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| Composite material could boost capacitor performance |
2/3/2025 |
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Researchers have developed a composite material that triples the energy density of ceramic capacitors, according to a study in Nature. The material disrupts the dipole pattern in antiferroelectrics -- enhancing breakdown strength and charge-discharge efficiency.
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| Keysight introduces LPDDR6 design and test solution |
1/31/2025 |
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The memory market is evolving rapidly due to the rising demand for high-performance computing, AI, and energy-efficient mobile applications. LPDDR6 significantly enhances performance and efficiency to support next-generation compute system requirements, making it a crucial upgrade for contemporary devices.
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| Rapidus installing 10 EUV tools for 2nm chips |
1/31/2025 |
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Rapidus plans to install 10 EUV lithography tools at its fabs in Japan, with its sights on 2-nanometer chip production by 2027 The first tool arrived in December, and Rapidus wants to start trial production in April and deliver samples to Broadcom by June.
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| Trump eyes up to 100% tariffs on foreign semiconductors |
1/30/2025 |
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High tariffs will either encourage suppliers to use more domestic production and components to avoid the import levies, and cut off foreign suppliers in favor of domestic ones, or cause the end buyer – you and me – to pick up the extra costs of importing the stuff, which will hit sales.
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| DeepSeek's AI breakthrough challenges US tech giants |
1/28/2025 |
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DeepSeek, a Chinese AI lab, has released DeepSeek-V3, a chatbot developed in just a few months for $5.6 million using midrange hardware. The development has shocked US tech giants -- raising questions about their spending and competitive edge. The R1 model was trained on 2,000 Nvidia graphics processing units, significantly fewer than the tens of thousands typically used by US developers. DeepSeek experienced significant outages after its AI assistant became the top free app on Apple's US App Store, but the company says the issues have been resolved.
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| Micron Building New HBM Advanced Packaging Factory in Singapore |
1/24/2025 |
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The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth.
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