Sunday, September 15, 2019

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Industry News
Apple is in talks to buy Intel’s modem chip business 7/24/2019
If the purchase happens, it would again underscore Apple’s increased willingness to consider large multibillion-dollar acquisitions with its war chest of $225 billion in cash and marketable securities.
Two companies plan on using unlicensed 800Mhz to 900Mhz band for IoT Communications 7/24/2019
LoRa uses unlicensed 800- to 900-MHz bands, which is inexpensive but subject to interference and requires users to set up their own networks. Narrowband-IoT, a low-cost version of LTE, typically uses higher frequencies with less range and penetration than the ISM bands.
Toshiba Memory wants to get into data center business through Merger and Acquisitions 7/23/2019
“One of the critical areas where we are focused on is the cloud service providers, data centre players,” Toshiba Memory Chairman Stacy Smith told Reuters. “We are very focused on growing our share in that space. There is a good chance that Toshiba Memory will embark on M&A over time,”
Moore's Law is not likely to run out of steam with advanced architectures 7/23/2019
The slow decline of Moore’s Law has become a talking point for chip executives since 2013, when Henry Samueli said that Broadcom had been discussing it with its customers. Like others in the industry, Samueli also expressed optimism that engineers will leverage new architectures to drive performance gains.
Samsung put LPDDR5 memory into new phone design 7/23/2019
The 12-Gb LPDDR5 is approximately 1.3 times faster than the LPDDR4X mobile memory found in today’s smartphones; the LPDDR4X comes in at 4.2 Gbps. As part of a 12-GB package, the LPDDR5 can transfer 44 GB of data (the equivalent of 12 full-HD movies) in a second.
Renesas enhanced AI performance by using processor-in-memory (PIM) technology 7/23/2019
Renesas’ existing generation of AI inference accelerators, based on its dynamically reconfigurable processor (DRP) architecture, achieves in the order of 1TOPS/W, enough to enable real time image recognition at the end node. The new PIM technology is almost an order of magnitude better in terms of TOPS/W and could be the basis for implementing incremental learning at the endpoint.
Intel announced a significant partnership with SAP 7/22/2019
Intel plans to tune its Intel Xeon Scalable processors and Intel Optane DC persistent memory for SAP’s suite of applications.The multi-year partnership includes giving SAP early access to emerging Intel technologies and building a Center of Excellence.
Senate introduced bill to keep Huawei from trading U.S. patents 7/22/2019
Huawei is pressing Verizon Communications Inc. to pay licensing fees for more than 200 of its patents, the Journal has reported. The tactic is seen by some in Washington as retaliation against U.S. policy makers' crackdown on the Chinese firm, which is the world's biggest telecom gear maker and has become a central sticking point in the U.S.-China trade talks.
Vendors see rising MOSFET order for second half of year 7/22/2019
Brand vendors' new PCs and notebooks are set to become available in the third quarter, coming with next-generation CPU and GPU platforms that require more MOSFET chips. Many Taiwan-based MOSFET suppliers have already seen rising orders for the third quarter.
Nvidia recruited safety expert from Intel 7/22/2019
Nvidia this week snatched up Riccardo Mariani, formerly chief functional safety technologist at Intel Corp., and an Intel Fellow, to be its vice president of industry safety. The position is a new role for Nvidia, added to augment its “world-class safety team,” according to Nvidia. The goal is to institute “an overarching safety view across multiple domains and technologies.”
Samsung starts production of 12GB LPDDR5 mobile DRAM 7/19/2019
The world's largest memory chip maker will package eight of them (2GB) into a 12GB LPDDR5 DRAM and supply it for new flagship smartphones,
Toshiba Memory rebrands itself as Kioxia 7/19/2019
The change is scheduled to take place on October 1, 2019, at which time all Toshiba Memory companies will adopt the new name.
$1.5 billion of U.S. federal funds earmarked for advance semiconductor research 7/19/2019
Projects span new kinds of circuits, fresh approaches to chip stacking, advanced materials, and new design flows, as well as new techniques for machine learning. “ERI is about driving innovation for a new wave in electronics when geometric scaling no longer makes as much sense,”
GDDR found its path to AI applications 7/19/2019
Last couple of years have seen GDDR technology hit a “Goldilocks zone” of sorts with uptake in emerging use cases such as artificial intelligence (AI), autonomous vehicles, and 5G networking — all of which need speed and high performance.
DOJ request a pause in antitrust ruling involving Qualcomm 7/18/2019
According to the Department of Justice, national security could be threatened by a May ruling by Judge Lucy Koh, who found that Qualcomm broke competition law by charging cellphone makers high fees for the rights to the company's wireless equipment.
Arm initiates a "Try-Before-Buy" model on its IP license 7/18/2019
Called Arm Flexible Access, the model allows IC designers to initiate projects before they license IP and pay only for what they use at production, giving designers more freedom to experiment, evaluate and innovate.
EU funds project to create vision-basedl reference platform 7/18/2019
The resulting reference platform includes a full development kit, comprising an FPGA-based embedded, multicore computing board, parallel real-time operating system and development tool chain with guidelines, coupled with ‘real world’ use cases focusing on medical x-ray imaging, driver assistance and autonomous drones with obstacle avoidance.
Algolux video sensor can see around corners 7/18/2019
It seems that a team of researchers from Algolux, the University of Montreal, and Princeton University has developed a new method that lets conventional color cameras, like the ones in your smartphone or in vehicles, see hidden objects that are occluded by walls or other objects in the scene.
Tesla cut prices of Model 3 while adjusting prices on other models 7/17/2019
Tesla said on Monday that it’s reducing the price of the Model 3 by $1,000 to $38,990. The company will no longer sell the standard range versions of the Model S and Model X, raising the minimum costs consumers will have to pay for those cars.
TSMC June sales up 21.9% 7/17/2019
June sales were $2.77 billion, up 21.9 percent from the same month a year before and up 6.8 percent from May. TSMC's revenue for first half of the year was $14.51 billion, down 4.5 percent on the first half of 2018.
Symantec breaks off merger talk with Broadcom 7/17/2019
Price negotiations broke down. Broadcom was last week willing to offer as much as $28.25 per share in cash for Symantec and was hoping to ink a deal on Monday. CNBC, which first reported the news on Monday, said Symantec was looking for more than $28 per share.
High performance computation may turn to specialized Chiplets 7/17/2019
One example is Google's Tensor Processing Units (TPUs), the bespoke processors that excel at the mathematical operations required for machine learning, another are the many Bitcoin mining chips released when the cryptocurrency was at its peak. These chips differ from the traditional CPU (Central Processing Unit) found inside computers, which is able to handle a very broad range of tasks for the computer and can be considered a jack of all trades and master of none.
DRAM prices turned around and rose 13% 7/16/2019
Prices of dynamic random access memory (DRAM) chips gained as much as 13 percent in a week on concerns about supply disruption at Korean chipmakers responsible for more than 70 percent of DRAM global supplies following Japan’s export curbs on materials needed for chip production.
Samsung is readying to deal with trade dispute with Japan 7/16/2019
The de facto leader of Samsung Group, JY Lee, reportedly convened a meeting on Sunday with senior executives of Samsung Electronics' display and semiconductor businesses upon his return from Japan, ordering them to come up with plans that took into account Japan's trade restrictions.
New chip stack packaging shown at Semicon West 7/16/2019
Packaging engineers are coming to the rescue with novel ways to stack individual chips into potent devices.
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