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DRAM Revenue Jumps 17% in 2Q 2025 9/18/2025 Rising contract prices, robust shipments growth, and expanding HBM volumes, have fueled the 17.1% global DRAM revenue growth in 2Q. US faces shortfall of 5.3M college-educated workers by 2032 9/18/2025 Nursing, teaching and engineering would experience the largest gaps, per a study from Georgetown University’s Center on Education and the Workforce. Infineon expands XENSIV MEMS microphone lineup 9/18/2025 Infineon Technologies has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F. US, UK plan $42B Tech Prosperity Deal for AI, quantum 9/18/2025 The US and UK are expected to announce a $42 billion Tech Prosperity Deal aimed at advancing AI and quantum computing. Nvidia will deploy 120,000 graphics processing units in the UK as part of the Stargate project with OpenAI, while Microsoft is investing in the expansion of cloud and AI infrastructure and Google is investing in the construction of a data center. MediaTek develops first chipset using TSMC’s 2nm technology, expected in late 2026 9/17/2025 MediaTek has become among the first companies to partner with TSMC to successfully develop a chip featuring the enhanced N2P process. Spotify Finally Lets Free Users Search for and Listen to Specific Songs 9/17/2025 You can only listen to one song at a time before Spotify begins shuffling, but it's a big upgrade if you know exactly what you want to hear. SpaceX's Starlink Can Deliver 10Gbps on This Cruise Ship 9/17/2025 The Star of the Seas is the first confirmed cruise ship outfitted with a Starlink Community Gateway, which costs $1.25 million to install. Preorder Demand for iPhone 17 Much Higher Than iPhone 16 9/17/2025 The Pro Models and the base variant have performed well, but the iPhone Air is lagging behind, says analyst Ming-Chi Kuo. Lam Research Deposition Tool Tackles Critical Advanced Packaging Challenges in IC Manufacturing 9/16/2025 Lam Research's TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. SEMICON Taiwan 2025 Marks 30 Years of Innovation 9/16/2025 SEMICON Taiwan is celebrating its 30th anniversary with its largest-ever scale this year, under the theme "Leading with Collaboration. Innovating with the World." TSMC gets into the honey business after working with local beekeepers to establish hives around its fabs 9/16/2025 TSMC branded honey is available in several flavors, depending on the flora around a particular fab. Scientists develop 'full-spectrum' 6G chip that could transfer data at 100 gigabits per second 9/16/2025 Researchers have developed a 6G chip that uses a dual electro-photonic approach to send signals across nine radio-frequency bands — 10,000 times faster than 5G US Electric Car Sales Hit Record High in August, But It Might Not Last 9/15/2025 Tesla's market share plummets to an eight-year low as shoppers opt for other brands ahead of the federal tax credit expiring on Sept. 30. Nvidia and Kioxia target 100 million IOPS SSD in 2027 9/15/2025 AI server drives aim to deliver 33 times more performance Deca, Microchip's SST partner on NVM chiplet package 9/15/2025 Deca Technologies and Silicon Storage Technology, a Microchip subsidiary, have partnered to develop a nonvolatile memory chiplet package for modular, multi-die systems. The collaboration combines Deca's M-Series fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology. SK Hynix ready to mass produce HBM4 9/15/2025 SK Hynix is set to start mass production of HBM4, a memory product for ultra-high-performance AI applications. HBM4 features 2,048 I/O terminals, doubling the bandwidth of the previous generation and improving power efficiency by more than 40%. The company has exceeded the JEDEC standard for operating speed of 8 gigabits per second, achieving 10 Gbps operating speed. Lam Research Deposition Tool Tackles Critical Advanced Packaging Challenges in IC Manufacturing 9/12/2025 Lam Research's TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. Mercedes-Benz, LG Energy strike $11B EV battery supply deal 9/12/2025 The two contracts are the largest order to date for the company’s cylindrical 46-series cells, according to news media reports. $1.5trn spend on fab 2024-30, forecasts PwC 9/12/2025 Spending on fab between 2024 and 2030 will be more than $1.5 trillion to supply a market worth over $1 trillion by 2030, says PwC. Synthetic diamond semiconductors could offer EU an edge 9/12/2025 Europe could gain a competitive advantage through synthetic diamond semiconductors, which offer better electrical and thermal performance compared with silicon carbide while reducing environmental impact, writes Gauthier Chicot, CEO and co-founder of Diamfab. Chicot emphasizes the importance of integrating semiconductor advancements into environmental and industrial policies to enhance energy efficiency and technological sovereignty. US agency launches process to bar some Chinese labs from testing US electronics 9/11/2025 "Foreign adversary governments should not own and control the labs that test the devices the FCC certifies as safe for the U.S. market," FCC Chairman Brendan Carr said. Apple debuts A19 and A19 Pro processors for iPhone 17, iPhone Air, and iPhone 17 Pro 9/11/2025 The base iPhone 17 will be powered by the A19 system on a chip, while the rest of the lineup relies on the more powerful A19 Pro. These chips are likely built on TSMC's latest N3P process node, which is also expected to be used for Apple's upcoming M5 chips for iPads and Macs. TSMC increases Arizona internships to feed its Phoenix fabs 9/11/2025 A wave of homegrown talent arrives just as TSMC’s 4nm ramp-up in Arizona turns into a three-fab silicon supercluster. Nvidia announces next-gen AI chips: Rubin CPX 9/11/2025 Nvidia will debut a new generation of AI chips called Rubin CPX by the end of 2026, specifically designed to manage demanding tasks like video and software generation. To address the complexities of AI workloads, Nvidia's new chips will integrate multiple processing steps, including video decoding, encoding and inference, into a single chip. AMD Expands R&D Footprint in Malaysia 9/10/2025 AMD has inaugurated its new state-of-the-art office and engineering lab facility in Penang, significantly expanding its presence in Malaysia.  1  |  2  |  3  |  4  |  5  |  6  |  7  |  8  |  9  |  10

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