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| Honda earmarks $65B to accelerate EV development |
5/21/2024 |
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Despite slower EV sales in the Western Hemisphere, Honda is preparing a $65 billion infusion into development and bring out seven new models under its flagship brands by the end of the decade. Company President Toshihiro Mibe unveiled the plan, which calls for Honda to produce 2 million EVs annually and reduce battery costs in North America.
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| Apple exec's appearance in Taiwan fires up 2nm talk |
5/21/2024 |
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Jeff Williams, operating chief at Apple, has been spotted in Taiwan, presumably to sew up a deal to procure TSMC's first batch of 2-nanometer wafers. It has been reported that Apple will use the 2nm technology next year in its iPhone 17 lineup, although other reports cite a 2026 date and different details; whenever the deal starts, it will add billions to TSMC's coffers.
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| Amazon participated in the private placement for SIP Core provider Alchip |
5/20/2024 |
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Amazon's minor investment in Alchip, which has the likes of TSMC and SoftBank as early investors, has a significant meaning for Amazon regarding self-developed AI chips. It signifies support for Alchip and implies that the two companies may maintain a customer relationship for a while.
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| IBM working with Honda on automotive chips, software |
5/17/2024 |
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IBM and Honda have signed an agreement to collaborate on automotive chips and software. The companies expect software-defined vehicles to increase semiconductor design complexity as well as power consumption.
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| Japan eyes electric grid amid chip, data center investments |
5/17/2024 |
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Japan will need to generate 50% more electricity by 2050 to meet the demands of chipmaking facilities and AI data centers as it invests heavily to revitalize its chipmaking industries. Data center operator DigitalBridge has warned that it could run out of power within two years and is considering relocating to locations with renewable energy.
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| AI Servers Transitioning Towards Liquid Cooling |
5/17/2024 |
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Despite the maturity of air-cooling technology, its heat dissipation ceiling stands at approximately 10~15kW. This limitation has prompted a shift towards hybrid solutions such as “water-cooled + air-cooled” and liquid-cooled dissipation systems.
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| Google touts Trillium chip for its AI performance |
5/16/2024 |
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Google has announced its Trillium AI chip and says it improves data center performance fivefold. Engineers increased overall bandwidth and high-bandwidth memory capacity to achieve the gains, and the chip is expected to hit the market later this year.
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| Samsung delivers HBM tech to SiPearl |
5/16/2024 |
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Samsung is working with SiPearl to offer high-bandwidth memory technology in its Rhea family. SiPearl CEO Philippe Notton says the built-in HBM with SiPearl's low-power, high-performance microprocessors will enable AI and supercomputer workloads.
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| NXP CTO Lars Reger to Deliver Keynote at COMPUTEX 2024 |
5/15/2024 |
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Reger will take a novel approach to COMPUTEX’s theme of artificial intelligence (AI), showing how it can supercharge a future full of vibrant possibilities when it is combined with a solid technology framework.
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| US chip industry facing a labor shortage, report says |
5/14/2024 |
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A McKinsey report found that the growing push for domestic semiconductor capacity in the US is driving a labor shortage. The report recommends certification programs and partnerships with middle and high schools to help fill the gaps.
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