|
 |
|
| La Luce Cristallina begins 200mm BaTiO3 wafer production |
5/5/2026 |
|
La Luce Cristallina has begun producing 200-millimeter barium titanate wafers at a new facility in Austin, Texas, becoming the second US manufacturer of such wafers. Barium titanate is gaining interest for modulators and photonic ICs due to its efficiency and performance, with applications in telecommunications, AI data centers and quantum computing
|
|
|
| Qualcomm debuts custom silicon for AI, agentic phones |
5/4/2026 |
|
Qualcomm has announced plans for custom silicon, including a dedicated central processing unit for "agentic experiences" and "agentic smartphones." The company will supply custom products to "a leading hyperscaler," with shipments expected in the December quarter, and expects to win 70% of Samsung's system-on-chip business this year and next.
|
|
|
| Apple chooses TSMC's packaging for A20 chip |
5/1/2026 |
|
Apple will reportedly not use WMCM packaging for its A20 chip in the base iPhone 18 due to DRAM shortages and cost concerns, opting instead for Taiwan Semiconductor Manufacturing Co.'s Integrated Fan-Out packaging. However, Apple plans to use WMCM for the A20 Pro in the iPhone 18 Pro and Pro Max.
|
|
|
| Samsung Q1 chip profit hits $36bn on sales of $94bn |
5/1/2026 |
|
Samsung Electronics has reported a first-quarter semiconductor profit of $36 billion, up 49 times year over year, on $94 billion in revenue, driven by high-bandwidth memory demand and data center expansion. The company has initiated mass production of HBM4 and SOCAMM2 for Nvidia's Vera Rubin platform and developed PCIe Gen6 solid-state drive
|
|
|
| AI memory needs to surge 1,000x |
5/1/2026 |
|
Professor Kim Jung-ho of the Korea Advanced Institute of Science and Technology projects a 1,000-fold increase in memory capacity requirements driven by AI inference over the next 30 years.
|
|
|
| SK hynix Verifies 12-Die Hybrid Bonded HBM Stack |
4/30/2026 |
|
SK Hynix has verified a 12-die high-bandwidth memory stack using hybrid bonding, which enhances speed and efficiency by eliminating the need for bumps between memory layers. The company has reported yield improvements but has not disclosed specific figures. SK Hynix plans to continue using mass reflow-molded underfill technology until hybrid bonding is ready for mass production.
|
|
|
|
