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| Micron Ships Industry’s Fastest 11 Gbps HBM4 Modules |
9/26/2025 |
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Micron has confirmed shipping the industry's fastest 11 Gbps HBM4 DRAM to customers & TSMC partnership for next-gen HBM4E. Micron Says It Has Outperformed The Competition With Its 11 Gbps HBM4 Memory, Will Partner With TSMC For HBM4E DRAM
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| TSMC, partners target chip energy efficiency with AI |
9/26/2025 |
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Taiwan Semiconductor Manufacturing Co. has partnered with electronic design automation companies to use AI to improve the energy efficiency of AI chips by a factor of 10. TSMC is working closely with Cadence Design Systems and Synopsys, which have released AI-powered software tools to aid this process.
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| IBM and AMD to Collaborate on Quantum-centric Supercomputing |
9/25/2025 |
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Last week, technology giants IBM and Advanced Micro Devices announced a landmark partnership to develop the next generation of computers, signaling a significant industry shift toward a hybrid future that marries the strange power of quantum mechanics with the brute force of today’s most powerful supercomputers. The collaboration aims to build what the companies call “quantum-centric supercomputing,”
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| MediaTek reportedly could use TSMC's Arizona fab to avoid tariff fallout |
9/24/2025 |
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MediaTek is considering producing chips in the US through Taiwan Semiconductor Manufacturing Co.'s Arizona fab to meet customer demands for locally manufactured components and to avoid potential tariffs, Nikkei reports. US production could help MediaTek address logistical and policy-related concerns.
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| Will Trump's $100K H-1B Fee Gut Silicon Valley? |
9/24/2025 |
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Trump insists major tech firms are 'very happy' to pay more than 10 times what they're paying now for foreign workers. Will companies adjust their budgets or try to find Americans to fill the jobs?
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| PCIe 8.0 Expected to Deliver 256 GT/s |
9/22/2025 |
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Anticipated to arrive by 2028, the PCI-SIG's PCIe 8.0 spec will likely double bandwidth to 256 GT/s to drive next-gen future applications.
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