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Micron to build a new DRAM plant in Japan 10/21/2021
The new chip fab will produce advanced DRAM for the data center, as the company is shifting focus away from the consumer market after selling its 3D XPoint fab to Texas Instruments.
GlobalFoundries to IPO on Nasdaq for $47 billion 10/21/2021
GloFo is to sell 33 million shares and major shareholder Mubadala is to sell 22 million shares for between $42 and $47 a share in an attempt to raise $2.6 billion.
Bit demand in DRAM to increase while revenue will stay flat 10/21/2021
Total DRAM bit supply is projected to grow by 17.9% in 2022. DRAM bit demand to increase by 16.3% in 2022. DRAM revenue for 2022 will likely be mostly flat.
Gallium arsenide (GaN) technology has taken opportunity to grow in automotive electronic 10/21/2021
For example, Kubos Semiconductor is developing a new material called cubic GaN. “It’s the cubic form of gallium nitride and we can not only produce it on large-scale wafers — 150 mm and above — but potentially, they can scale to higher wafer sizes and can slot seamlessly into existing production lines,”
Wolfspeed, formerly Cree, gets design win to suppply SiC wafer for GM EV productions 10/20/2021
Wolfspeed, formerly Cree, kicked off its rebranding with a major design win: A supply chain agreement with GM to develop and produce silicon carbide (SiC) semiconductors for the automaker’s EVs. In August,
Alibaba shows home grown ARM based server chip 10/20/2021
Alibaba Cloud has revealed a home-grown CPU for servers, based on the Arm architecture, that it has already deployed powering its cloud services.
Apple shows off its in house developed M1 and M1 Pro system in a chip 10/20/2021
The M1 had been widely successful for Apple, showcasing fantastic performance at never-before-seen power efficiency in the laptop market. Although the M1 was fast, it was still a somewhat smaller SoC – still powering devices such as the iPad Pro line-up, and a corresponding lower TDP, naturally still losing out to larger more power-hungry chips from the competition.
China runs behind on Semiconductor due to shortage of talent pool 10/20/2021
China faces a chronic shortage of scientific and engineering talent that may hamper its efforts to become a semiconductor superpower and reduce its reliance on imported chips, according to industry figures.
Rambus announced sampling of DDR5 server memory modules 10/19/2021
This level of performance, according to the company, represents a 17% increase in data rate over the first-generation 4800 MT/s DDR5 RCD. With the addition of a number of key innovations, Rambus has been able to deliver 5600 MT/s performance at lower latency and power while optimizing timing parameters for improved RDIMM margins.
NGK Insulators plans European plant switch to renewable energy 10/19/2021
NGK Ceramics Europe in Belgium will use completely green power, “procuring electricity generated through wind power as well as generating power by installing solar panels on its site”
New JEDEC Standard making it easier to change out flash memory soldered into connected devices applications 10/19/2021
The JEDEC Solid State Technology Association has released its first iteration of the Crossover Flash Memory (XFM) Embedded and Removable Memory Device (XFMD) standard. The spec outlines a new universal data storage media providing an interface between NVM Express (NVMe) and PCI Express (PCIe) in a small, thin form factor.
Component shortage slows smartphone market 10/19/2021
Global smartphone shipments fell by 6% in the third quarter of 2021 as vendors struggled to meet demand for devices amid component shortages, according to market analyst Canalys.
Israeli AI chip startup Hailo has raised $136 million in a Series C funding 10/18/2021
Hailo’s latest cash infusion will be used to continue building its software offering and support teams. The company has expanded its presence globally over the last year, opening offices in Tokyo, Taipei, Munich and Silicon Valley.
Samsung Foundry to offer GAA process by 2022 10/18/2021
amsung is being most aggressive pursuing the next generation of transistor technology, with plans to reach mass production ahead of TSMC and Intel. Samsung’s 3-nanometer process will use the gate-all-around (GAA) transistor structure, which the foundry calls MBCFET (Multi-bridge channel FET) and will be in production first half of 2022.
DRAM prices projected to be in downswing 10/18/2021
DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in the fourth quarter of 2021 at a quarter-on-quarter (QoQ) decline of 3-8%, according to TrendForce. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices.
China and Taiwan combine now controls 37% of semiconductor global capacity 10/18/2021
As of December 2020, Taiwan held the largest share of IC industry capacity of any country or region in the world. Moreover, if combined, the share of IC capacity within the borders of China and Taiwan would represent about 37% of global IC capacity, about 3x the amount of IC capacity located in North America.
AMD offers new $329* Radeon RX 6600 graphics card 10/15/2021
The graphics card that should be available at Amazon, Best Buy, Micro Center and the Newegg Shuffle starting as soon as the very moment we published this story at 9AM ET. Given how exorbitant GPU prices have been during the global chip crunch, you should probably stop reading if you want one and get with the clicking.
Electronic waste to weigh 57 million tonnes this year 10/15/2021
According to a 2019 report by the World Economic Forum, the world's electronic waste has a material value of $62.5 billion (£46 billion) - more than the GDP of most countries.
After all, Taiwan still leads Korea in advanced note processing 10/15/2021
Taiwan by far holds the largest share of leading-edge (i.e., <10nm) IC capacity (63%) of any country in the world. South Korea, represented by Samsung, holds the remaining 37%.
Demand for automotive electronics to drive volume up for power wafers 10/15/2021
Installed capacity for the power and compound fab industry grew 5% in 2019 and 3% in 2020 before surging 7% in 2021, SEMI said. Growth is projected to remain strong at 6% in 2022 and 5% in 2023 as the industry tops the 10 million WPM mark.
Yangtze Memory Technologies license Xperi’s DBI hybrid bonding technology to package NAND devices 10/14/2021
“Xperi’s DBI hybrid bonding is a key enabling technology for current and future generations of high performance, high-capacity 3D NAND flash memory,” said Craig Mitchell, president of Invensas, a wholly owned subsidiary of Xperi.
Samsung mass producing 14nm DDR5 DRAM using 5 layer EUV technology 10/14/2021
Following the company’s shipment of its first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today’s DDR5 devices.
MediaTek posted record highs 10/14/2021
MediaTek recorded NT$47.91 billion (US$1.7 billion) for its September sales, which represents an 11.9% increase from August figures, and a 26.51% year-on-year change. Third-quarter 2021 revenue came in at NT$131.07 billion, a 4.31% bump compared to Q2 results.
Senator Elizabeth Warren called for breaking up Amazon.com 10/14/2021
Investigation showed the e-commerce giant had copied products and rigged search results in India. Meanwhile, a bipartisan group of U.S. lawmakers plans to introduce a bill that would bar Big Tech platforms from favoring their products and services.
Semiconductor merger and acquisition to reach $22 Billion this year 10/13/2021
Pace of semiconductor acquisition agreements fell back over the next five months of 2021, putting this year’s total M&A value at $22 billion for the January-August period, according to IC Insights’ September Update of the 2021 McClean Report.
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