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| Deca, Microchip's SST partner on NVM chiplet package |
9/15/2025 |
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Deca Technologies and Silicon Storage Technology, a Microchip subsidiary, have partnered to develop a nonvolatile memory chiplet package for modular, multi-die systems. The collaboration combines Deca's M-Series fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology.
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| SK Hynix ready to mass produce HBM4 |
9/15/2025 |
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SK Hynix is set to start mass production of HBM4, a memory product for ultra-high-performance AI applications. HBM4 features 2,048 I/O terminals, doubling the bandwidth of the previous generation and improving power efficiency by more than 40%. The company has exceeded the JEDEC standard for operating speed of 8 gigabits per second, achieving 10 Gbps operating speed.
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| Synthetic diamond semiconductors could offer EU an edge |
9/12/2025 |
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Europe could gain a competitive advantage through synthetic diamond semiconductors, which offer better electrical and thermal performance compared with silicon carbide while reducing environmental impact, writes Gauthier Chicot, CEO and co-founder of Diamfab. Chicot emphasizes the importance of integrating semiconductor advancements into environmental and industrial policies to enhance energy efficiency and technological sovereignty.
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| Nvidia announces next-gen AI chips: Rubin CPX |
9/11/2025 |
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Nvidia will debut a new generation of AI chips called Rubin CPX by the end of 2026, specifically designed to manage demanding tasks like video and software generation. To address the complexities of AI workloads, Nvidia's new chips will integrate multiple processing steps, including video decoding, encoding and inference, into a single chip.
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| AMD Expands R&D Footprint in Malaysia |
9/10/2025 |
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AMD has inaugurated its new state-of-the-art office and engineering lab facility in Penang, significantly expanding its presence in Malaysia.
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| Manufacturing sees 12,000 job losses in August |
9/10/2025 |
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Transportation equipment lost more than 14,000 jobs, the most of any manufacturing sector, driven by worker strikes at Boeing, GE Aerospace and others, according to the BLS report.
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| Intel undergoes executive shake-up; Holthaus steps down |
9/10/2025 |
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Michelle Johnston Holthaus, executive vice president and general manager of the Client Computing Group at Intel Corp., speaks during the Intel AI Everywhere launch event in New York, US, on Thursday, Dec. 14, 2023. Intel Corp. announced new chips for PCs and data centers that the company hopes will give it a bigger slice of the booming market for artificial intelligence hardware. Photographer: Victor J. Blue/Bloomberg via Getty Images
Johnston Holthaus (Bloomberg/Getty Images)
Intel is undergoing another executive shake-up with the departure of Michelle Johnston Holthaus, CEO of products. She joined Intel nearly 30 years ago and took on the role of CEO of products just 10 months ago. Other executive moves include Kevork Kechichian, previously of Arm, leading Intel's Data Center Group, and Jim Johnson heading the Client Computing Group.
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| U.S. Export Waiver Revocations Put Samsung and SK hynix in Limbo |
9/9/2025 |
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The end of VEU status—materializing in 120 days—means that Intel, Samsung, and SK hynix will have to seek licenses to purchase American chip fabrication gear for their manufacturing facilities in China. It will lead to case-by-case reviews, which could take three to six months to obtain a license.
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