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| WD’s David Goeckeler Elected Chair of SIA |
11/26/2024 |
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Western Digital CEO David Goeckeler has been elected Chair of the Semiconductor Industry Association (SIA) Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
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| TSMC's says 1.6nm node to be production ready in late 2026 — roadmap remains on track |
11/25/2024 |
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Taiwan Semiconductor Manufacturing Co. says mass production of chips using the N2, or 2-nanometer technology, will begin late next year, followed by the A16, or 1.6nm process, in late 2026. The A16 process, which includes a backside power delivery network, is aimed at data center AI processors, while the N2P and N2X processes target client devices and high-performance central processing units, respectively.
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| Rivian locks in 5-year battery deal with LG Energy Solution |
11/25/2024 |
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Rivian has signed a five-year battery supply agreement with LG Energy Solution Arizona, according to an announcement Nov. 8. Rivian expects the deal will help trim sourcing and production costs, further reduce battery weight, enhance energy storage and improve battery pack assembly processing by 45%, according to a shareholder letter.
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| TI sets plan to boost in-house manufacturing |
11/21/2024 |
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Texas Instruments will increase in-house manufacturing to 95% by 2030, tripling manufacturing capacity and building new fabs and assembly locations, says Stefan Bruder, TI's president of Europe, the Middle East and Africa. The company has increased direct sales to 70% via its website and API and is focusing on AI and gallium nitride
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| Space-grade NOR flash for FPGA configuration |
11/20/2024 |
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“The device offers a 133MHz quad serial peripheral interface and the highest density, radiation and single-event effects performance available in a QML-qualified non-volatile memory for use with space-grade FPGAs and microprocessors,”
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| Samsung foundry eyes Qualcomm and Nvidia for 2nm and 3nm orders |
11/20/2024 |
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Industry reports from South Korea indicate that low yield rates in Samsung's foundry operations have impeded recent AP advancements. However, the introduction of the 2nm process could mark a turning point. The company plans to integrate the Exynos 2600 into its Galaxy S26 smartphones, departing from its previous strategy of using both Exynos and Qualcomm chips based on market requirements.
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| Hynix to sample HBM3e 16hi in H1 2025 |
11/19/2024 |
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With HBM4 12hi starting in the second half of 2025, Hynix’s move to add a 16hi option within the HBM3e family could be because TSMC’s CoWoS-L packaging technology is expected to support larger package sizes between 2026 and 2027, allowing for more HBM stacks per SiP.
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