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| AMD achieves first TSMC N2 product silicon milestone |
4/16/2025 |
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AMD has announced that its next-generation AMD EPYC processor, codenamed ‘Venice,’ is the first HPC product in the industry to be taped out and brought up on the TSMC advanced 2nm (N2) process technology.
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| Boeing sees delivery uptick in Q1 |
4/15/2025 |
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However, the Trump administration’s 25% steel and aluminum tariffs and China’s export controls of critical minerals could affect the aircraft manufacturing titan’s progress.
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| Nvidia to Build Supercomputer Factories in Texas |
4/15/2025 |
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Nvidia teams up with Foxconn and Taiwan-based Wistron for factories in Houston and Dallas, respectively. The news comes as Trump has said repeatedly he plans to tariff foreign-made chips.
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| HBM in the Spotlight Again |
4/11/2025 |
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HBM technology continues its relentless march in 2025 with the imminent arrival of more advanced HBM4 memory devices.
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| Global Chip Sales Up 17% in February |
4/10/2025 |
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Global semiconductor sales reached $54.9 billion in February 2025, up by 17.1% year-on-year but down by almost 3% from the previous month.
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| FMC, Neumonda introduce DRAM+ technology |
4/9/2025 |
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Ferroelectric Memory Co. has partnered with Neumonda to produce DRAM+, a nonvolatile memory using ferroelectric hafnium oxide, in Germany. The technology combines DRAM performance with solid-state drive-like data retention, targeting applications in AI, automotive and industrial sectors. Neumonda will support with advanced testing systems, aiming to revive semiconductor capabilities in Europe.
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| YMTC patents highlight advances in 3D NAND technology |
4/8/2025 |
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Yangtze Memory Technologies has published almost 20 patents for processes to enhance computing efficiency and optimize chip stacking, showcasing its technological prowess in 3D NAND. The patents include innovations in stacking structures, electromagnetic interference shielding and data refreshing methods
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