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| Apple adds new suppliers to boost US component production |
3/30/2026 |
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Apple has expanded its American Manufacturing Program by partnering with Bosch, Cirrus Logic, TDK and Qnity Electronics to produce iPhone components domestically. Apple has earmarked $400 million through 2030 for the new partners. The components will be sent overseas for assembly; iPhones will not be assembled in the US.
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| Intel releases Xeon 600, Panther Lake CPUs with vPro |
3/27/2026 |
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Intel has launched the Xeon 600 central processing units and Core Ultra Series 3 processors, also known as Panther Lake, featuring the updated vPro platform. The Xeon 600, with up to 86 cores, supports up to 4TB of ECC memory, while the Core Ultra Series 3, certified for business use, includes the NPU 5 AI accelerator and the Xe3 iGPU.
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| Samsung Secures Exclusive HBM4 Supply Deal with OpenAI |
3/23/2026 |
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Samsung Electronics has secured a deal to exclusively supply sixth-generation high-bandwidth memory, known as HBM4, to OpenAI, according to reports. OpenAI intends to integrate the HBM4 into its AI semiconductor Titan, which is expected to be released later this year.
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| Imec installs ASML's litho tool for sub-2nm chip development |
3/23/2026 |
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Imec has installed the ASML EXE:5200 high-numerical-aperture extreme ultraviolet lithography system, offering partners early access to advanced chip-scaling technologies. The tool, integrated with patterning and metrology tools, advances sub-2-nanometer logic and high-density memory, supporting AI and high-performance computing.
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