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DRAM Prices to Continue Rising in 4Q 2025 10/28/2025
Conventional DRAM prices are expected to rise by 8–13% on quarter in 4Q 2025. When HBM is included, the increase could widen to 13-18%.
Infineon Launches Secured Prepaid Tag Solutions for Gift Cards 10/28/2025
Infineon's latest security solutions replace visible codes, barcodes, or magnetic stripes with a secured chip using cryptographic mechanisms.
Tariffs anxiety prompts US importers to place spring orders early 10/28/2025
Small importers for large U.S. retailers rushed in China-made strollers and wares meant for spring and are storing the goods in their own warehouses to avoid the big tariff bills that had been threatened over the next month.
Trump to raise Canada tariffs by 10% 10/28/2025
The announcement comes days after trade talks with Canada were suspended over an anti-tariff TV ad featuring parts of a 1987 speech by then-President Ronald Reagan.
Intel’s Q3 earnings surge following US government investment 10/27/2025
Intel’s turnaround efforts gained momentum in the third quarter, marked by billion-dollar investments from the U.S. government, Nvidia and Softbank Group, underlying strength from its semiconductor business, ongoing layoffs, restructuring and more.
UMC introduces 55nm BCD platform for power management 10/27/2025
United Microelectronics Corp. has unveiled a 55-nanometer bipolar-CMOS-DMOS platform that targets the performance and power efficiency of next-generation devices across various sectors. The platform features three process variants: Non-Epitaxy for cost-effective power efficiency, Epitaxy for automotive applications up to 150V, and Silicon-on-Insulator for industrial and high-grade automotive systems.
UMC introduces 55nm BCD platform for power management 10/27/2025
United Microelectronics Corp. has unveiled a 55-nanometer bipolar-CMOS-DMOS platform that targets the performance and power efficiency of next-generation devices across various sectors. The platform features three process variants: Non-Epitaxy for cost-effective power efficiency, Epitaxy for automotive applications up to 150V, and Silicon-on-Insulator for industrial and high-grade automotive systems.
Amazon Reveals Cause of Major AWS Internet Outage Earlier Last Week 10/27/2025
Millions around the world found themselves unable to access popular services thanks to a Domain Name System issue with Amazon Web Services.
SE Asia Production Capacity Expansion to Fuel Global Notebook Shipment Growth in 2025 10/24/2025
Despite challenges from geopolitical tensions and tariff uncertainties, the global notebook market is showing signs of recovery in 2025.
Texas Instruments’ earnings outlook stirs confusion, signals soft demand 10/24/2025
A number of Wall Street analysts identified a “tone” shift in how executives were describing where Texas Instruments was in the semiconductor recovery cycle compared to Q1, raising questions about what happened to change the messaging.
Chipmaker CXMT eyes US$42 billion Shanghai listing, sources say 10/24/2025
IPO plans come as China’s semiconductor stocks surge, with the benchmark CSI CN semiconductor index rallying 49 per cent year-to-date
Amazon Reportedly Wants Robots to Replace 600,000 Human Hires 10/24/2025
Amazon's robot push promises to cut costs and automate operations at warehouses, according to The New York Times. Amazon says it's a 'misleading picture of our plans.'
Eos Energy to spend $353M to establish factory, relocate HQ to Pittsburgh area 10/23/2025
The project will create at least 735 jobs and retain 265 positions, according to the release. It also brings Eos geographically closer to new strategic partner Talen Energy Corporation, which plans to partner with the battery maker to develop storage capacity for artificial intelligence infrastructure across Pennsylvania.
Samsung, SK hynix showcase latest HBM4 chips at 2025 SEDEX 10/23/2025
SK Hynix and Samsung Electronics touted their latest high-bandwidth memory chips at the 2025 Semiconductor Exhibition in Seoul. SK Hynix is getting ready for mass production of HBM4, while Samsung is hoping to regain its competitive edge with its new HBM4 lineup.
JEDEC says SOCAMM2 compact DRAM module for AI servers boasts higher speeds and broader compatibility 10/23/2025
JEDEC is nearing completion of the SOCAMM2 memory standard, which is based on Nvidia's design but expanded for broader industry adoption. SOCAMM2 uses LPDDR5X memory and offers higher transfer rates of up to 9,600 megatransfers per second.
NASA Reopens Lunar Lander Contract, and Elon Musk Is Big Mad 10/23/2025
Acting Administrator Sean Duffy calls out SpaceX’s Starship for falling 'behind schedule,' and suggesting that Blue Origin could get astronauts there first.
SpaceX Expands 'Free' Starlink Dish Offer Across US 10/22/2025
In some parts of the US, SpaceX is also offering free professional installation. But You Don't Actually Own It.
After an ICE Raid in Rural Georgia, Hyundai Keeps Betting on America 10/22/2025
Hyundai hoped the facility, in Ellabell, would become a shining example of car assembly, an image that also aligns with President Trump’s desire to re-industrialize the nation.
Nvidia still needs Taiwan even as TSMC ramps Blackwell production in Arizona 10/22/2025
AI arms dealer relies on Taiwanese advanced packaging plants for top-specced GPUs
Chipmind Agents target chip design tasks with automation 10/22/2025
Chipmind has introduced Chipmind Agents, AI agents designed for the automation and optimization of complex chip design and verification tasks by integrating into existing workflows and adapting to proprietary EDA tools. "Our 'design-aware' agents are engineered to holistically understand the entire chip context, not just the surrounding tools," says CEO Harald Kröll.
Arm releases vendor-neutral chiplet standard for autos 10/21/2025
Arm has introduced a vendor-neutral version of its Foundation Chiplet System Architecture through the Open Compute Project to set standards for chiplet integration. The architecture is designed to deliver data center-level performance for vehicles integrating advanced driver-assistance systems and advanced in-cabin experiences. Arm is collaborating with BMW, LG Electronics and imec on the initiative.
US Senate passes measure that limits Nvidia and AMD’s AI chip exports to China 10/21/2025
The Senate action follows a Trump administration deal this summer with Nvidia and AMD to ease China export restrictions
Wireless Power Eliminates Batteries for IoT Devices 10/21/2025
Energous’ transmitters deliver power to IoT devices that no longer need batteries.
Intel’s CEO Lip-Bu Tan Meets Saudi Official For a Potential Chip Partnership 10/21/2025
Intel CEO Lip-Bu Tan recently met with Saudi Minister of Communications and Information Technology Abdullah Al-Swaha to discuss a potential partnership in semiconductors and AI, according to reports. Saudi Arabia and UAE, meanwhile, are shifting their economic focus toward technology.
TI President and CEO Haviv Ilan Succeeds Rich Templeton as Chairman of the Board 10/20/2025
Haviv Ilan succeeds Rich Templeton, who will retire at the end of 2025 after a 45-year career with the company.
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