|
 |
|
| TSMC to Lead Rivals at 2-nm Node, Analysts Say |
1/8/2026 |
|
Taiwan Semiconductor Manufacturing Co. is expected to maintain its lead in advanced semiconductor nodes with the launch of its 2-nanometer process, attracting major customers such as Nvidia, Advanced Micro Devices, Apple and Qualcomm, analysts say. While Samsung Electronics and Intel have faced challenges in advanced-node production,
|
|
|
| SK hynix unveils 16-high 48Gb HBM4 |
1/8/2026 |
|
SK Hynix has debuted a 16-high 48GB high-bandwidth memory at CES, a technical achievement due to the complexity of stacking 16 layers.
|
|
|
| TSMC reportedly set to build 12 Arizona fabs as Japan, Germany expansions stall |
1/8/2026 |
|
TSMC(2330.TW) has confirmed plans to expand its Arizona campus beyond the existing six fabs by adding two new fabs. Advanced packaging capacity will also increase from two fabs to three or four. This means TSMC is set to build up to 12 fabs in Arizona, keeping capital expenditures elevated through 2026-2028.
|
|
|
| The activation of a China EUV prototype marks the end of globalized silicon |
1/5/2026 |
|
A recent Reuters investigation confirms the EUV prototype is now operational in Shenzhen. This development is not just a technical milestone; it is a seismic structural realignment that effectively marks the end of the unified global semiconductor market and inaugurates an era of deep technological division.
|
|
|
| Next UFS Standard to Include Support for AI |
1/5/2026 |
|
The next Universal Flash Storage (UFS) standard has yet to be released, but the standards organization overseeing it has made the uncharacteristic move to disclose its goals for version 5.0, which includes support for AI.
|
|
|
| Space Forge achieves world-first in orbital semiconductor manufacturing |
1/5/2026 |
|
Space Forge has achieved a milestone in orbital semiconductor manufacturing by generating plasma on its ForgeStar-1 satellite, marking the first time a commercial spacecraft has done so. This demonstrates the potential for advanced crystal growth in low-Earth orbit, with microgravity offering advantages for producing cleaner semiconductor crystals.
|
|
|
| TSMC gets annual US export license for Nanjing facility |
1/5/2026 |
|
Taiwan Semiconductor Manufacturing Co. has received an annual license from the US Department of Commerce to import US chip manufacturing gear to its facility in Nanjing, China, ensuring uninterrupted operations and product deliveries.
|
|
|
| TSMC enters volume 2nm production |
12/31/2025 |
|
The company says are the most advanced in the world in terms of energy efficiency and density. TSMC states that the N2 technology offers up to 15% better performance and up to 30% lower power consumption compared to its N3E chips.
|
|
|
| China mandates 50% domestic equipment rule for chipmakers |
12/31/2025 |
|
China is demanding that chipmakers use at least 50% domestically made equipment for new capacity, sources say. The mandate, not publicly documented, is part of Beijing's effort to establish a self-sufficient semiconductor supply chain amid tightened US export rules. This reported move is seen as one of the most significant steps Beijing has taken to decrease its reliance on foreign technology.
|
|
|
| Qualcomm files countersuit against Arm |
12/30/2025 |
|
Qualcomm claims that Arm has been in breach of contract by misrepresenting the relationship between the two companies to Qualcomm’s customers, non-delivery of IP and misrepresenting its intentions as a design firm when it was preparing to sell proprietary ICs.
|
|
|
|
