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Strikes to hit Volkswagen in December as clash with labor escalates 11/29/2024
"Strikes are possible and also necessary from the beginning of December," IG Metall said in a handout to workers seen by Reuters, adding an existing agreement not to stage walkouts will end on Nov. 30.
Rising Inventory and Supply Seen to Push DRAM Prices Down in 2025 11/29/2024
Rapid changes in market dynamics have led TrendForce to revise its forecast, shifting from an anticipated price increase to a projected decline.
Qualcomm' no longer interest in Intel acquisition 11/29/2024
Qualcomm's interest in acquiring Intel has diminished, according to sources, who point to the complexities of such a deal, including Intel's $50 billion debt and potential regulatory hurdles. Qualcomm had initially considered the acquisition following Intel's disappointing earnings report and restructuring efforts, sources say.
Intel to close$8B CHIPS Act grant for factory projects 11/29/2024
Intel is nearing a deal with the US government for an $8 billion grant to boost its factory-building efforts in four states. The previously announced grant was reportedly reduced by around $500 million because Intel was previously awarded up to $3 billion for secure facilities designed to produce microchips for US military and intelligence. Funds will be disbursed to Intel at various milestones, with at least $1 billion coming later this year.
US to reportedly sanction 200 more Chinese chip firms — high bandwidth memory might also see export bans 11/27/2024
The US is not looking to ease its stringent trade policies anytime soon. Comments (0)
Xiaomi readies mobile chip design for 2025 mass production to cut reliance on Qualcomm 11/27/2024
Xiaomi’s move could help with China’s goal of tech self-reliance, but only Apple and Google have completely transitioned to self-designed silicon
Vehicle-to-Everything Communication—The Future of Autonomous Connectivity 11/27/2024
Testing V2X technology in real-world environments faces significant challenges due to the inherent complexity of real-world conditions.
Infineon Highlights Latest Contactless Payment Solutions at SFF 2024 11/27/2024
Here's a look at Infineon's platforms and solutions showcase for the contactless payment industry at the Singapore FinTech Festival 2024.
Intel plans sale and leaseback of its 150-acre Folsom, California campus 11/26/2024
Intel Folsom employees mostly work on software. Intel is releasing capital but maintaining operations and staff in its California campus.
WD’s David Goeckeler Elected Chair of SIA 11/26/2024
Western Digital CEO David Goeckeler has been elected Chair of the Semiconductor Industry Association (SIA) Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
SpaceX Eyes 2 Gigabit Speeds for Starlink With Capacity Upgrades 11/26/2024
SpaceX's Gwynne Shotwell says the company's improvements to satellite communications are advancing at a rate similar to Moore's Law for computer chips.
AMD Hawk Point Refresh 'Ryzen 200' family set to arrive in 2025 but lacks NPU for local AI Inference 11/26/2024
This is tnot the first time we've heard about a potential Hawk Point refresh. A key factor that sets these new new Hawk Point refresh or Ryzen 200 APUs apart is the absence of an NPU - which is probably physically disabled from the die - thus explaining the lack of an "AI" tag.
Bain-Backed Kioxia Sets IPO Price for December Tokyo Debut 11/25/2024
Bain Capital-backed Kioxia Holdings Corp. is setting its indicative IPO price at ¥1,390 per share, the latest attempt to capitalize on Japan’s stock market renewal.
TSMC's says 1.6nm node to be production ready in late 2026 — roadmap remains on track 11/25/2024
Taiwan Semiconductor Manufacturing Co. says mass production of chips using the N2, or 2-nanometer technology, will begin late next year, followed by the A16, or 1.6nm process, in late 2026. The A16 process, which includes a backside power delivery network, is aimed at data center AI processors, while the N2P and N2X processes target client devices and high-performance central processing units, respectively.
Rivian locks in 5-year battery deal with LG Energy Solution 11/25/2024
Rivian has signed a five-year battery supply agreement with LG Energy Solution Arizona, according to an announcement Nov. 8. Rivian expects the deal will help trim sourcing and production costs, further reduce battery weight, enhance energy storage and improve battery pack assembly processing by 45%, according to a shareholder letter.
DOJ Wants to Force Google to Sell Chrome, License Search Data to Rivals 11/25/2024
A proposal from the Justice Department and a group of state attorneys general would also ban search-default deals and could lead to a forced divestiture of Android.
Arrow Electronics Fuels SAVART Motors’ EV Manufacturing Expansion in Indonesia 11/22/2024
Arrow is supporting Indonesia's SAVART Motors in designing and manufacturing high-quality, safe, and affordable electric scooters.
US Charges 5 Members of Scattered Spider Hacking Group 11/22/2024
Federal investigators says the suspects sent text-based phishing messages to steal login credentials and breach numerous companies. Targets reportedly included MGM Resorts.
SK Hynix Begins Mass Production of Industry-leading 321-layer NAND Flash Memory 11/22/2024
Significant Leap from Previous 238-layer Generation with 12% Faster Data Transfer
SMIC's stock jumps 120% as semiconductor trade war intensifies 11/22/2024
Will growing local sales compensate for its inability to produce cutting-edge chips?
TI sets plan to boost in-house manufacturing 11/21/2024
Texas Instruments will increase in-house manufacturing to 95% by 2030, tripling manufacturing capacity and building new fabs and assembly locations, says Stefan Bruder, TI's president of Europe, the Middle East and Africa. The company has increased direct sales to 70% via its website and API and is focusing on AI and gallium nitride
Microsoft debuts custom chips to boost data center security and power efficiency 11/21/2024
Microsoft has introduced the Azure Integrated hardware security module and Azure Boost data processing unit to enhance data center efficiency and security. The Azure Integrated HSM meets FIPS 140-3 Level 3 security standards, while the Azure Boost DPU optimizes data processing and power usage.
GlobalFoundries, DOC finalize $1.5B funding award 11/21/2024
The U.S. chipmaker plans to use the funds to build and expand factories in New York and Vermont.
Starship’s Sixth Flight Test Skips the Tower Catch, Ends in Soft Splashdown 11/21/2024
A live audience that included President-elect Trump, plus millions more on SpaceX’s stream, watched the world's most powerful rocket lift off but did not see it return to its origin.
Space-grade NOR flash for FPGA configuration 11/20/2024
“The device offers a 133MHz quad serial peripheral interface and the highest density, radiation and single-event effects performance available in a QML-qualified non-volatile memory for use with space-grade FPGAs and microprocessors,”
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