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| Samsung Secures Exclusive HBM4 Supply Deal with OpenAI |
3/23/2026 |
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Samsung Electronics has secured a deal to exclusively supply sixth-generation high-bandwidth memory, known as HBM4, to OpenAI, according to reports. OpenAI intends to integrate the HBM4 into its AI semiconductor Titan, which is expected to be released later this year.
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| Imec installs ASML's litho tool for sub-2nm chip development |
3/23/2026 |
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Imec has installed the ASML EXE:5200 high-numerical-aperture extreme ultraviolet lithography system, offering partners early access to advanced chip-scaling technologies. The tool, integrated with patterning and metrology tools, advances sub-2-nanometer logic and high-density memory, supporting AI and high-performance computing.
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| Kioxia's SSD achieves over 10M IOPS for AI workloads |
3/20/2026 |
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Kioxia has unveiled the E3.S CM9 series, a "super high" input/output operations per second solid-state drive designed to enhance AI workloads on Nvidia graphics processing units. The SSD, which offers 25.6 terabytes of capacity and can achieve more than 10 million IOPS, uses Kioxia's XL-Flash to reduce read latency, part of Nvidia's Storage-Next initiative.
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| AMD's Su to discuss foundry collaboration with Samsung |
3/19/2026 |
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Advanced Micro Devices CEO Lisa Su plans to visit Samsung Electronics' chip production site in Pyeongtaek, South Korea, to explore expanding cooperation beyond memory into foundry manufacturing, according to a source. Samsung has been supplying high-bandwidth memory 3E chips for AMD's AI accelerators since last year.
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