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| The activation of a China EUV prototype marks the end of globalized silicon |
1/5/2026 |
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A recent Reuters investigation confirms the EUV prototype is now operational in Shenzhen. This development is not just a technical milestone; it is a seismic structural realignment that effectively marks the end of the unified global semiconductor market and inaugurates an era of deep technological division.
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| Next UFS Standard to Include Support for AI |
1/5/2026 |
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The next Universal Flash Storage (UFS) standard has yet to be released, but the standards organization overseeing it has made the uncharacteristic move to disclose its goals for version 5.0, which includes support for AI.
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| Space Forge achieves world-first in orbital semiconductor manufacturing |
1/5/2026 |
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Space Forge has achieved a milestone in orbital semiconductor manufacturing by generating plasma on its ForgeStar-1 satellite, marking the first time a commercial spacecraft has done so. This demonstrates the potential for advanced crystal growth in low-Earth orbit, with microgravity offering advantages for producing cleaner semiconductor crystals.
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| TSMC gets annual US export license for Nanjing facility |
1/5/2026 |
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Taiwan Semiconductor Manufacturing Co. has received an annual license from the US Department of Commerce to import US chip manufacturing gear to its facility in Nanjing, China, ensuring uninterrupted operations and product deliveries.
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| TSMC enters volume 2nm production |
12/31/2025 |
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The company says are the most advanced in the world in terms of energy efficiency and density. TSMC states that the N2 technology offers up to 15% better performance and up to 30% lower power consumption compared to its N3E chips.
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| China mandates 50% domestic equipment rule for chipmakers |
12/31/2025 |
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China is demanding that chipmakers use at least 50% domestically made equipment for new capacity, sources say. The mandate, not publicly documented, is part of Beijing's effort to establish a self-sufficient semiconductor supply chain amid tightened US export rules. This reported move is seen as one of the most significant steps Beijing has taken to decrease its reliance on foreign technology.
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| Qualcomm files countersuit against Arm |
12/30/2025 |
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Qualcomm claims that Arm has been in breach of contract by misrepresenting the relationship between the two companies to Qualcomm’s customers, non-delivery of IP and misrepresenting its intentions as a design firm when it was preparing to sell proprietary ICs.
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| Rohm, Tata to assemble, test power ICs in India |
12/24/2025 |
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Rohm and Tata Electronics have partnered for the assembly and testing of power ICs in India, starting with automotive-grade N-channel 100-volt, 300-ampere silicon metal-oxide-semiconductor field-effect transistors in TOLL packaging. Mass production is set for next year, and the companies are considering future co-development of packaging technologies.
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| Samsung to buy ZF's ADAS unit for $1.8B |
12/24/2025 |
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Samsung Electronics has agreed to acquire ZF Friedrichshafen's autonomous driving technology division for $1.8 billion, integrating it with Harman's audio business to create next-generation in-car platforms. The deal provides Samsung with advanced driver assistance system technologies, including vehicle cameras and controllers, marking a diversification beyond memory chips and smartphones.
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| AI boom diverts memory chip supply |
12/23/2025 |
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A severe memory chip shortage driven by AI demand is causing a spike in prices, with some chips increasing by as much as 300%, according to analysts. The shortage is expected to affect the PC and smartphone markets in 2026, with potential price increases of up to 8%. Major memory producers, such as Micron Technology, Samsung Electronics and SK Hynix, are shifting their focus to high-bandwidth memory for data centers, which is exacerbating the shortage for consumer electronics, analysts say.
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