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| Jury awards $49.5 million to family of Boeing 737 MAX crash victim |
5/18/2026 |
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The trial, which started May 4 in a Chicago federal court, resolves one of the last remaining cases filed against Boeing by the families who lost loved ones in those crashes. It also marks only the second time Boeing has faced a civil trial related to the crashes, which killed 346 people.
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| UMC Launches 14nm eHV FinFET Platform |
5/18/2026 |
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UMC's new process boosts power efficiency and performance while reducing chip size, supporting the evolution of next-generation display technologies.
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| Micron offers 256GB DDR5 module for AI, HPC servers |
5/18/2026 |
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Micron Technology has introduced a 256GB DDR5 memory module aimed at AI servers and high-performance computing. Built on Micron's 1-gamma technology, the module reaches speeds of up to 9,200 megatransfers per second, which is over 40% faster than current modules.
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| TSMC raises 2030 chip market forecast to $1.5T |
5/18/2026 |
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Taiwan Semiconductor Manufacturing Co. has raised its forecast for the global semiconductor market, predicting it will top $1.5 trillion by 2030, driven by demand for high-performance computing and AI. TSMC plans to accelerate capacity expansion, especially for 2-nanometer processes and advanced packaging, and is expanding its manufacturing footprint in the US, Japan and Germany.
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| Xi Tells US CEOs on Trump Visit That China Will Open Up More |
5/15/2026 |
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Xi Jinping signaled China is moving toward greater openness, striking an upbeat note during his meeting with US business leaders accompanying Donald Trump as the two presidents wrapped up morning talks that featured more divisive issues like trade and Taiwan.
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| The U.S.-China Summit Signals a New Asian Order |
5/14/2026 |
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U.S. President Donald Trump and Chinese President Xi Jinping are expected to engage in strategic talks on supply chains, Taiwan, and global security issues during their May 14–15 Beijing summit.
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| imec showcases 3D CCD memory breakthrough for AI applications |
5/14/2026 |
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Imec has launched its first functional 3D charge-coupled device for memory applications, a breakthrough that could meet the increasing AI data demands. The 3D CCD device uses an indium gallium zinc oxide channel and achieves charge transfer speeds exceeding 4 MHz.
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| NASA, Microchip collaborate on next-gen spaceflight chips |
5/14/2026 |
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NASA has partnered with Microchip Technology to develop next-generation spaceflight chips, aiming to deliver processors with 100 times the computing power of current models. The chips will come in radiation-hardened and radiation-tolerant versions, supporting missions to Mars, the moon and low-Earth orbit. The system-on-a-chip design will enhance power efficiency and allow for some autonomy, and potential Earth-based applications include medical equipment and AI.
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| Chip export controls emerge as US-China summit flashpoint |
5/13/2026 |
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Export controls on semiconductors are a key point of contention as the US continues to restrict China's access to advanced AI chips, lithography equipment, and high-bandwidth memory in a bid to slow Beijing's technological progress. In response, China is tightening export management of critical minerals and accelerating its domestic semiconductor development. This tit-for-tat approach has institutionalized export controls as a central feature of the ongoing rivalry, with the summit expected to address how both sides can manage these controls to avoid escalating into broader conflict while safeguarding their strategic
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| SK hynix Turns to Intel’s EMIB Packaging as TSMC CoWoS Bottlenecks Squeeze the AI Supply Chain |
5/12/2026 |
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As the race for the AI buildout continues to intensify, a shortage in the packaging industry has led memory manufacturer SK hynix to team up with Intel for chip packaging technology. After a strong comeback under CEO Lip-Bu Tan, Intel is now aiming to expand its presence in the packaging industry. The firm and SK hynix are collaborating on 2.5D packaging technology and Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology as shortages create tightness in the current packaging supply chain.
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| TSMC, Sony partner on image sensor development |
5/12/2026 |
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Taiwan Semiconductor Manufacturing Co. and Sony have signed a nonbinding memorandum of understanding to form a partnership for next-generation image sensor development and manufacturing. The companies plan to establish a joint venture, with Sony as the majority shareholder, at Sony's new fab in Kumamoto, Japan.
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| Memory capacity issue at SK Hynix has customers scrambling |
5/11/2026 |
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Major tech companies are reportedly offering to invest in SK Hynix's chip production lines and purchase ASML's extreme ultraviolet lithography machines amid a severe memory shortage driven by AI demand. The proposals, which include funding dedicated memory production lines, are unprecedented in the memory industry.
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