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Cadence, Renesas team up for AI design in India 9/28/2023
Cadence Design Systems and Renesas are collaborating in India on design challenges using AI. The pilot project is "utilizing a large language model to interpret the written specs and communicate the intent clearly to all stakeholders, identifying any mismatches or misalignments ... ensuring cleanliness and adherence to the intended specs at every stage," Cadence's Jayashankar Narayanankutty says.
Getty Images is partnering with Nvidia to launch Generative AI by Getty Images 9/28/2023
Generative AI by Getty Images is trained only on the vast Getty Images library, including premium content, giving users full copyright indemnification. This means anyone using the tool and publishing the image it created commercially will be legally protected,
STMicroelectronics Enables Secure Connection of IoT Devices to Microsoft Azure IoT Hub 9/28/2023
STMicroelectronics' new software simplifies connecting IoT devices built using its latest STM32H5 MCUs to Microsoft Azure IoT Hub.
proteanTecs Now a Member of TSMC 3DFabric Alliance 9/28/2023
proteanTecs has joined the TSMC Open Innovation Platform (OIP) 3DFabric Alliance, the newest alliance in TSMC's OIP ecosystem.
Macronix OctaFlash Memory Solutions certified for ISO 26262 ASIL D 9/27/2023
Macronix, an integrated-device manufacturer in the non-volatile memory (NVM) market, has announced that its OctaFlash memory line has received ISO 26262 ASIL D (Automotive Safety Integrity Level) certification.
Samsung Electronics denies Huawei ties after 2020 sanctions 9/27/2023
"Samsung has been abiding by export regulations set forth by the U.S. government and does not hold business relationships outlined within the guardrails," a spokesperson at Samsung Electronics said.
Li-Ion Battery Improvements to Drive a 6x Increase in Global EV Battery Output by 2030 9/27/2023
New research from global technology intelligence firm ABI Research finds that global EV battery output production will increase nearly six times to 2,585GWh by 2030.
Microchip Low Pin-Count MCU Features I3C Support 9/27/2023
Microchip's low pin count PIC18-Q20 MCU series features up to two I3C peripherals and Multi-Voltage I/O.
Huawei exec urges use of China's homegrown chips 9/26/2023
Despite China's inferior domestic chips, "if we don't use them, this gap will always be a gap, and lagging behind will always be lagging behind," said Zhijun, Huawei's rotating chairman.
Nvidia tops Qualcomm in Q2 chip design revenue 9/26/2023
Nvidia, spurred by the global demand for AI, saw its quarterly revenue jump 12.5% to $38.1 billion, TrendForce reports. These quarterly results moved the chip designer ahead of Qualcomm.
Southeast Asia Now the Hottest EV Market as OEMs Take Pole Position 9/26/2023
Battery electric vehicle (BEV) unit sales grew by 894% during the second quarter in Southeast Asia, driven by strong demand across Thailand, Vietnam, Indonesia, and Malaysia, according to Counterpoint Technology Market Research’s latest SE Asia Passenger Electric Vehicle Tracker, Q2 2023.
Vietnam’s FPT and Silvaco Team Up to Boost Semiconductor Workforce 9/26/2023
FPT Semiconductor is partnering with Silvaco to foster workforce and business growth in the semiconductor sector.
Nvidia to top in semiconductor revenue 9/25/2023
Semiconductor Intelligence is estimating Nvidia's revenue this year will be $52.9 billion, nearly double its 2022 revenue, which will make the company No. 1 worldwide. Intel with revenue at $51.6 billion and Samsung at $45.4 billion round out the top.
GlobalFoundries signs 10-year US contract for chips with DOD 9/25/2023
GlobalFoundries has signed a 10-year contract with the Defense Department to supply chips for defense and aerospace worth up to $3.1 billion. The deal includes access to the foundry's design ecosystem, prototyping, IP libraries and secure US facilities.
Semiconductor Foundries Expect Rebound in 3Q23 After 1.1% Revenue Drop in 2Q23 9/25/2023
Demand for staple consumer products like smartphones, PCs, and notebooks remains sluggish, perpetuating a slump in the use of expensive, cutting-edge manufacturing processes. At the same time, traditionally stable sectors—automotive, industrial control, and servers—are undergoing inventory correction.
Deigners now have the flexibility to make changes at any point in the FPGA chip's life span 9/25/2023
This eliminates many expensive chip spins and enables chip designers to start addressing many customers and applications with the same chips. It also extends the life of chips and systems because designers are now able to update their chips as protocols and standards changed.
Kioxia to refinance $14B with eye on WD merger 9/22/2023
Chip memory company Kioxia is reportedly working with lenders to refinance $14 billion in loans to fund a possible merger with Western Digital, sources say. The merger deal, which is still in the discussion stage, would give Western Digital 50.5% stake in the combined company.
Samsung, TSMC boost carbon neutrality efforts 9/22/2023
Samsung Electronics and Taiwan Semiconductor Manufacturing Co. are ramping up efforts to cut carbon emissions and transition to renewable energy. TSMC has advanced its RE100 commitment by 10 years, with plans to complete its move to renewable sources by 2040, while Samsung has pledged to reach carbon neutrality by 2050.
ITRI Leads Industry Collaboration for Heterogeneous Chip Packaging 9/22/2023
Multi-dimensional chip design and heterogeneous integrated packaging architecture are key tools to tackle IC design cycles and costs issues.
Qualcomm unveils Snapdragon 7s Gen 2 using 4nm process 9/21/2023
The new chipset comes with a dedicated Qualcomm AI Engine, which promises to offer users the option to capture crisp photos and 4K HDR videos, as well as enhanced nighttime shots with Qualcomm Low Light.
Worldwide 200mm fab capacity to jump 14% by 2026 to record high 9/21/2023
Power and compound semiconductors, which are vital for the consumer, automotive and industrial sectors, are the biggest drivers of 200mm investment. The development of powertrain inverters and charging stations for electric vehicles (EV) in particular is expected to fuel increases in global 200mm wafer capacity as EV adoption continues to rise.
Synopsys to Advance IC Design Workforce in Vietnam 9/21/2023
Synopsys is helping advance IC design talent in Vietnam by supporting the NIC's establishment of a chip design incubation center.
NIC and Cadence Team Up to Elevate Vietnam’s Electronics and Semiconductor Industry 9/21/2023
Cadence and the National Innovation Center have launched a new program aimed at accelerating IC design innovation in Vietnam.
TSMC in talks to add chip packaging capacity in Ariz. 9/20/2023
Taiwan Semiconductor Manufacturing Co. is discussing additional investments and advanced chip packaging capacity in Arizona, where the company already has committed to two fabs. Separately, TSM says it is on track with its 2-nanometer process project in Hsinchu, Taiwan.
Wafer Contract Price Hikes Trigger Short-term Surge in Spot Market 9/20/2023
TrendForce expects short-term market price fluctuations as suppliers continue to hold the upper hand in determining the prices for wafers and related NAND flash products.
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