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Nvidia tipped to top chipmaker R&D spending in 2026 9/8/2025
TechInsights expects Nvidia’s R&D spending to top Intel’s in 2026, as the loss-making chipmaker trims outlay while the AI leader continues to boost investment.
New 3D-stacked memory tech seeks to dethrone HBM for AI inference 9/8/2025
HBM may soon be edged out in some use cases
OpenAI Announces Hiring Platform, Will Use AI to Match Companies With Talent 9/8/2025
The company is also working on a certification program designed to assure employers that candidates are skilled in using its tools.
China’s Focus on LFP Batteries Now Paying Off 9/5/2025
The leadership is not accidental but the result of a "very smart" long-term strategy, initiated over ten years ago, to prioritize Lithium Iron Phosphate (LFP) batteries.
Amkor relocates $2B semiconductor facility to larger Arizona site 9/5/2025
After delays and pushback from local residents, the company is moving forward with construction in the coming days. Production is set to begin in early 2028.
Standards Development Lags HBM Innovation and Uptake 9/4/2025
Demands of hyperscalers and GPU makers are putting pressure on HBM makers to rapidly innovate with custom solutions.
SK hynix Introduces Industry's First Commercial High NA EUV 9/4/2025
SK Hynix debuts high-NA EUV system for DRAM production.
TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs 9/4/2025
The change comes as U.S. lawmakers advance the Chip EQUIP Act, a proposal that would prohibit companies receiving American subsidies from buying tools from “foreign entities of concern,” including Chinese firms such as AMEC and Mattson Technology.
Amkor details $2B packaging, test facility in Ariz. 9/4/2025
Amkor Technology has unveiled plans to build an advanced packaging and test facility in Peoria, Ariz., with production slated to begin in early 2028.
Toshiba debuts 650V SiC MOSFETs with TOLL packaging 9/3/2025
Toshiba has introduced three industrial 650V silicon carbide metal-oxide-semiconductor field-effect transistors in TO-leadless packaging, with on-resistance as low as 27 milliohms. The TOLL package, a nine-pin, four-terminal design, reduces switching losses by minimizing parasitic impedance.
Samsung R&D investment up 71%, tops semiconductor firms 9/3/2025
Despite Challenges, Samsung Invests Heavily to Compete with TSMC and Intel
TSMC to break ground on 1.4nm fab next month 9/3/2025
This facility will house four plants, with the initial fab slated to begin trial production by the end of 2027 and volume production in H2 2028.
TSMC reportedly cuts Chinese chipmaking tools from 2nm fabs 9/3/2025
law makers move forward with the Chip EQUIP Act to restrict purchases from "foreign entities of concern." TSMC is also auditing Taiwanese suppliers, focusing on exposure to China and profit margins.
Apple’s Entry Expected to Increase Foldable Phone Penetration Beyond 3% by 2027 9/2/2025
The anticipated launch of Apple's first foldable device in the second half of 2026 is expected to lift foldable phone penetration to over 3% in 2027.
Keysight Launches Physical Layer Compliance Test Solution for HDMI 9/2/2025
Keysight's test solution for HDMI addresses the growing complexity, and bandwidth demands of modern HDMI applications.
What SoftBank’s Investment in Intel Means 9/2/2025
Masayoshi Son's stress on advanced semiconductor manufacturing tilts the balance of this deal in favor of Intel's foundry business.
NAND Flash Revenue Surged Over 20% in 2Q 2025 9/1/2025
The NAND flash industry posted solid growth in 2Q 2025 despite slight declines in ASP, according to TrendForce.
J&J earmarks $2B for Fujifilm’s North Carolina facility 9/1/2025
The 10-year deal will expand the biopharma giant’s capacity to better meet U.S. demand for advanced medicines and create 120 jobs for the Raleigh area.
Qualcomm to add Single Photon Active Sensor tech to Snapdragon 9/1/2025
Qualcomm plans to integrate VoxelSensors' Single Photon Active Event Sensor technology into the Snapdragon AR2 Gen 1 Platform to enhance 3D sensing for robotics and extended-reality applications. The SPAES sensors can detect single photons and generate high-resolution 3D data at a rate of up to 100 million points per second.
Semiconductor industry faces water, sustainability challenges 9/1/2025
The boom in chip manufacturing has also increased demand for ultra-pure water. Fabrication plant operators are investing in ways to mitigate water usage, but are still reclaiming a small percentage of it in their operations.
Tata Electronics and Bosch to Collaborate on Chip Packaging, Manufacturing 8/29/2025
Tata Electronics and Bosch will collaborate on several key areas within the electronics and semiconductor industries.
Nvidia's Huang meets Samsung, SK leaders at US summit as HBM battle escalates 8/29/2025
The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won. The encounter underscored the rising importance of high-bandwidth memory (HBM) and cross-border semiconductor investment in the intensifying global AI race.
Nvidia posts record $46.7B revenue in Q2 8/29/2025
Nvidia has $46.7bn Q2 forecasts $54bn Q3In the quarter to the end of July, Nvidia had sales of $46.7 billion which was 56% up y-o-y – the smallest y-o-y percentage increase for two years
Renesas MCU Features Advanced Security and Targeted Peripheral Set 8/28/2025
Renesas' RA4C1 offers ultra-low power consumption, advanced security features, abundant communication interfaces, and segment LCD support.
Hyundai boosts US investments to $26B through 2028 8/28/2025
The automaker aims to significantly expand its domestic manufacturing footprint, including steel production and robotics.
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