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Tuesday, March 3, 2026

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SK hynix, Sandisk Collaborating on Global Standardization of Next-Gen Memory HBF 3/3/2026
HBF technology can fill the gap between HBM's high performance and SSD's high capacity.
Arm and Tensor Technologies have partnered to develop the world's first AI-driven personal vehicle 3/3/2026
The Robocar, which is set for a global launch in 2026, will feature 433 Arm-based cores and a comprehensive sensor suite to support Level 4 autonomy.
Micron launches its first major chip assembly plant in India 3/3/2026
Test and assembly site in Gujarat marks India’s first commercial semiconductor production following multibillion-dollar investments in US and Singapore to meet growing demand for storage and memory chips
iPhone 17e Is Here 3/3/2026
.Apple Adds MagSafe, Doubles Storage, Sticks With 1 Camera. iPhone 17e preorders begin on Wednesday, starting at $599 for a 256GB version.
Chipmakers still suffering from rare earth shortages 3/2/2026
US-China trade truce apparently still hasn’t eased pressures despite agreement taking place in October last year
Apple is quietly assembling a US chip supply chain, one layer at a time 3/2/2026
New fabs, wafer plants, and packaging campuses show Apple reshoring high-value silicon work while iPhone assembly stays overseas
Stellantis posts $26B loss amid EV reset 3/2/2026
As the automaker sidelines electric vehicles, it sees North America as a potential growth engine in 2026.
Netflix Drops Bid to Acquire Warner Bros., Paramount Set to Take Over 3/2/2026
WBD's board determined that Paramount's offer was superior and gave Netflix four days to submit a better bid. The streamer declined later that day.
Samsung reportedly exits 2D NAND, converts Hwaseong Line 12 to 1c DRAM end fab 2/27/2026
Samsung would stop operating the 12-inch line as early as March 2026. Hwaseong Line 12 has a monthly capacity of about 80,000 to 100,000 wafers. Customers were informed of the shutdown in 2025, consistent with Samsung's fourth-quarter guidance to phase out legacy planar NAND and shift investment to advanced processes.
Imec shows gas control boosts EUV lithography 2/27/2026
Imec has shown that controlling gas compositions during post-exposure extreme ultraviolet lithography steps can reduce exposure doses and increase wafer throughput. The research shows that increasing oxygen levels during post-exposure bake can improve the dose response of metal-oxide photoresists by 15% to 20%, while reducing costs and increasing efficiency.
As Energy Costs Soar, Trump Pushes AI Giants to 'Produce Their Own Electricity' 2/27/2026
In his State of the Union, Trump said he'd negotiated a 'ratepayer protection pledge.' He didn’t say who signed on, but several companies previously committed to covering their own electric costs.
Nvidia Warns of 'Very Tight' GPU Supplies for at Least Next 2 Quarters 2/27/2026
Nvidia signals it might not see any year-over-year growth in gaming GPU revenue as it prioritizes chips for data centers.
Apple to produce Mac mini computers in US for the first time 2/26/2026
The move would double the iPhone maker’s manufacturing footprint in Houston. The company also plans to expand production of its servers and provide worker training in the city.
AMD and Meta strike $100 billion AI deal that includes 10% stock deal 2/26/2026
New partnership will see AMD provide up to 6 gigawatts of AMD Instinct computing power to power Meta's AI ambitions. The deal includes a colossal performance-based share incentive that could see Meta awarded with up to 160 million AMD shares, roughly 10% of the company's total stock.
Kioxia samples UFS 5.0 NAND for AI smartphones 2/26/2026
Kioxia has begun sampling UFS 5.0 NAND, which JEDEC is standardizing to meet the performance needs of AI-enabled smartphones. UFS 5.0 uses MIPI M-PHY 6.0 and UniPro 3.0, offering speeds up to 46.6 Gbps per lane.
Apple May Launch Touch-Screen MacBook With Dynamic Island Later This Year 2/26/2026
Apple may also tweak macOS to improve touch support, reports Bloomberg's Mark Gurman.
Taiwan’s ITRI Breaks Ground on Advanced Semiconductor R&D Center in Hsinchu 2/25/2026
ITRI's soon-to-rise Advanced Semiconductor R&D Center marks a new step in Taiwan's semiconductor development strategy.
Semidynamics Becomes 3-nm Ready, Moves Europe Toward Hardware Sovereignty 2/25/2026
Semidynamics has expanded into full-stack AI infrastructure and has taped out 3-nanometer designs with Taiwan Semiconductor Manufacturing Co. Using process-agnostic IP cores, Semidynamics is setting out to become a vertically integrated AI hardware supplier.
ASML's 1,000W light source to boost EUV processing 2/25/2026
ASML has unveiled a 1,000-watt light source that is expected to increase the throughput of its high-numerical-aperture extreme ultraviolet machines from 220 wafers per hour to 330 by 2030. The advancement was achieved by doubling the rate at which molten tin drops are exposed to a carbon dioxide laser beam to make plasma that sends out EUV radiation. ASML shipped eight high-NA machines last year and expects to ramp up production to 20 per year by 2027.
AMD, Meta reach $100B deal to boost AI infrastructure 2/25/2026
Advanced Micro Devices and Meta Platforms have signed a multiyear partnership that could be worth over $100 billion, with AMD providing up to 6 gigawatts of computing power for Meta's AI infrastructure. Both companies have emphasized the long-term nature of the deal, planning to rapidly scale Meta's AI capabilities and support the development of cutting-edge AI models.
Apple Will Reportedly Unveil New Products Over 3 Days Next Week 2/24/2026
A report from Bloomberg’s Mark Gurman says Apple may introduce new gadgets on Monday, Tuesday, and Wednesday next week, ahead of in-person experiences for the press.
Applied Materials expects 20% growth in semiconductor business in 2026 2/24/2026
Although Q1 2026 revenue was down 2% year over year, the company credited its “strong results” to AI-computing-driven demand.
Renesas unveils 3nm TCAM technology designed for high density and low power 2/24/2026
Renesas Electronics has announced a new ternary content-addressable memory (TCAM) technology built on a 3nm FinFET process.
Samsung Electronics Reclaims Top Spot in Global DRAM Market 2/24/2026
The company is expected to further solidify its position in the DRAM market with the launch of the world's first mass-produced 6th generation high-bandwidth memory (HBM4).
3 Silicon Valley Engineers Arrested, Allegedly Sent Trade Secrets to Iran 2/23/2026
The US alleges that the trio transferred confidential documents related to processor security, cryptography, and other technologies to a platform outside the US.
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