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| Intel leads as first adopter of ASML's high-NA EUV tech |
2/27/2025 |
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Intel is using a pair of ASML High-NA Twinscan EXE:5000 extreme ultraviolet lithography tools at its D1 development fab in Oregon, processing 30,000 wafers for research and development. Intel plans to use the tools to produce 1.4-nanometer chips, with its sights on setting industry standards and gaining an edge.
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| Chip design software maker Cadence revenue skyrockets with AI demand |
2/24/2025 |
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The San Jose, California-based company generated Q4 2024 revenue of $1.36 billion, up 27% over the previous year, as progress in artificial intelligence fuels growth and demand for innovative semiconductor products and services. Net income increased 5% to $340.2 million over the same period.
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| Elon Musk Reveals Grok 3 AI Chatbot |
2/19/2025 |
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The model was trained on 200,000 GPUs and beats its rivals in math, science, and coding benchmarks, Musk says. It appears to coincide with a price hike on X Premium+ accounts.
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| Micron plans 12-layer HBM3E production for Nvidia |
2/19/2025 |
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According to reports from Seoul Economic Daily and Business Korea, Micron is making significant progress with its 12-layer HBM3E technology. Following sample distribution to customers in 2024, Micron's CFO Mark Murphy highlighted at a Wolfe Research event that their 12-layer HBM3E products achieve 20% less power consumption while delivering 50% more capacity compared to competitors' 8-layer versions.
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| Nvidia in talks to commercialize memory standard |
2/19/2025 |
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Nvidia is said to be in confidential discussions with Samsung Electronics and SK Hynix to commercialize SOCAMM, a new memory standard being called the "second high-bandwidth memory." SOCAMM, a DRAM module, enhances performance for personal AI supercomputers with superior cost performance and a compact design.
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