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Wednesday, October 5, 2022

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Intel's mass production of the tGPU chipset in Meteor Lake to be postponed 8/5/2022
Intel Corp. plans to outsource the tGPU (tiled GPU) chipset in Meteor Lake to Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) for manufacture, according to TrendForce research. Mass production of this product was initially planned for the second half of the year (2H22) but was later postponed to 1H23 due to product design and process verification issues.
IC market recorded its first-ever June sequential sales decline 8/4/2022
Based on data from WEMA, SIA, and WSTS dating back to 1976. Typically, high single-digit or double-digit sales gains have been the pattern for June IC sales. Even in its previously weakest year (1985), June IC sales increased 1%. Never, until this year, have June IC sales declined.
Apacer will return to AGE Australia and showcase its industrial PCIe SSDs 8/4/2022
The Australian Gaming Expo (AGE), which has been postponed for two years due to the worldwide pandemic, officially returns this year. Industrial storage and memory brand Apacer will return to participate in the AGE in Sydney, Australia from August 9–11,
Semtech Corp. to acquire Sierra Wireless Inc for a total enterprise value of $1.2 billion. 8/4/2022
The acquisition will significantly expand Semtech’s addressable market and is expected to approximately double Semtech’s annual revenue and create a strong and diverse portfolio of connectivity solutions for the growing IoT market, making it easier for customers to find innovative end to end solutions for any segment.
Infineon has reported another robust quarter 8/4/2022
Despite the challenging macroeconomic and geopolitical situation, Infineon has reported another robust quarter with revenue of €3.6 billion, up 10% sequentially and 33% year over year, in the third quarter of its fiscal year 2022. The Munich, Germany-based chipmaker has raised its revenue forecast for the full year 2022.
SK hynix discloses 238-layer 4D NAND Flash product 8/3/2022
According to the company, the latest achievement follows development of the 176-layer NAND product in December 2020. The latest 238-layer product is most layered and smallest in area at the same time.
Avery Design Systems offers Chiplet Verification IP 8/3/2022
Avery Design Systems, known for its functional verification solutions for key semiconductor technologies, including PCI Express (PCIe), Compute Express Link (CXL), and HMB3, now offers comprehensive support for the new Universal Chiplet Interconnect Express (UCIe) with high–quality models and test suites that support pre–silicon verification of systems using UCIe
Six ways to make mass-market EV adoption a reality 8/3/2022
Electric-car unit sales grew last year by nearly 70%, to 2.3 million, but some barriers to electric-vehicle adoption can only be overcome by effective strategies and practices. In a panel session at the recent Energy Tech Summit in Warsaw, Poland, e-mobility pundits discussed six ways to make mass-market EV adoption a reality.
Robotic Automation Optimizes Test Instrumentation can save time and money 8/3/2022
In life cycle development. Each step requires testing, debugging, and verification.
SK geo centric and STAC forms JV to make high-purity semiconductor cleaner products 8/2/2022
Tokuyama, a Japanese chemical company, and SK geo centric established a 50-50 joint venture named STAC for the project last December, with combined investments worth 120 billion won ($92 million).
Micron plans increase in memory production 8/2/2022
Micron wants a piece of the $52 billion in chips subsidies approved by US Congress this week. The company Friday promised to ramp up domestic memory production over the next few years.
Pierre Barnabé succeeds Paul Boudre as CEO of Soitec 8/2/2022
The three-month transition has ended. Boudre has handed over the reins of Soitec to Barnabé, former senior executive vice president, group security officer, and global head of big data and cybersecurity at Atos, to continue the company’s growth trajectory.
U.S. Chip Act to bring restrictions on Equipements export to China 8/2/2022
The draft bill not only covers wafer manufacturing R&D and factory construction subsidies, tax incentives, among others, but also proposes additional restrictions.
Intel shows $500 million loss on $15.3 billion of Q2 revenue 8/1/2022
The gross margin was 36.5%, down 20.6pp from the same period a year ago. But expenditure on R&D and mergers & acquisitions increased by 17% to US$6.2 billion.
Global Silicon Wafer Shipments Hit New Record in Q2 2022 8/1/2022
Worldwide silicon wafer area shipments in the second quarter of 2022 surpassed the previous record high set in the first quarter of the year, edging up 1% quarter-over-quarter to 3,704 million square inches, according to the SEMI Silicon Manufacturers Group (SMG).
STMicroelectronics Doubles Q2 Net Income 8/1/2022
STMicroelectronics has reported net revenues of $3.84 billion in the second quarter of 2022, up 28.3% year over year and above the midpoint of its guidance and raised its full-year revenue outlook.
Alchip Technologies to go 3nm in 2023 8/1/2022
The company expects to join much larger fabless companies with the world’s first 3nm test chips early next year.
Samsung see weakness in Smartphone and PC sales ahead 7/29/2022
Samsung Electronics Co Ltd (005930.KS) cautioned chip demand from smartphone and PC makers would weaken further as people shop less, and that the more resilient demand from server clients may also see adjustments amid recession worries.
The Americas outspent the world in chip R&D during 2021 7/29/2022
The Americas are still the globe's biggest investors into semiconductor R&D. According to updated global data from IC Insights, the Americas in 2021 led with their 55.8% slice of the total $80.5 billion sunk into technological research and development.
Qualcomm reported less robust Q3 sales 7/29/2022
Qualcomm said it expected between $3 and $3.30 in earnings per share during the fourth quarter on between $11 billion and $11.8 billion in sales, falling short of Wall Street’s Q4 earnings expectations of $3.23 per share and $11.87 billion in sales
Applied Materials signs MOU to create training courses for Singapore employees 7/29/2022
The initiative underscores the importance of building and maintaining a future-ready talent pipeline in Singapore to serve the global semiconductor industry.
Kioxia Holdings and Western Digital Corp (WDC.O) to get $680 million from the Japanese government 7/28/2022
The subsidy is part of a broader effort to revive chip production in Japan, as tensions between China and the United States and COVID-19 pandemic disruptions spur concern that Japanese companies such as automaker Toyota Motor Corp (7203.T) could be hobbled by semiconductor shortages.
India’s power demand set to surge 6% 7/28/2022
India’s power demand is seen growing over 6% for the second straight fiscal year, and above the pre-pandemic levels and the long-period average growth of 5%. This trend of above-average growth could continue for two more fiscals.
Cadence Design Systems help Samsung Achieve 2X Productivity on Large-scale Analog IP 7/28/2022
Samsung Foundry has deployed Cadence Design Systems Inc.’s Spectre FX Simulator for FastSPICE-based verification of their large-scale analog and mixed-signal IP on 3nm, 4nm and 5nm processes.
An international research team created a 2.8nm transistor 7/28/2022
WPI-MANA has used a transmission electron microscope (TEM) to create a 2.8nm transistor consisting of nanochannels embedded in metallic carbon nanotubes (CNTs), which exhibits quantum transport at room temperature.
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