Home News Products Corporate Contact

Friday, November 14, 2025

News Industry News Publications CST News Help/Support Software Tester FAQs

Global Pure-Play Chip Foundry Revenues Forecast to Grow 17% YoY in 2025 7/29/2025 The advanced 3nm and 5/4nm nodes are proving pivotal in driving semiconductor revenue growth. AMD is using AI to help design its next-generation GPUs 7/29/2025 At the recent 'Winning the AI Race' summit in Washington, AMD's CEO Dr. Lisa Su confirmed that it's leveraging AI to help design its next-gen GPU products. SK hynix confirms 3GB GDDR7 modules 7/29/2025 Paving way for RTX 50 Super VRAM boost. New chips would allow for 18GB of VRAM on a 192-bit bus, or 24GB on a 256-bit bus. Samsung Secures $16.5 Billion Tesla AI Chip Deal, Production Set For Texas 7/29/2025 The deal, which lasts through 2033, will produce chips to power Tesla's self-driving cars. Kioxia sampling 9th gen 512Gbit flash memory 7/28/2025 The devices are designed to support applications requiring performance and power efficiency in low to mid-level storage capacities. They will also be integrated into Kioxia’s enterprise SSDs, ST to buy NXP’s MEMS sensor business 7/28/2025 The MEMS businesses of ST and NXP are strongly complementary in terms of technology and product portfolio, with the combined product offering to be well balanced across automotive, industrial and consumer end markets. TSMC’s 2nm Production Is Expected to Break Records, With Capacity Surpassing 3nm 7/28/2025 The Taiwan giant appears to be now preparing for the next cycle of semiconductor process, which is set to be the 2nm (N2) technology. The 2nm node is expected to be the firm's most expensive technology to date, and despite skepticism from the industry to adopt the process, Intel will cancel 14A and following nodes if it can't win a major external customer 7/28/2025 Intel would move leading-edge nodes to TSMC and Samsung Then exit the leading-edge process technologies completely Micron launches high-density, space-tolerant SLC NAND 7/25/2025 Micron Technology has released a high-density, radiation-tolerant single-layer cell NAND flash memory, with an initial die capacity of 256 gigabits. The memory is designed for use in space applications and has been tested to withstand extreme temperatures, shock and radiation exposure. Mercury Systems has incorporated Micron's memory for use in NASA's Earth Surface Mineral Dust Source Investigation. Samsung delays HBM4 rollout to 2026 7/25/2025 Samsung delays HBM4 rollout to 2026 due to yield challenges, all while SK Hynix strengthens lead in AI memory U.S.'s push for domestic chip manufacturing is bearing fruit 7/25/2025 AMD CEO says U.S.-made TSMC chips are more expensive, but worth it — costs 'more than 5% but less than 20%' higher than Taiwan-sourced alternative Trump's 'AI Action Plan' Looks to Boost Data Center Buildouts, Ban 'Woke' AI 7/25/2025 Proposals include reducing regulations and environmental permitting but also carry on a few Biden policies. 'We will not allow any foreign nation to beat us' on AI, Trump says. Global IC Equipment Sales Expected to Reach $125.5B in 2025 7/24/2025 Semiconductor manufacturing equipment growth is expected to continue in 2026, with sales projected to reach a new high of $138.1 billion. US, Japan reach deal on tariffs, market access 7/24/2025 If finalized, the agreement would place a 15% duty on imports from Japan, including for cars and auto parts. Ørsted powers up Taiwan's first TSMC-exclusive wind farm 7/24/2025 This 920 MW project represents a groundbreaking achievement as the world's first offshore wind farm specifically designed to supply green electricity to TSMC. Want to Stay on Windows 10? Sign Up for Free Extended Security Updates Now 7/24/2025 Signing up for Microsoft's ESU program will get you one year of security updates. Look for the enrollment wizard in notifications and Settings to get started. Global PC Shipments Jump Over 8% YoY in 2Q 2025; Tariff Concerns Loom 7/23/2025 The 2Q growth was mainly driven by the approaching Windows 10 sunset, the early adoption of AI PCs, and stronger commercial demand. TSMC to Exit GaN, Focus on Advanced Packaging 7/23/2025 TSMC's exit from GaN production has sparked considerable speculation. U.S. Tariffs Cost Stellantis $350 Million So Far 7/23/2025 Preliminary first-half 2025 financials show steep loses made worse by automotive tariffs on the company’s imports into the U.S. 3M sees ‘strong’ Q2 with $6.3B net sales 7/23/2025 The chemical and consumer product manufacturer updated its outlook to include tariff impacts and aims to accelerate new product launches. Lattice FPGAs Powering Mitsubishi Electric Factory Automation Solutions 7/22/2025 Lattice's FPGAs are enabling Mitsubishi's CNC solutions to bring power efficient and reliable factory automation experiences. How to deploy faster in Southeast Asian IoT markets with smart modules 7/22/2025 This challenge can only be solved with compact, unified modules which can be embedded easily to deliver multiple advanced functionalities out-of-the-box. US preps 93.5% tariff on graphite from China 7/22/2025 The Commerce Department will determine the final duty rate in December as the Trump administration promotes domestic critical mineral production. What If GPUs Had Expandable Memory? 7/22/2025 Imagine if we had the choice of expanding GPU VRAM, similar to your usual PC memory, but while we cannot do it in modern times, there was such an option in the past. SK keyfoundry and LB Semicon Advance Chip Packaging with Direct RDL 7/21/2025 The newly co-developed Direct RDL by SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.  9  |  10  |  11  |  12  |  13  |  14  |  15  |  16  |  17  |  18

Copyright © 1994 - 2023 CST, Inc. All Rights Reserved