Home
News
Products
Corporate
Contact
 
Thursday, November 21, 2024

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News
Most Efficient EV Ever? Lucid Touts MPGe Boost on 2025 Air Pure Lineup 7/22/2024
With a 146MPGe rating, the California-based automaker's 2025 lineup 'requires less electrical energy for any journey taken, A to B, than any other vehicle on the market today,' it says.
Infineon and Amkor Ink MoU to Stimulate Sustainability Strategies Across Supply Chain 7/22/2024
Infineon and Amkor are partnering to stimulate decarbonization and sustainabilit..
Merck to Acquire Unity-SC to Strengthen Offerings for AI Chips 7/22/2024
The combined technologies of Merck and Unity-SC will create high value solutions for the manufacturing of semiconductor devices globally.
$400M in CHIPS funding goes to GlobalWafers 7/19/2024
The money will go towards new plants in St. Peters, Missouri, and Sherman, Texas.
BMW and NXP First to Achieve CCC Digital Key Certification 7/19/2024
Car Connectivity Consortium (CCC), a cross-industry standards organization dedicated to advancing vehicle-to-device connectivity solutions. BMW was certified for their comprehensive digital key product, which allows drivers to use their CCC Digital Key enabled smart phone to lock, unlock and drive their vehicle utilizing near-field communication capabilities.
Harnessing Digital Twins for Energy-Efficient Data Centers 7/19/2024
U.S. data centers consumed over 4 percent of the country’s total electricity in 2022, a figure anticipated to rise to 6 percent by 2026.
Taiwan Enjoys Growing Role in Electronics Startup Ecosystem 7/19/2024
EE Times took the opportunity to interview many local and global startups at Com...
Ukraine rushes to create AI-enabled war drones 7/18/2024
Ukraine hopes a rollout of AI-enabled drones across the front line will help it overcome increasing signal jamming by the Russians as well as enable unmanned aerial vehicles (UAVs) to work in larger groups.
5G, 5G RedCap to Lead Automotive Connectivity by 2030 7/18/2024
The global automotive connectivity module and chipset market is projected to grow at a CAGR of 13% between 2020 and 2030.
Harnessing Digital Twins for Energy-Efficient Data Centers 7/18/2024
Recent computing advancements are forcing the data center industry to examine some harsh truths regarding power use.
We're Moving Twitter and SpaceX to Texas 7/18/2024
Musk vows to move two of his companies from California to Texas after the Golden State's governor passes a law about LGBTQ+ students.
Q1 ESD revenues up 14.4% 7/17/2024
“The EDA industry continued to report strong revenue growth in Q1 2024,” says Wally Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report, “all product categories reported increases, with CAE, IC Physical, Semiconductor IP and Services posting double-digit upticks.
MediaTek Plans To Introduce Its Own AI Server Chips, Featuring ARM Architecture & TSMC 3nm Process 7/17/2024
MediaTek intends to develop AI server chips using Arm architecture and Taiwan Semiconductor Manufacturing Co.'s 3-nanometer process. The company will go after cloud service providers' business with a mid-to-low performance tier.
Are Consumers Ready for 8K? 7/17/2024
At today's sizes of 65" to 80", the 8K difference is difficult to perceive, and the promise of an immersive experience is unfulfilled.
TI’s Magnetic Packaging Technology Reduces Power Module Sizes 7/17/2024
Utilizing TI's proprietary MagPack integrated magnetic packaging technology, the power modules are 23% smaller compared to competing modules.
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations 7/16/2024
HBM4 is set to introduce a doubled channel count per stack compared to HBM3, with a larger physical footprint. To support device compatibility, the standard ensures that a single controller can work with both HBM3 and HBM4 if needed.
Semis to grow 16% this year, says WSTS 7/16/2024
This growth is expected to be driven primarily by the Memory and Logic sectors, which are on track to soar to over $200 billion in 2025 each,
Wafer-Level Pulsed Laser Deposition: A Game Changer 7/16/2024
Lam Research's PLD technique allows chipmakers to accelerate their product roadmaps and explore longer-range capabilities.
Microchip MPU Designed for Autonomous Space Computing 7/16/2024
A report released by the World Economic Forum estimated that the space hardware and the space service industry is set to grow at a compound annual growth rate (CAGR) of 7% from 2023’s $330 billion dollars to $755 billion dollars by 2035.
Accenture Further Expands Silicon Design Capabilities with Cientra Acquisition 7/15/2024
Cientra brings approximately 530 experienced engineers and practitioners to Accenture's Advanced Technology Centers in India.
TSMC valuation soars as AI chip demand fuels growth 7/15/2024
Analysts expect TSMC to report a 29% increase in second-quarter net income and raise its full-year sales forecast, fueled by strong AI chip demand. The chipmaker's valuation has climbed to a $1 trillion market cap, with potential for further growth as it hikes prices for advanced chips. A predicted 3% to 6% price increase for advanced chips could lead to a gross profit margin rise of 58% next year, analysts say.
Taiwan president meets with Micron CEO 7/15/2024
It is very unusual for Taiwan's president to have publicised meetings with senior foreign tech executives despite the island being home to the world's largest contract chipmaker TSMC (2330.TW), opens new tab, whose chips help to power the surge in artificial intelligence (AI) applications.
Las Vegas Sphere Uses 150 Nvidia A6000 GPUs to Power Its Massive Display 7/15/2024
The Sphere taps the workstation Nvidia GPUs to display content on its 16K screens and massive LED-powered exterior.
The next-generation of chip material could be so thin to be just as three atoms thick 7/12/2024
Researchers developing next generation 2D semiconductors investigate potential silicon replacement in transition-metal dichalcogenide.
Samsung upgrades foldable phones, wearables with AI 7/12/2024
Samsung Electronics' latest foldable smartphones, the Galaxy Z Fold 6 and Flip 6, which are lighter and slimmer and feature enhanced AI functions and run the Qualcomm Snapdragon 8 Gen 3 for Galaxy processor. The company is also adding advanced health-monitoring features to its Galaxy Watch and new Galaxy Ring.
 9  |  10  |  11  |  12  |  13  |  14  |  15  |  16  |  17  |  18 

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved