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| Micron Building New HBM Advanced Packaging Factory in Singapore |
1/24/2025 |
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The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth.
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| TSMC halts production, checks for damage after Taiwan earthquake |
1/23/2025 |
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It was still felt around 40km away in the city of Tainan, and 200km away in the city of Taichung. The Register mentions them as both house TSMC fabrication plants and, according to local media reports, the chipmaker was sufficiently worried about worker safety that staff were told to cease work and leave the building.
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| First AI Chip Startup Goes Public as Blaize Merges With SPAC |
1/23/2025 |
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Blaize, founded in 2011, has faced criticism for low revenue, reporting only $28,000 in hardware sales for the first three quarters of 2024. Blaize has contracts with Mercedes-Benz and Denso, but chip sales from these won't start until at least 2028.
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| Trump unveils $500B AI infrastructure initiative |
1/23/2025 |
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President Donald Trump has announced a $500 billion private-sector investment to build AI infrastructure in the US. The initiative, called Stargate, is a joint venture among OpenAI, Oracle and SoftBank and plans to build 20 data centers and create 100,000 jobs.
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| DuPont revamps spinoff plans |
1/22/2025 |
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The chemical maker plans to split into two publicly traded companies, separating its electronics segment by November.
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| emi Completes Acquisition of Qorvo’s SiC JFET Business |
1/21/2025 |
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onsemi has completed its acquisition of the silicon carbide (SiC) junction field-effect transistor (JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
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