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| AMD closes ZT Systems acquisition, eyes end-to-end AI offerings |
4/4/2025 |
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CEO Lisa Su says the deal addresses the need for comprehensive AI solutions, integrating hardware, software and systems. Former ZT executives Frank Zhang and Doug Huang have joined AMD to lead manufacturing divestiture and data center platform engineering.
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| Taiwan tariff to spare semiconductors |
4/4/2025 |
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The White House has clarified that a 32% import tariff on Taiwan will not apply to semiconductors. News of the tariff initially caused concern for companies such as Nvidia, Qualcomm, and Advanced Micro Devices, which rely on Taiwan Semiconductor Manufacturing Co
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| Altera starts production shipments of the Agilex 7 FPGA M-series |
4/3/2025 |
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Altera has begun production shipments of the Agilex 7 FPGA M-series, which includes integrated high-bandwidth memory and DDR5 and LPDDR5 support. The field-programmable gate array, which offers over 3.8 million logic elements, is designed for applications requiring high performance and memory bandwidth, such as AI, 5G infrastructure and data centers.
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| Intel CEO Tan sees equal priority on both design and foundry |
4/3/2025 |
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Intel CEO Lip-Bu Tan has affirmed a commitment to maintaining Intel's dual focus on chip design and foundry services, addressing concerns about potential changes. Tan highlighted plans for domestic production in line with government initiatives, discussed product milestones and outlined plans to retain and recruit top engineering talent.
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| US may target CHIPS Act grants to up investments |
4/3/2025 |
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Commerce Secretary Howard Lutnick is considering withholding CHIPS and Science Act grants to encourage major chipmakers to invest more in US manufacturing, Bloomberg reports. Lutnick might also expand a 25% tax credit under the act, which would require approval by Congress. President Donald Trump has been critical of the CHIPS Act and signed an executive order to boost corporate investment in the US. Samsung Electronics and SK Hynix are among the chipmakers that are unsure about the receiving the subsidies
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| UMC Inaugurates New Fab in Singapore |
4/2/2025 |
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The new facility is equipped for manufacturing with UMC's 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore's semiconductor sector.
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| Japan's Rapidus begins test production of 2nm chips |
4/2/2025 |
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Rapidus, a Japanese state-backed semiconductor company, has started test production of next-generation chips, aiming to mass-produce 2-nanometer semiconductors by 2027. The initiative, supported by $11.5 billion in government funding, seeks to reduce Japan's reliance on foreign technology. Rapidus used ASML Holding's extreme ultraviolet lithography for the first time; test chips are expected by July.
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| GlobalFoundries eyes merger with UMC |
4/2/2025 |
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GlobalFoundries is considering a merger with United Microelectronics Corp. to strengthen its position in mature and specialty process technologies, according to reports. The "Project Ultron" initiative reportedly aims to develop a major player in chip production but faces regulatory, financial and political hurdles. UMC has denied the reports.
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| Apple M6 Chip to Feature Built-In Modem for Macs by 2027 |
4/1/2025 |
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Apple has started designing the M6 chip, set for a 2027 release, which will feature an in-house cellular modem for Macs, according to reports. This move aims to reduce reliance on Qualcomm, whose chips are used in current Macs.
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| 12-channel LED driver targets automotive lighting |
3/31/2025 |
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Nexperia has unveiled the AEC-Q100-qualified NEX13120FPC-Q100, a 12-channel LED driver designed for automotive lighting applications. The driver supports ASIL-B compliance and features a low dropout voltage, reducing operating temperatures by 5 C. It offers phase-shift pulse width modulation dimming and can handle data rates up to 2 megabits per second.
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| Smaller Surface PCs may arrive soon with Snapdragon chips inside |
3/28/2025 |
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Microsoft is reportedly preparing to launch a new line of smaller Surface devices, including a Surface Pro tablet and Surface Laptop, potentially in alignment with its 50th anniversary. It is speculated the 12-inch devices will feature Snapdragon chips, maintaining Microsoft's use of the Qualcomm Snapdragon X platform for consumer products.
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| Broadcom, Astera tackle PCIe 6.0 complexity for AI |
3/28/2025 |
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Broadcom and Astera Labs are addressing the complexities of PCIe 6.0, which is driven by AI workloads. Broadcom has introduced a PCIe 6.0 portfolio, including an Interop Development Platform, and is collaborating with Micron and Teledyne LeCroy. Astera Labs has expanded its Cloud-Scale Interop Lab to test Scorpio Smart Fabric switches.
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