019

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SK Hynix reports 10% up on annual sales 1/29/2019
The South Korean semiconductor manufacturer reported sales of ?9.94tn ($8.9bn), up 10 per cent year-on-year but down 13 per cent on the prior quarter in what has historically been its busiest three months of the year. Similarly, net profit was up 6 per cent on a year ago to ?3.4tn ($3.04bn), but down 28 per cent sequentially.
Transition from DDR4 to DDR5 won/t be easy 1/29/2019
Those are the data and clock rate, VDD (or operating voltage), power architecture, channel architecture, burst length, and improvements for higher-capacity DRAM support. These new changes present special design considerations.
New Bluetooth and WiFi standard to improve location service within centimeter 1/29/2019
Smartphone giants Apple and Samsung have been active in the .4z meetings also attended by Huawei, leading some to suggest that the capability could be integrated in handsets within two years.
Mercury Systems to offer space qualified SSD 1/28/2019
Designed to operate reliably in high radiation environments, this is the first commercial SSD leveraging VITA 78 SpaceVPX standards to reduce cost and mitigate programme risk. In addition to commercial satellite applications, this device is also intended for high-altitude aircraft, airborne weapons and mission-critical ground computing systems.
Western Digital announced cost cuting 1/28/2019
Western Digital is targeting $800 million in annualized reductions in non-GAAP cost and expenses, Milligan said on the post-earnings call, adding that the company is accelerating the closure of a plant.
Intel reports China chip demand slowing 1/28/2019
Growth in data center sales came in far below what the company forecast as demand from Chinese customers weakened.
Semiconductor outlook unclear with many variables 1/28/2019
Big uncertainties over China and European trade and the bottom of the memory cycle predicts that the semiconductor industry will slow down over the next two years before picking up steam again. But in long term, don’t worry about China,
German government to spend $568 million research into next generation EV batteries 1/25/2019
The new facility aims to transfer known-how from Germany’s Fraunhofer science institute to private firms, helping reduce the risk for companies ready to start EV battery production.
Qualcomm, Intel and MediaTek are in the race for 5G modems 1/25/2019
Judging from actual field tests by related parties on 5G mobile communications technologies, the sources commented, Qualcomm, Intel and MediaTek will remain the only three players in the segment of 5G modem chips in the initial stage of the 5G era.
Semiconductor M & A down 75% from 2015 peak 1/25/2019
Total chip industry deals reached in 2018 — including semiconductor companies, business units, product lines, and related assets — were worth roughly $23.2 billion last year, down from $28.1 billion in 2017, according to estimates.
3D machine vision advancing 1/25/2019
Machine vision for guiding robotic movement has been implemented in factory applications for many years now and is in many ways a mature technology. Smart camera systems with built-in processing and calibration capabilities, robust recognition and measurement algorithms, and proven libraries that simplify application development are widely available and continually improving.
Business worries about global uncertainty 1/24/2019
Business executives had grown more worried about "increased financial market volatility, rising short-term interest rates, falling energy prices and elevated trade and political uncertainty.
Toshiba Electronics offers Ethernet bridge IC for automotive networks 1/24/2019
The TC9562 series has been designed to provide both reliability and performance, delivering Ethernet bridging capability up to 1Gbps transfer rate. The bridge IC also supports Time Sensitive Networking (TSN) protocol for various industrial and commercial applications.
Server demand predicted to be stable 1/24/2019
The major variable is the uncertainties arising from the US-China trade war, which may force cloud service providers to adjust downward their capital expenses on the establishment of datacenters, reducing demand for servers.
TSMC to tape out 5nm first half of this year 1/24/2019
The foundry is scheduled to start taping out 5nm chip designs later in the first half of 2019. TSMC is on track to move its 5nm process incorporating EUV lithography technology to volume production in the first half of 2020, according to Wei.
EU to fund compound semiconductor development 1/23/2019
The plan unlocks €1.75bn of funding for research activities and will bring in up to €6bn in private investment and will ultimately help bring new technology innovations to market.
DRAMeXchange predicts 50% price drop for Server DRAM 1/23/2019
DRAMeXchange said the expected price drop may flirt with a 50 percent drop for the whole of 2019, though price falls are expected to ease during the third and fourth quarters should inventory problems be solved properly.
China demanded U.S. to drop charges on Huawei VP 1/23/2019
China demands that the U.S. withdraw the arrest warrant against Meng and "not make a formal extradition request to the Canadian side.
Layoffs at SpaceX 1/23/2019
Last week, SpaceX announced that it will lay off 10% of its nearly 6,000 workers in an effort to become leaner. “This action is taken only due to the extraordinarily difficult challenges ahead and would not otherwise be necessary,” the company said.
TomTom sells telematics unit to concentrade on Mapping 1/22/2019
TomTom has announced that it’s selling its telematics division to automotive giant Bridgestone Europe for €910 million ($1,033 billion).
PTI experienc boosted memory packaging business 1/22/2019
Prices for NAND flash chips had plunged by some 60% in 2018 and may fall further in 2019, but production capacities are still being expanded, with bit shipments to see an annual increase 39% in the year.
Toshiba Memory to go public sooner than later 1/22/2019
Toshiba Memory Corp advancing its IPO listing to the second half of 2019 from 2021 and enhancing cooperation with No. 3 player Western Digital (WD) to enforce capacity expansions.
U.S. manufacturer cut jobs as trade war goes on 1/22/2019
For many businesses, the tariffs are escalating costs, creating hardships and magnifying uncertainty. The Institute for Supply Management's manufacturing index plunged last month to its lowest point in more than two years partly because of the tariffs. And the Federal Reserve appears increasingly worried that damage from the trade war will undercut the economy.
JEDEC has new updated HBM Specifications 1/21/2019
Jedec Solid State Technology Association’s most recent update to the JESD235 HBM DRAM standard focuses on meeting the needs of applications in which peak bandwidth, bandwidth per watt, and capacity per area are critical metrics. Such applications include high-performance graphics, network and client applications, and high-performance computing.
7nm order increased for 5G SoC 1/21/2019
Demand for 7nm fabrication processes is being driven by flagship devices rolled out by smartphone vendors, said Digitimes Research.
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