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| Space-grade NOR flash for FPGA configuration |
11/20/2024 |
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“The device offers a 133MHz quad serial peripheral interface and the highest density, radiation and single-event effects performance available in a QML-qualified non-volatile memory for use with space-grade FPGAs and microprocessors,”
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| Samsung foundry eyes Qualcomm and Nvidia for 2nm and 3nm orders |
11/20/2024 |
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Industry reports from South Korea indicate that low yield rates in Samsung's foundry operations have impeded recent AP advancements. However, the introduction of the 2nm process could mark a turning point. The company plans to integrate the Exynos 2600 into its Galaxy S26 smartphones, departing from its previous strategy of using both Exynos and Qualcomm chips based on market requirements.
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| Hynix to sample HBM3e 16hi in H1 2025 |
11/19/2024 |
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With HBM4 12hi starting in the second half of 2025, Hynix’s move to add a 16hi option within the HBM3e family could be because TSMC’s CoWoS-L packaging technology is expected to support larger package sizes between 2026 and 2027, allowing for more HBM stacks per SiP.
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| Global GPU market to hit $100 billion in 2024 |
11/19/2024 |
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Demand for these units is increasing rapidly. As a result, the revenue of GPU developers is growing, and this year the global GPU market is expected to exceed $98.5 billion, according to Jon Peddie Research.
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| MRDIMMs double bandwidth and reduce latency for Xeon 6 |
11/19/2024 |
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Intel is highlighting multiplexed rank dual inline memory modules for its Xeon 6 platform, noting that the modules' double bandwidth reduces latency and maintains compatibility with existing server infrastructure. NEC plans to use the MRDIMMs in an upcoming supercomputer.
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| Samsung, SK to unveil supercomputer chips at SC24 |
11/15/2024 |
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SK Hynix and Samsung Electronics are expected to introduce supercomputer chips at the upcoming Supercomputing 24 conference. SK Hynix is debuting an accelerator card for large language models using its GDDR6-AiM chip. Samsung is focusing on Compute Express Link products, including the CXL Memory Module-DRAM.
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| Canadian Chip Manufacturing Needs Industrial Policy |
11/14/2024 |
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In a recent virtual chat, Hudson Valley FastFab chair and CEO Dick Thurston and Jim Bark, partner with DNA Global, discussed the key ingredients necessary for Canada to ramp up its semiconductor manufacturing capabilities as they look to build a mature node fab in Canada.
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