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| Malaysia seeks over $107B in chip investment |
5/29/2024 |
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Malaysia is aiming to increase its role in the global semiconductor supply chain and is targeting more than $107 billion in investments in advanced packaging, manufacturing equipment and integrated circuit design, according to Prime Minister Anwar Ibrahim. Malaysia expects to contribute $5.3 billion to meet the targets.
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| HBM Prices to Jump 5–10% in 2025 |
5/28/2024 |
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HBM’s share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025.
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| Toshiba Completes 300mm Wafer Fab Facility for Power Chips |
5/28/2024 |
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The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024.
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| TSMC Launches Program to Enhance Green Conservation |
5/28/2024 |
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Moving forward on its commitment to protecting biodiversity, Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has launched the “Eco Plus! – Ecological Harmony Program”, which integrates internal and external resources to connect fragmented biological habitats, enhance species survival, and establish a reward system to support potential talents and important ecological research on biodiversity.
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| AMD aims to achieve 100x power efficiency boost by 2027 |
5/27/2024 |
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Generative AI is driving the need for more performance using less energy, and AMD's strategy includes AI-specific architectures, tuning at the data center level and co-design efforts for hardware and software.
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| Samsung refutes report of failing Nvidia's AI memory chip test |
5/27/2024 |
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Samsung is currently testing its HBM chips with U.S. graphic chip giant Nvidia to supply the memory chips for Nvidia's AI processors, but Reuters reported that Samsung did not pass the test due to issues with heat and power consumption. Samsung Electronics refuted a Friday news report that it failed to pass a test of Nvidia's high-bandwidth memory (HBM) chips.
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| IGZO DRAM memory tech is coming from Imec for AI |
5/24/2024 |
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Imec is experimenting with indium-gallium-zinc-oxide technology for use in AI memory using an analog in-memory computing approach. The IGZO DRAM technology offers speed and energy efficiency.
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| AI helps buoy semiconductor growth this year and into next |
5/24/2024 |
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Major semiconductor companies had mixed results for 1Q 2024, report’s Semiconductor Intelligence.The revenue cha nge from 4Q 2023 to 1Q 2024 ranged from a 23% increase reported by Micron Technology to a 19% decline from STMicroelectronics.
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| Bill to control AI model exports advances in House |
5/24/2024 |
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Lawmakers in the House Foreign Affairs Committee advanced the Enhancing National Frameworks for Overseas Restriction of Critical Exports Act, which aims to expand authority to block the export of AI models to China.
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| LPDDR competition heats up for energy efficiency |
5/23/2024 |
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Samsung Electronics, SK Hynix and Micron Technology are working to develop low power double data rate memory DRAM technology to boost energy efficiency for AI applications. Micron's Crucial LPCAM2 builds on Samsung's low power compression attached memory module released last year.
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| Subaru teams up with Toyota to mitigate EV ‘risks’ |
5/23/2024 |
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Subaru CEO and President Atsushi Osaki said after exploring various options for BEV development, the company has opted to partner with its friendly rival Toyota Motor Corp. The two automakers will jointly develop four battery electric SUVs,
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| TSMC's Lithography Machines Have a Remote Kill Switch in Case China Invades |
5/23/2024 |
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TSMC makes the world's most advanced chips at its Taiwan facilities, so the prospect of those fabs being taken over or controlled by a hostile force is not a pleasant scenario to consider. However, now it's been revealed for the first time that the machines have remote kill switches, which would render them idle in the case of Chinese aggression.
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| Samsung, SK Hynix cautious about ramping up production |
5/22/2024 |
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Samsung and SK Hynix are taking a cautious approach to ramping up production of standard DRAM and NAND chips, the companies communicated during their first-quarter earnings call that "there will be constraints in DRAM production bit growth this year." High inventory levels for PCs and NAND price stability is causing market uncertainty.
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