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Shift to EV-only future would spell job losses, Toyota chairman warns 10/10/2024
A shift to an electric vehicle-only future would lead to job losses among those who have been working on engine-related technologies, including at the many suppliers in the sector, Toyota Motor's chairman said.
NXP Single-Chip Solution Enables Autonomous Industrial and IoT Applications 10/10/2024
NXP's Trimension SR250 integrates on-chip processing capabilities with both short-range UWB radar and secure ranging.
Foxconn to build Taiwan’s fastest AI supercomputer with Nvidia Blackwell 10/9/2024
The project, Hon Hai Kaohsiung Super Computing Center, revealed Tuesday at Hon Hai Tech Day, will be built around Nvidia’s Blackwell graphics processing unit (GPU) architecture and feature the GB200 NVL72 platform, which includes a total of 64 racks and 4,608 Tensor Core GPUs.
Samsung Electronics' Q3 earnings fall below market expectations 10/9/2024
Samsung Electronics has forecast a third-quarter operating profit of $6.76 billion, below market expectations because of weak chip demand and one-time costs. The Device Solutions division, which includes semiconductors, is a major factor in the disappointing performance. LG Electronics also has projected lower-than-expected Q3 operating profit, citing higher marketing and shipping costs.
Electronic System Design Industry Revenue Jumps 18% in 2Q 10/9/2024
ESD industry revenue increased by 18.2% to $4.69 billion in the second quarter of 2024, according to the ESD Alliance.
Worldwide Chip Sales Up 21% YoY in August 10/9/2024
“The global semiconductor market continued to grow substantially in August, hitting its highest-ever sales total for the month of August, and month-to-month sales increased for the fifth consecutive month. Year-to-year sales increased by the largest percentage since April 2022,
Reports allege job cuts around world amid growing chip concerns 10/8/2024
Reports suggest that the electronics giant is seeking to slash jobs at its global outposts, while brokerages are casting pessimistic outlooks on the company’s third-quarter earnings, stoking fears that Samsung is facing a crisis.
TSMC and Amkor link up to bring advanced packaging stateside 10/8/2024
The advanced packaging facility is set to be built in Peoria, Arizona. Notably, fan-out wafer packaging, a technology used by companies like Apple to connect memory to processors in iPhones and MacBooks, will be a focal point at the site.
Sony Semiconductor and Raspberry Pi Co-develop AI Camera 10/8/2024
Sony Semiconductor and Raspberry Pi are launching a jointly developed AI camera that is compatible with Raspberry Pi's range of SBCs.
Hybrid Bonding Technology Poised to Transform Chip Industry 10/8/2024
Hybrid bonding technology, also known as direct-bond interconnect, promises higher performance and efficiency with lower power consumption.
Global Spending on 300mm Fab Equipment to Reach 0B Over Next Three Years 10/7/2024
Worldwide, 300mm fab equipment spending is projected to grow by 4% to $99.3 billion in 2024, and further increase by 24% to $123.2 billion in 2025, surpassing the $100 billion level for the first time.
JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents 10/7/2024
JEDEC has announced the publication of the JESD406-5 LPDDR5/5X Serial Presence Detect (SPD) Contents V1.0, which outlines the content of the SPD non-volatile configuration device included in standard memory modules using LPDDR5/5X SDRAMs. This allows application software and BIOSes to determine the module capacity, speed, I/O configuration, and content revision level. The release aims to expand the market for these components and ensure consistent support for incorporating LPDDR5 devices into systems, particularly for notebook computers.
Samsung begins mass production of SSD for AI PCs 10/7/2024
Samsung Electronics has started mass production of its PM9E1 solid-state drive, designed for AI PCs. The SSD features 8th-generation V-NAND technology and a 5-nanometer-based controller for performance and power efficiency.
Texas Sues TikTok, Alleging It's Selling Children's Personal Data 10/7/2024
The lawsuit claims TikTok is violating multiple Texas laws and failing to provide adequate parental verification and controls.
DRAM & NAND Prices Witness Almost 20% Drop 10/4/2024
Manufacturers are Not Able to Sell DDR4 Memory Modules, Ultimately Creating Inventory Pressure, Which Leads To A Price Slash
Nvidia sees AI chip demand surge; partners with Accenture 10/4/2024
The collaboration reflects Nvidia's efforts to solidify its position in the AI market.
Chinese Man Ordered to Pay $1 Million to Apple for Counterfeit iPhone Scheme 10/4/2024
The court also sentences Haotian Sun and his co-conspirator to more than four years in prison for carrying out the scheme, which involved over 6,000 counterfeit iPhones.
US port workers and operators reach deal to end East Coast strike immediately 10/4/2024
US dock workers and port operators reached a tentative deal that will immediately end a crippling three-day strike that has shut down shipping on the East Coast and Gulf Coast.
ST, Qualcomm team for intelligent Wi-Fi, Bluetooth and Thread modules 10/3/2024
ST said that it plans to introduce self-contained Wi-Fi, Bluetooth and Thread wireless modules that including Qualcomm ICs
Samsung preps for industry downturn, plans global job cuts 10/3/2024
Reports suggest that the electronics giant is seeking to slash jobs at its global outposts, while brokerages are casting pessimistic outlooks on the company’s third-quarter earnings, stoking fears that Samsung is facing a crisis
Euro zone business activity contracted in September, PMI shows 10/3/2024
A PMI covering the euro zone's dominant service industry slid to 51.4 last month from 52.9 but was ahead of the 50.5 flash reading.
Biggest dockworker strike in nearly half a century 10/3/2024
Long lines of container ships are queueing up outside major US ports as the biggest dockworker strike in nearly half a century enters its third day, preventing unloading and threatening shortages of everything from auto parts to hamburgers.
First silicon-proven 3nm 24 Gbps UCIe subsystem validated 10/2/2024
Built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology this complete PHY and controller subsystem, developed in close collaboration with TSMC, is tailored for high-demand applications such as hyperscale data centres, high-performance computing (HPC), and AI.
Nvidia’s Huang Says Nuclear Power an Option to Feed Data Centers 10/2/2024
We’re going to need energy from all sources and balance the availability and the cost of energy as well as the sustainability over time.
Canon ships first nanoimprint chipmaking machine to R&D lab 10/2/2024
This Lithography technique does not require a light source, unlike ASML's complex extreme ultraviolet approach
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