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Micron, Intel Bring MRDIMM Modules to Market |
8/20/2024 |
Micron Technology and Intel introduced multiplexed rank dual inline memory modules designed for AI and high-performance computing in data center applications. The MRDIMMs, ranging from 32 GB to 256 GB, offer improvements in memory bandwidth and latency and outperform current TSV RDIMMs.
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Revolutionizing Touch in Cars |
8/19/2024 |
The auto industry may no longer rely on eccentric rotating mass vibration motor (ERMs) and linear resonant motor (LRAs) for haptics.
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Intel offloads Arm shares as part of cost-cutting |
8/15/2024 |
Intel has sold its 1.18 million shares in Arm Holdings, raising about $147 million, as part of a broader strategy to cut costs and stabilize its finances. The company has struggled to regain its market position after a poor earnings report and, despite the sale, had a net loss on its equity investments of $120 million in the second quarter.
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SK Hynix joins 3D DRAM race with 4F2 technology |
8/14/2024 |
SK Hynix has announced plans to develop 4F2 DRAM, also known as vertical gate DRAM, featuring vertically stacked transistors. The stacking cuts die area by 30% compared to traditional 6F2 DRAM and aims to cut the cost of extreme ultraviolet processes by half.
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KIOXIA develops broadband SSD with optical interface for greener data centres |
8/12/2024 |
The solution replaces electrical wiring with optical wiring within devices in data centres. This enables significant expansion of physical distances between devices, slimming down wiring, while maintaining energy efficiency and high signal quality. It also allows for greater flexibility in data centre system design and applications.
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