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| FMC, Neumonda introduce DRAM+ technology |
4/9/2025 |
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Ferroelectric Memory Co. has partnered with Neumonda to produce DRAM+, a nonvolatile memory using ferroelectric hafnium oxide, in Germany. The technology combines DRAM performance with solid-state drive-like data retention, targeting applications in AI, automotive and industrial sectors. Neumonda will support with advanced testing systems, aiming to revive semiconductor capabilities in Europe.
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| YMTC patents highlight advances in 3D NAND technology |
4/8/2025 |
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Yangtze Memory Technologies has published almost 20 patents for processes to enhance computing efficiency and optimize chip stacking, showcasing its technological prowess in 3D NAND. The patents include innovations in stacking structures, electromagnetic interference shielding and data refreshing methods
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| GUC debuts HBM4 IP with advanced monitoring |
4/8/2025 |
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Global Unichip has completed the first tape-out of an HBM4 controller and PHY IP, using Taiwan Semiconductor Manufacturing Co.'s N3P process and CoWoS-R packaging. The HBM4 IP supports data rates up to 12 Gbps, offering 2.5 times the bandwidth of HBM3, and integrates proteanTecs' monitoring for enhanced reliability.
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| US Investment Accelerator seeks to revamp CHIPS deals |
4/8/2025 |
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President Donald Trump has signed an executive order to create the US Investment Accelerator, aiming to negotiate better deals under the CHIPS and Science Act. Commerce Secretary Howard Lutnick will oversee the initiative, which could alter environmental protections and increase private contributions for fab construction.
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| UMC Inaugurates New Fab in Singapore |
4/7/2025 |
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The new facility is equipped for manufacturing with UMC's 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore's semiconductor sector.
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| Intel, TSMC plan US manufacturing JV |
4/7/2025 |
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Intel and Taiwan Semiconductor Manufacturing Co. have reportedly reached a preliminary agreement to form a joint venture to operate Intel's US fabs, with TSMC owning 20%, according to The Information. The US government is said to have influenced the deal to stabilize Intel amid operational challenges.
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| AMD closes ZT Systems acquisition, eyes end-to-end AI offerings |
4/4/2025 |
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CEO Lisa Su says the deal addresses the need for comprehensive AI solutions, integrating hardware, software and systems. Former ZT executives Frank Zhang and Doug Huang have joined AMD to lead manufacturing divestiture and data center platform engineering.
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| Taiwan tariff to spare semiconductors |
4/4/2025 |
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The White House has clarified that a 32% import tariff on Taiwan will not apply to semiconductors. News of the tariff initially caused concern for companies such as Nvidia, Qualcomm, and Advanced Micro Devices, which rely on Taiwan Semiconductor Manufacturing Co
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| Altera starts production shipments of the Agilex 7 FPGA M-series |
4/3/2025 |
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Altera has begun production shipments of the Agilex 7 FPGA M-series, which includes integrated high-bandwidth memory and DDR5 and LPDDR5 support. The field-programmable gate array, which offers over 3.8 million logic elements, is designed for applications requiring high performance and memory bandwidth, such as AI, 5G infrastructure and data centers.
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| Intel CEO Tan sees equal priority on both design and foundry |
4/3/2025 |
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Intel CEO Lip-Bu Tan has affirmed a commitment to maintaining Intel's dual focus on chip design and foundry services, addressing concerns about potential changes. Tan highlighted plans for domestic production in line with government initiatives, discussed product milestones and outlined plans to retain and recruit top engineering talent.
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| US may target CHIPS Act grants to up investments |
4/3/2025 |
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Commerce Secretary Howard Lutnick is considering withholding CHIPS and Science Act grants to encourage major chipmakers to invest more in US manufacturing, Bloomberg reports. Lutnick might also expand a 25% tax credit under the act, which would require approval by Congress. President Donald Trump has been critical of the CHIPS Act and signed an executive order to boost corporate investment in the US. Samsung Electronics and SK Hynix are among the chipmakers that are unsure about the receiving the subsidies
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| UMC Inaugurates New Fab in Singapore |
4/2/2025 |
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The new facility is equipped for manufacturing with UMC's 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore's semiconductor sector.
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