Wednesday, October 5, 2022

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Industry News
Foxconn may be fined for investment into Tsinghua UniGroup 7/19/2022
Foxconn did not seek prior approval from the Taiwan government before the investment was made and authorities believe it has violated a law governing the island's relations with China,.
Worldwide shipments of traditional PCs declined by 15.3% year over year 7/19/2022
This was the second consecutive quarter of lower shipments following two years of growth. The decline was worse than expected as supply and logistics further deteriorated due to the lockdowns in China and persistent macroeconomic headwinds.
ARTERY Tech offers two new MCU series 7/19/2022
the AT32F435 and the AT32F437—featuring high performance and up to 288MHz operating frequency. The introduction of both new products will further add to the diversity of AT32 MCU Family on the top of the existing mainstream and ultra-value product lines.
TSMC trims expansion as industry is going into "not so good time" 7/19/2022
TSMC has pared back its plan to spend more than $40 billion this year for capacity expansion. The outlook for demand has worsened on expectations of an inventory reduction in the PC and consumer electronics segments.
Extreme heat affects Toyota production at San Antonio, Texas 7/18/2022
Toyota may stop production on most days before 2 p.m. and shorten night shifts, effective immediately through mid-August
Senate to vote on "Chip Bill" next week 7/18/2022
Voting in the Senate on a bill to boost the U.S. semiconductor industry and improve competitiveness with China could begin as early as Tuesday, Senate Majority Leader Chuck Schumer has been telling lawmakers, a source familiar with the issue said on Thursday.
EVG has breakthrough in die-to-wafer (D2W) fusion and hybrid bondin 7/18/2022
EV Group (EVG) has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using its GEMINI FB automated hybrid bonding system.
Removable memory devices still the favorite 7/18/2022
The ability to swap out a memory device easily is certainly a time and cost saver for automotive applications when it fails, especially when the memory is causing an otherwise functional system to fail.
Global IC equipment sales to reach a record $117.5 billion in 2022 7/15/2022
Rising by 14.7% from the previous industry high of $102.5 billion in 2021, and increase to $120.8 billion in 2023, according to SEMI’s Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective, which was released at SEMICON West 2022 Hybrid.
Intel claims victory in achieving "net positive water" at manufacturing facilities 7/15/2022
Net positive water, as Intel defines it, means the company is returning more freshwater to local communities than it takes in.
EV Group achieved breakthrough in die-to-wafer (D2W) fusion and hybrid bonding 7/15/2022
EV Group (EVG) has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using its GEMINI FB automated hybrid bonding system.
Lam Research Collaborate with Gelest to Advance EUV Dry Resist Technology Ecosystem 7/15/2022
Lam Research Corp., Entegris Inc., and Gelest Inc, a Mitsubishi Chemical Group company, are teaming up to provide semiconductor manufacturers worldwide with reliable access to precursor chemicals for Lam’s breakthrough dry photoresist technology for extreme ultraviolet (EUV) lithography.
Semiconductor manufacturing equipment are forecast to reach a record US$117.5 billion in 2022 7/14/2022
Both the front-end and back-end semiconductor equipment segments are contributing to the market expansion. The wafer fab equipment segment, which includes wafer processing, fab facilities and mask/reticle equipment, is projected to expand 15.4% to a new industry record of US$101 billion in 2022, followed by a 3.2% increase to US$104.3 billion in 2023.
Power outage at Micron’s Japanese plant has limited effect on production 7/14/2022
Although machinery initiated the uninterruptible power supply system when the outage occurred, due to the voltage drop, plant machinery required initialization and inspection. The power outage persisted for approximately 5~10 minutes and the effect on production capacity was limited.
Siemens Digital offers Mixed Signal IC Verification Capabilities with Symphony Pro Platform 7/14/2022
This next generation solution extends the robust mixed-signal verification capabilities of Siemens’ proven Symphony platform to support new and advanced Accellera standardized verification methodologies with a powerful, comprehensive and intuitive visual debug cockpit, resulting in productivity improvements of up to 10X compared to legacy solutions.
STMicroelectronics and GlobalFoundries to build 300mm fab in in Crolles, France, 7/14/2022
The jointly operated fab will support GlobalFoundries’ 22FDX FD-SOI process technology and STMicroelectronics’ technology roadmap down to 18 nm for automotive, industrial, IoT, and communications infrastructure applications, companies said.
Samsung Electronics earned $10.3 billion from DRAM sale in the first quarter regardless 7/13/2022
The market size of the global DRAM market also declined for two consecutive quarters after hitting a record high of $26.2 billion during the third quarter last year, shrinking to $24.25 billion during the first quarter this year.
Cadence Design Systems acquires Future Facilities 7/13/2022
Cadence Design Systems has entered into an agreement to acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimisation solutions for data centre design and operations using physics-based 3D digital twins.
Intel hires away executives and senior employees from competing chipmaker like TSMC 7/13/2022
The latest additions to Intel's revitalized foundry business, Intel Foundry Services, are Suk Lee and Michael Chang, two TSMC veterans who have a combined experience of 44 years working for the Taiwanese company.
Infineon lays foundation for modular wafer fab in Malaysia 7/13/2022
With more than RM8 billion worth of investment, the third module will add significant manufacturing capacity in power semiconductors, particularly wide bandgap technology based on silicon carbide (SiC) and gallium nitride (GaN). Construction is expected to be completed by third quarter of 2024.
Nordic Semiconductor acquire US embedded memory IP supplier Mobile Semiconductor. 7/12/2022
Mobile specialises in compilers for low-power static ram, rom and register file memory, and its sram is already used in Nordic’s nRF52 and nRF53 Series SoCs, and its nRF91 system-in-package devices.
Researchers have built design framework for analog computing chipsets 7/12/2022
Institute of Science (IISc) have developed a design framework to build next-generation analog computing chipsets that promise to be faster and require less power than the digital chips found in most electronic devices.
Automotive LED market expected to grow 4% 7/12/2022
Gains made in the penetration rate of LED headlights coupled with the development of advanced technologies such as intelligent headlights, logo lamps, and intelligent ambient lights will sustain a backstop for market demand in automotive lighting in 2022.
Startup QuiX Quantum raised capital to toward the photonic quantum computer 7/12/2022
In March 2022, QuiX announced the commercial launch of a photonic quantum processor that the company says is capable of 20 qumodes and “outperforms the current generation of processors by almost a factor of 2.”
Fabless suppliers have taken a record 34.8% share of global IC sales 7/11/2022
In fact, the first time on record that IDM IC sales growth outpaced fabless IC company sales growth was in 2010 when IDM IC sales grew 35% and fabless IC company sales grew 29%.
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