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| U.S. Export Waiver Revocations Put Samsung and SK hynix in Limbo |
9/9/2025 |
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The end of VEU status—materializing in 120 days—means that Intel, Samsung, and SK hynix will have to seek licenses to purchase American chip fabrication gear for their manufacturing facilities in China. It will lead to case-by-case reviews, which could take three to six months to obtain a license.
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| TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs |
9/9/2025 |
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The change comes as U.S. lawmakers advance the Chip EQUIP Act, a proposal that would prohibit companies receiving American subsidies from buying tools from “foreign entities of concern,” including Chinese firms such as AMEC and Mattson Technology.
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| Chinese tech firms continue to eye Nvidia chips |
9/9/2025 |
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Chinese tech companies remain interested in Nvidia's AI chips despite Beijing's discouragement, sources say. The companies are particularly monitoring the H20 model, which Nvidia recently regained permission to offer in China, and a more powerful chip, known as the B30A, which could be twice as expensive.
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| US considers annual export approvals in China |
9/9/2025 |
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The US is considering yearly approvals for the export of chipmaking supplies to SK Hynix and Samsung Electronics factories in China, according to Bloomberg reports. The proposal, presented by the US Commerce Department to South Korean officials, would replace indefinite authorizations previously granted to the companies
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| TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs |
9/4/2025 |
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The change comes as U.S. lawmakers advance the Chip EQUIP Act, a proposal that would prohibit companies receiving American subsidies from buying tools from “foreign entities of concern,” including Chinese firms such as AMEC and Mattson Technology.
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| Toshiba debuts 650V SiC MOSFETs with TOLL packaging |
9/3/2025 |
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Toshiba has introduced three industrial 650V silicon carbide metal-oxide-semiconductor field-effect transistors in TO-leadless packaging, with on-resistance as low as 27 milliohms. The TOLL package, a nine-pin, four-terminal design, reduces switching losses by minimizing parasitic impedance.
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| Qualcomm to add Single Photon Active Sensor tech to Snapdragon |
9/1/2025 |
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Qualcomm plans to integrate VoxelSensors' Single Photon Active Event Sensor technology into the Snapdragon AR2 Gen 1 Platform to enhance 3D sensing for robotics and extended-reality applications. The SPAES sensors can detect single photons and generate high-resolution 3D data at a rate of up to 100 million points per second.
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