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| Rapidus steps up 1nm development as Japan seeks to close gap with TSMC |
4/6/2026 |
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Japan’s Rapidus is accelerating its push into advanced semiconductor manufacturing, with the company aiming to reduce its technology gap with Taiwan Semiconductor Manufacturing Company (TSMC) to roughly six months at the 1nm node, according to comments made by Chief Technology Officer Kazunari Ishimaru.
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| TSMC reportedly eyes major expansion in Arizona |
4/6/2026 |
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TSMC is reportedly considering a significant expansion in Arizona, potentially increasing its capacity to 12 fabrication plants, four advanced packaging facilities and a research-and-development center. This expansion is said to be part of a $500 billion investment agreement between the US and Taiwan.
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| Micron developing stacked GDDR for AI inference, with prototype targeted for 2027 |
4/3/2026 |
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Micron Technology is working on what could be the first stacked graphics dynamic random-access memory for AI inference and high-performance graphics, with a prototype expected in 2027, according to reports. The stacked GDDR could offer a cost-effective alternative to high-bandwidth memory, although it won't match HBM in raw performance.
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| Nvidia invests $2B in Marvell to enhance AI ecosystem |
4/2/2026 |
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Nvidia is investing $2 billion in Marvell Technology to enhance the NVLink Fusion partnership, integrating Marvell into Nvidia's AI factory and AI-RAN ecosystem. Marvell is set to provide custom XPUs and scale-up networking, while Nvidia will supply various components, including Vera CPUs and Spectrum-X switches. The two companies have also agreed to collaborate on silicon photonics and AI-RAN infrastructure for 5G and 6G networks. "The inference inflection has arrived. Token generation demand is surging, and the world is racing to build AI factories," says Jensen Huang, CEO of Nvidia.
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| Samsung to offer 1nm process with fork sheet tech |
3/31/2026 |
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Samsung Electronics is setting out to introduce a 1-nanometer process by 2031, using fork sheet technology to increase transistor density, according to reports. By placing a non-conductive wall between transistors, Samsung aims to increase the number of transistors per chip area.
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| Apple adds new suppliers to boost US component production |
3/30/2026 |
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Apple has expanded its American Manufacturing Program by partnering with Bosch, Cirrus Logic, TDK and Qnity Electronics to produce iPhone components domestically. Apple has earmarked $400 million through 2030 for the new partners. The components will be sent overseas for assembly; iPhones will not be assembled in the US.
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