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| U.S. data center power demand could reach 106 GW by 2035 |
12/9/2025 |
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BloombergNEF’s latest forecast is 36% higher than its previous prediction, released in April. The jump is due in part to the higher average size of the 150 significant U.S. data center projects announced in the past year, over a quarter of which are larger than 500 megawatts, BNEF said.
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| Samsung 4nm process gains traction with 60% to 70% yield |
12/9/2025 |
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Samsung Electronics' 4-nanometer process has reached a yield improvement of 60% to 70%, which has reportedly secured a $100 million order from Tsavorite Scalable Intelligence for an omni processing unit. The yield improvement marks a turning point for Samsung's foundry business, and the order is expected to contribute to Samsung's goal of making its foundry business profitable by 2027.
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| Microsoft reportedly eyes Broadcom for custom chips |
12/9/2025 |
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Microsoft is considering moving its custom chip business to Broadcom from Marvell Technology, according to a report. Microsoft could potentially collaborate with Broadcom to develop next-generation chips that support AI projects. The shift could provide Broadcom with a long-term revenue stream and bolster its position in the AI infrastructure supply chain.
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| TSMC accelerating Ariz. packaging for US-made chips |
12/9/2025 |
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Taiwan Semiconductor Manufacturing Co. is accelerating the construction of an advanced packaging site in Arizona, potentially making "all-American" chips a reality by the end of the decade, according to a report. The facility, planned initially as part of the Fab 21 expansion, could begin tool move-in by the end of 2027.
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| UMC, Polar sign memorandum on US wafer production |
12/8/2025 |
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United Microelectronics and Polar Semiconductor have signed a memorandum of understanding to explore the manufacturing of 8-inch semiconductor wafers in the US. The partnership will join Polar's expanded facility in Minnesota with UMC's 8-inch chip portfolio and global customer network. It will target demand from the automotive, data center, consumer electronics, and aerospace and defense sectors.
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| Kerala Sets Sights on Design and IP |
12/5/2025 |
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While Gujarat boasts about OSATs and fabs, the Indian state of Kerala is charting a different path with its design-first semiconductor roadmap that focuses on chip design, testing and IP creation rather than competing to build multi-billion-dollar fabs.
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| SiTime Exploring Renesas’ $2 Billion Timing Exit |
12/5/2025 |
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SiTime is in discussions to acquire Renesas Electronics' timing components unit, in what would be SiTime's largest acquisition, according to reports. The unit, which Renesas largely inherited from Integrated Device Technology, could be valued at nearly $2 billion and includes clock generators, jitter cleaners and real-time clocks.
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| Micron Technology plans to exit the consumer DRAM market |
12/5/2025 |
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Micron Technology plans to exit the consumer DRAM market, including sales of Crucial-branded products, by February to focus on the growing demand for memory and storage in data centers driven by AI. The move aligns Micron's "business to secular, profitable growth vectors in memory and storage," the company says.
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| The Chip Industry’s Future Equilibrium |
12/4/2025 |
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The notion of balance between performance and purpose, innovation and sustainability, is fast becoming the defining narrative of the global semiconductor sector.
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| Samsung touts 96% lower-power NAND design |
12/3/2025 |
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Researchers investigate design based on ferroelectric transistor and demonstrate FeFET-based 3D NAND cells with near-zero pass voltage and up to five bits per cell.
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| Global growth is holding up better than expected |
12/2/2025 |
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Global growth is holding up better than expected as an artificial intelligence investment boom helps offset some of the shock from US tariff hikes, the OECD said, nudging up its outlook for some major economies.
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| Micron preps $9.6B HBM plant in Japan |
12/2/2025 |
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Micron Technology plans to invest $9.6 billion in a high-bandwidth memory facility in Hiroshima, Japan, according to reports. The project, supported by up to $3.2 billion in government subsidies, is designed to address the rising demand for AI memory, potentially shifting the HBM market share in Micron's favor.
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