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| Global EV sales up 30.5% in September |
10/15/2024 |
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Global sales of fully electric and plug-in hybrid vehicles rose by an annual 30.5% in September, as China surpassed its record numbers recorded in August and Europe resumed growth, market research firm Rho Motion said.
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| AMD debuts MI325X AI accelerators with 256GB of HBM3e |
10/14/2024 |
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Advanced Micro Devices has introduced the Instinct MI325X AI accelerators, featuring 256GB of HBM3e and 6TB/s of memory bandwidth. The MI325X, which is set for production shipments in the fourth quarter, shows a 20% to 40% lead over Nvidia's H200 in inference performance
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| TSMC’s Sales Beat Estimates in Good Sign for AI Chip Demand |
10/10/2024 |
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Taiwan Semiconductor Manufacturing Co. reported a 39% increase in quarterly revenue to $23.6 billion, surpassing expectations and easing concerns about a slowdown in AI hardware spending. The strong performance, driven by demand from Nvidia and Apple, highlights TSMC's role in AI development.
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| Foxconn to build Taiwan’s fastest AI supercomputer with Nvidia Blackwell |
10/9/2024 |
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The project, Hon Hai Kaohsiung Super Computing Center, revealed Tuesday at Hon Hai Tech Day, will be built around Nvidia’s Blackwell graphics processing unit (GPU) architecture and feature the GB200 NVL72 platform, which includes a total of 64 racks and 4,608 Tensor Core GPUs.
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| Samsung Electronics' Q3 earnings fall below market expectations |
10/9/2024 |
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Samsung Electronics has forecast a third-quarter operating profit of $6.76 billion, below market expectations because of weak chip demand and one-time costs. The Device Solutions division, which includes semiconductors, is a major factor in the disappointing performance. LG Electronics also has projected lower-than-expected Q3 operating profit, citing higher marketing and shipping costs.
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| Worldwide Chip Sales Up 21% YoY in August |
10/9/2024 |
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“The global semiconductor market continued to grow substantially in August, hitting its highest-ever sales total for the month of August, and month-to-month sales increased for the fifth consecutive month. Year-to-year sales increased by the largest percentage since April 2022,
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| TSMC and Amkor link up to bring advanced packaging stateside |
10/8/2024 |
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The advanced packaging facility is set to be built in Peoria, Arizona. Notably, fan-out wafer packaging, a technology used by companies like Apple to connect memory to processors in iPhones and MacBooks, will be a focal point at the site.
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| JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents |
10/7/2024 |
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JEDEC has announced the publication of the JESD406-5 LPDDR5/5X Serial Presence Detect (SPD) Contents V1.0, which outlines the content of the SPD non-volatile configuration device included in standard memory modules using LPDDR5/5X SDRAMs. This allows application software and BIOSes to determine the module capacity, speed, I/O configuration, and content revision level. The release aims to expand the market for these components and ensure consistent support for incorporating LPDDR5 devices into systems, particularly for notebook computers.
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