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| Japan's Rapidus begins test production of 2nm chips |
4/2/2025 |
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Rapidus, a Japanese state-backed semiconductor company, has started test production of next-generation chips, aiming to mass-produce 2-nanometer semiconductors by 2027. The initiative, supported by $11.5 billion in government funding, seeks to reduce Japan's reliance on foreign technology. Rapidus used ASML Holding's extreme ultraviolet lithography for the first time; test chips are expected by July.
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| GlobalFoundries eyes merger with UMC |
4/2/2025 |
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GlobalFoundries is considering a merger with United Microelectronics Corp. to strengthen its position in mature and specialty process technologies, according to reports. The "Project Ultron" initiative reportedly aims to develop a major player in chip production but faces regulatory, financial and political hurdles. UMC has denied the reports.
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| Apple M6 Chip to Feature Built-In Modem for Macs by 2027 |
4/1/2025 |
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Apple has started designing the M6 chip, set for a 2027 release, which will feature an in-house cellular modem for Macs, according to reports. This move aims to reduce reliance on Qualcomm, whose chips are used in current Macs.
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| 12-channel LED driver targets automotive lighting |
3/31/2025 |
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Nexperia has unveiled the AEC-Q100-qualified NEX13120FPC-Q100, a 12-channel LED driver designed for automotive lighting applications. The driver supports ASIL-B compliance and features a low dropout voltage, reducing operating temperatures by 5 C. It offers phase-shift pulse width modulation dimming and can handle data rates up to 2 megabits per second.
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| Smaller Surface PCs may arrive soon with Snapdragon chips inside |
3/28/2025 |
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Microsoft is reportedly preparing to launch a new line of smaller Surface devices, including a Surface Pro tablet and Surface Laptop, potentially in alignment with its 50th anniversary. It is speculated the 12-inch devices will feature Snapdragon chips, maintaining Microsoft's use of the Qualcomm Snapdragon X platform for consumer products.
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| Broadcom, Astera tackle PCIe 6.0 complexity for AI |
3/28/2025 |
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Broadcom and Astera Labs are addressing the complexities of PCIe 6.0, which is driven by AI workloads. Broadcom has introduced a PCIe 6.0 portfolio, including an Interop Development Platform, and is collaborating with Micron and Teledyne LeCroy. Astera Labs has expanded its Cloud-Scale Interop Lab to test Scorpio Smart Fabric switches.
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| Foundry 2.0 to grow 11% this year |
3/27/2025 |
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The Foundry 2.0 market — defined as encompassing foundry, non-memory IDM, OSAT, and photomask making —is projected to reach a market size of $298 billion in 2025, with year-over-year growth of 11%.
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| Samsung, SK Hynix compete for HBM4 dominance |
3/26/2025 |
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Samsung Electronics and SK Hynix will compete for dominance in the high-bandwidth memory market this year, aiming to strengthen their positions in the AI chip sector. SK Hynix has showcased a prototype of the 12-layer HBM4 at GTC 2025 and plans mass production in the second half of the year. Samsung has moved up its HBM4 launch by six months and plans to start mass production in the second half as well.
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| SK Hynix releases HBM4 samples, with eye on mass production this year |
3/25/2025 |
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According to the chipmaker, it recently provided samples of its 12-layer HBM4 to major clients for qualification tests. HBM4 is the sixth generation of HBM, which plays a critical role in accelerating processes for graphics processing units (GPUs) and other AI accelerator chips.
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| TSMC 2nm yields nearly ready for mass production |
3/25/2025 |
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Taiwan Semiconductor Manufacturing Co. is close to mass-producing 2-nanometer chips, with potential output reaching 50,000 wafers per month by year-end. TSMC's fabs in Baoshan and Kaohsiung in Taiwan, at full capacity, can run 80,000 wafers per month, which would meet initial demand.
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