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| Bain Is Said to Plan $500 Million IPO for Chipmaker Kioxia |
8/26/2024 |
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Bain Capital is preparing for an initial public offering of Kioxia Holdings on the Tokyo exchange that could raise $500 million. The Japanese chipmaker's IPO, expected to start in the coming weeks, may value the company at more than $10.3 billion, reports speculate.
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| China has imported a record $26B in chipmaking equipment so far this year |
8/23/2024 |
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Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week. That surpassed the previous high mark in 2021 and comes as American, Japanese and Dutch officials work on increasing restrictions on Chinese companies.
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| Nvidia Eyes Return to Record as AI Spending Bonanza Continues |
8/23/2024 |
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Nvidia and other semiconductor companies are seeing significant growth due to sustained investments in AI infrastructure. Erik Swords of Voya Investment Management says, "We're nowhere near close to finishing the build out of AI infrastructure, and that gives you a very good line of sight in terms of the growth you can expect over the coming years.
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| TSMC JV Breaks Ground on Dresden Fab |
8/22/2024 |
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A joint venture between TSMC, Bosch, Infineon, and NXP—held a groundbreaking ceremony last August 20 to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany.
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| Microchip hit by cyberattack, scales back operations |
8/22/2024 |
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Microchip Technology has reported a cyberattack on its servers that forced it to scale back operations and has affected some of its manufacturing capacity. Microchip, a key supplier of the US defense industry, was recently awarded $162 million to support its fab expansion.
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| Micron, Intel Bring MRDIMM Modules to Market |
8/20/2024 |
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Micron Technology and Intel introduced multiplexed rank dual inline memory modules designed for AI and high-performance computing in data center applications. The MRDIMMs, ranging from 32 GB to 256 GB, offer improvements in memory bandwidth and latency and outperform current TSV RDIMMs.
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