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| GlobalFoundries to spend $16B on chip production in US |
6/6/2025 |
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GlobalFoundries plans to invest $16 billion to expand its US chip manufacturing -- $13 billion for factory expansions in Vermont and New York and $3 billion for advanced packaging and new technologies such as silicon photonics and gallium nitride. The company is working with Apple, AMD, Qualcomm, NXP Semiconductors and others to support its production of US-made chips.
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| T-Mobile Officially Launches Its Fiber Service: |
6/5/2025 |
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With its acquisition of Lumos complete, T-Mobile aims to deploy high-speed internet fiber to 12 million to 15 million homes in the US by 2030. And it's promising a five-year price lock.
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| Anglia joins Alliance Memory to support legacy products |
6/4/2025 |
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Anglia Components has signed on with Alliance Memory to supply legacy and new memory products, such as DRAM, SRAM and flash memory. Alliance's products are pin-for-pin replacements for those from companies including Cypress, Infineon, Micron, Nanya and Samsung.
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| Reconfiguring the Future of Computing |
6/3/2025 |
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Once viewed as niche solutions for prototyping and specialized workloads, FPGAs are increasingly being embraced as critical enablers of performance, flexibility, and power efficiency across a broad spectrum of applications—from accelerating artificial intelligence (AI) systems and 5G to automotive and the industrial sector.
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| Intel, SoftBank eyeing a DRAM alternative to HBM |
6/3/2025 |
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Intel and SoftBank have reportedly formed Saimemory to develop a stacked dynamic random-access memory alternative to high-bandwidth memory, targeting commercialization by 2029, according to a Nikkei report. The initiative, which is expected to cost up to $70 million, will be tasked to halve power consumption compared with HBM
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| Apple to Shake Up Its OS Names |
5/30/2025 |
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Apple wants to bring some consistency to the naming of its software. The upcoming versions will be labeled based on the year, rather than the version number, Bloomberg reports.
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| TSMC to Open EU Design Center in Munich in Q3 |
5/29/2025 |
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TSMC is set to establish its first European Design Centre in Munich, Germany, to support European clients and focus on high-performance and energy-efficient chips for automotive and industrial applications, AI, telecommunications and the internet of things. The facility will become the company's 10th and will also work on advancing RRAM and MRAM.
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