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JEDEC unveils new plans for DDR5 MRDIMM and LPDDR6 CAMM standards 7/24/2024
The modules are designed to power the next generation of high-performance computing and AI applications.
Huawei sues MediaTek for alleged patent infringement 7/24/2024
Huawei Technologies has filed a patent infringement lawsuit against mobile chip developer MediaTek after licensing talks ended without resolution. The patents are said to be related to 3G, 4G and 5G cellular technologies, according to sources.
AI Server and Notebook Hardware Upgrades Fuel Demand for High-Capacitance MLCCs 7/24/2024
The surge in demand for AI hardware is driving ODMs to ramp up inventory procurement and setting the stage for a spike in orders and shipments of high-capacitance MLCCs.
Startup Emerges from Stealth to Address Chiplet Design Complexity 7/24/2024
Startup Baya Systems is coming out of stealth mode to take the guess work out of chiplets.
Nvidia has a new AI chip. Here’s what we know about the ‘B20’ 7/23/2024
Nvidia is working on a version of its new flagship AI chips for the China market that would be compatible with current U.S. export controls, four sources familiar with the matter said.
5G, 5G RedCap to Lead Automotive Connectivity by 2030 7/23/2024
The global automotive connectivity module and chipset market is projected to grow at a CAGR of 13% between 2020 and 2030.
Global AI Server Demand to Drive 2024 Market Value to $187B 7/23/2024
High demand for advanced AI servers from major CSPs and brand clients is expected to continue in 2024, according to TrendForce. Meanwhile, TSMC, SK hynix, Samsung, and Micron’s gradual production expansion has significantly eased shortages in the second quarter (2Q 2024). Consequently, the lead time for NVIDIA’s flagship H100 solution has decreased from the previous
Curiosity Rover Discovers Sulfur Crystals in Martian Rock 7/23/2024
The discovery marks the first time pure sulfur has been found on the Red Planet.
In Focus As Qualcomm Publishes Q3 Earnings 7/22/2024
Qualcomm is set to release its third-quarter earnings this month for fiscal 2024, with expectations of $9.25 billion in revenue. The figures will be driven by a recovery in the smartphone market and the growing demand for AI-optimized chipsets. The company's automotive business is bright, with semiconductors in demand as the adoption of autonomous driving and electrification pick up.
Most Efficient EV Ever? Lucid Touts MPGe Boost on 2025 Air Pure Lineup 7/22/2024
With a 146MPGe rating, the California-based automaker's 2025 lineup 'requires less electrical energy for any journey taken, A to B, than any other vehicle on the market today,' it says.
Infineon and Amkor Ink MoU to Stimulate Sustainability Strategies Across Supply Chain 7/22/2024
Infineon and Amkor are partnering to stimulate decarbonization and sustainabilit..
Merck to Acquire Unity-SC to Strengthen Offerings for AI Chips 7/22/2024
The combined technologies of Merck and Unity-SC will create high value solutions for the manufacturing of semiconductor devices globally.
$400M in CHIPS funding goes to GlobalWafers 7/19/2024
The money will go towards new plants in St. Peters, Missouri, and Sherman, Texas.
BMW and NXP First to Achieve CCC Digital Key Certification 7/19/2024
Car Connectivity Consortium (CCC), a cross-industry standards organization dedicated to advancing vehicle-to-device connectivity solutions. BMW was certified for their comprehensive digital key product, which allows drivers to use their CCC Digital Key enabled smart phone to lock, unlock and drive their vehicle utilizing near-field communication capabilities.
Harnessing Digital Twins for Energy-Efficient Data Centers 7/19/2024
U.S. data centers consumed over 4 percent of the country’s total electricity in 2022, a figure anticipated to rise to 6 percent by 2026.
Taiwan Enjoys Growing Role in Electronics Startup Ecosystem 7/19/2024
EE Times took the opportunity to interview many local and global startups at Com...
Ukraine rushes to create AI-enabled war drones 7/18/2024
Ukraine hopes a rollout of AI-enabled drones across the front line will help it overcome increasing signal jamming by the Russians as well as enable unmanned aerial vehicles (UAVs) to work in larger groups.
5G, 5G RedCap to Lead Automotive Connectivity by 2030 7/18/2024
The global automotive connectivity module and chipset market is projected to grow at a CAGR of 13% between 2020 and 2030.
Harnessing Digital Twins for Energy-Efficient Data Centers 7/18/2024
Recent computing advancements are forcing the data center industry to examine some harsh truths regarding power use.
We're Moving Twitter and SpaceX to Texas 7/18/2024
Musk vows to move two of his companies from California to Texas after the Golden State's governor passes a law about LGBTQ+ students.
Q1 ESD revenues up 14.4% 7/17/2024
“The EDA industry continued to report strong revenue growth in Q1 2024,” says Wally Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report, “all product categories reported increases, with CAE, IC Physical, Semiconductor IP and Services posting double-digit upticks.
MediaTek Plans To Introduce Its Own AI Server Chips, Featuring ARM Architecture & TSMC 3nm Process 7/17/2024
MediaTek intends to develop AI server chips using Arm architecture and Taiwan Semiconductor Manufacturing Co.'s 3-nanometer process. The company will go after cloud service providers' business with a mid-to-low performance tier.
Are Consumers Ready for 8K? 7/17/2024
At today's sizes of 65" to 80", the 8K difference is difficult to perceive, and the promise of an immersive experience is unfulfilled.
TI’s Magnetic Packaging Technology Reduces Power Module Sizes 7/17/2024
Utilizing TI's proprietary MagPack integrated magnetic packaging technology, the power modules are 23% smaller compared to competing modules.
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations 7/16/2024
HBM4 is set to introduce a doubled channel count per stack compared to HBM3, with a larger physical footprint. To support device compatibility, the standard ensures that a single controller can work with both HBM3 and HBM4 if needed.
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