Tuesday, January 28, 2020

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Industry News
Blaize now offers an AI graphic processor 11/14/2019
Blaize describes its GSP as capable of performing “direct graph processing, on-chip task-graph management and execution, and task parallelism.” In short, Blaize designed the GSP to fulfill AI processing needs that have been previously unmet by GPU, CPU or DSP.
Kioxia Memory offers new family of embedded NOR 11/13/2019
Kioxia Memory recently unveiled a family of SLC NAND flash memory products for embedded applications that need high-speed data transfers, including flat screen TVs, printers, wearable devices, and robots. Kioxia’s second-generation Serial Interface NAND is compatible with the widely used Serial Peripheral Interface (SPI) and offers increased speeds from 104 MHz to 133 MHz as compared with the previous generation.
Silicon wafer manufacturers and their clients become more reluctant to sign long-term agreements (LTA) 11/13/2019
Silicon wafer producers find it more difficult to strike LTA contracts for the supply of 8- and 6-inch, and smaller size wafers given the still sufficient supplies from the spot market.
Inphi and Synopsys to split assets of eSillicon 11/13/2019
eSilicon was established in 2000 and provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Targeting high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.
European commissioner see competition is beneficial rather than detrimental to society 11/13/2019
Vestager said that breaking up big tech conglomerates would not solve the problem. It would make sense if it is “the only solution to the illegal behavior, to the damage it has provoked. But, “we don’t have a case like that right now.
Kprean semiconductor output increased 5.5% in Q3 11/12/2019
Samsung and SK Hynix have both managed to lower their inventory to appropriate levels indicating the global memory market is poised for a rebound in the first half of 2020,
Tsinghua Unigroup called on U.S. companies to lobby on easing trade war 11/12/2019
Tsinghua Unigroup chairman Zhao Weiguo said at a conference in Beijing on Friday that U.S. firms should “relax and sleep well”, urging them not to be threatened by China’s semiconductor ambitions, and to play a greater role in easing tensions.
Q4 wafer shipment will be flat 11/12/2019
Affected by the US-China trade war, many clients have failed to honor procurement contracts inked with silicon wafer suppliers since the second quarter of 2019. Shipments of 12-inch wafers picked up slightly in the third quarter thanks to strong demand from TSMC to support its 7nm and 5nm production,
AV developement delayed due to complacency and ignorance 11/12/2019
Both GM and Ford, who promised to roll out their autonomous products this year have delayed the rollout indefinitely. Ten years is now the optimistic prediction. Twenty is more realistic.
DRAM Inventor, Robert Dennard, honored at SIA annual dinner 11/11/2019
Dennard, who spent much of his career at IBM Research in Yorktown Heights, New York, was also recognized for his contribution to “scaling theory,” another of the foundations upon which the industry continues to evolve.
Dozens of former GlobalFoundries workers lost their jobs when division was sold 11/11/2019
California company Marvell Technology Group Ltd. laid off 78 employees after taking full ownership of a GlobalFoundries division on Nov. 6.
Shenzhen Global CEO Summit attendants are skiptism about China Trade settlement 11/11/2019
The prevailing sentiment is that no news is good news is fake news.
There is room for Phase Change Memory (PCRAM) 11/11/2019
Jim Handy, principal with Object Analysis, said the reason the technology continues to hold such promise is its really small crosspoint cell and its ability to be stacked. Intel, for example, is stacking two decks right now, he said, but recently revealed it can go up to four decks. “They intend on reducing costs by increasing the number of decks.”
Taiwan's top foundries hit combined quarterly record revenue 11/8/2019
The top-3 Taiwan-based foundries' sales increased 18.8% sequentially to a record high of US$10.84 billion in the third quarter of 2019.
Little Polish company has big idea on password security 11/8/2019
The name of the product is ELIotPro. It stands for Easy Lightweight Internet of Things Protection, at least the acronym is easy to say if not to type. The technology includes a lightweight encryption algorithm that solves another problem of IoT security as most encryption is to much of a memory hog to be used in small devices. It’s small size is the key to how it works.
Nvidia offers smallest size supercomputer board 11/8/2019
The Xavier NX board can achieve 14 to 21 TOPS INT8 performance at power budgets between 10W and 15W, respectively. This amount of processing power would enable running multiple neural networks in parallel, and processing data from multiple high-resolution image sensors simultaneously.
Quantum chip developed in Singapore adds security to financial computers 11/8/2019
Researchers at Nanyang Technological University in Singapore (NTU Singapore) have developed a quantum chip 1,000 times smaller than current quantum configurations. The results offer a new opportunity for implementing quantum cryptography methods in many financial systems.
Intel now samples Stratix 10 FPGA 11/7/2019
The FPGA uses Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB technology stitches two Stratix 10 GX FPGA core fabric die (with a capacity of 5.1 million logic elements per die) along with appropriate I/O tiles.
Backend manufacturers rush to add 5G testing capability 11/7/2019
Testing demand for high-end 5G mobile SoCs, RF chips, and diverse 5G base station chipsets including AAU (active antenna unit) has been mounting significantly from Huawei/HiSilicon, Qualcomm, Broadcom, Apple and MediaTek along with the arrival of 5G commercialization. This is expected to help boost capacity utilization rates at the backend partners in 2020.
With 50 cents SOC, Bluetooth devices are now disposable 11/7/2019
Its new DA14531 chip, which it also calls SmartBond Tiny, makes it possible to extend wireless connectivity to applications where it would have previously been prohibitive in terms of size, power or cost, especially those within the growing connected medical field. SmartBond Tiny is expected to help facilitate connectivity for inhalers, medicine dispensers, weight scales, thermometers, glucose meters and more.
Google goes for OpenTitan instead of root of trust (RoT) design 11/7/2019
"With our partners we want to spread the benefits of reliable silicon RoT chips to our customers and the rest of the industry. We believe that the best way to accomplish that is through open source silicon.”
Sony and Samsungin head-to-head competition on CMOS image sensors 11/6/2019
Sony currently accounts for over 50% of the global CIS market, buoyed by the launch of an array of 40-megapixel CIS products that have been adopted by a number of handset makers for flagship models. Sony is integrating CIS and edge AI processing technology utilizing stack architecture as it seeks to further expand its market share by exploring the applications for CIS products,
Samsung to backoff Exynos processor developement, closes related U.S. units 11/6/2019
“(Exynos) chips are not really used anywhere else and continue to lose ground in the mobile processor market, raising concerns about the company’s competitiveness,” said Park Sung-soon, an analyst at Cape Investment & Securities.
Wi-Fi 6 chip solutions to support sub-6-GHz 5G smartphones 11/6/2019
Qualcomm, MediaTek and Realtek Semiconductor have ramped up their orders for testing and certifying Wi-Fi 6 core chips with IC certification labs including Sporton International, and other IC designers such as RichWave are also showing testing demand for Wi-Fi 6 RF front-end modules.
We are entering the age of autonomous 11/6/2019
Many analysts agree—the next industrial revolution is already upon us, driven by growth in Industry 4.0 and autonomous systems. The push to more efficient use of materials and labor in this next age of industrial discovery requires that the underlying technology continue to evolve at a rapid pace
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