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NXP sees industrial demand lifting Q2 profit 5/1/2024
NXP Semiconductors is forecasting its second-quarter profit to beat estimates on industrial demand. NXP's largest revenue share -- automotive -- is beginning to see inventory buildup.
American Battery Technology Co. starts production at lithium-hydroxide facility 5/1/2024
Sitting on 10,000 acres, the Tonopah project includes several facilities that ABTC is using to capture and process lithium hydroxide for use in lithium-ion battery cells, as well as recycle battery metal products.
2nm competition is heating up 4/30/2024
Taiwan Semiconductor Manufacturing Co., Intel and Samsung Electronics are at various stages of production on 2-nanometer processes. TSMC is ramping up production of its N2 this year with N2P planned for 2026; Intel's 18A is set for production in 2025; and Samsung has a foundry contract with a Japanese AI startup for its 2nm process.
SK Innovation losses continue for battery unit 4/30/2024
SK Innovation is slowing its battery investments after its battery unit SK On saw a $241 million operating loss in the first quarter. SK On Chief Financial Officer Kim Kyunghun says electric vehicle launches in North America are expected to drive market improvements.
Global PC Market Back in Black in 1Q 2024 4/30/2024
Global PC shipments grew by around 3% year-on-year (YoY) in the first quarter (1Q 2024) after eight consecutive quarters of declines due to demand slowdown and inventory correction,
Will MicroLEDs Revolutionize Our Screens? 4/30/2024
As we transition from LCD and OLED screens, microLED stands out as a beacon of innovation, promising unparalleled energy efficiency, luminosity and color depth.
TSMC previews A16 process in move toward HPC products 4/29/2024
Taiwan Semiconductor Manufacturing Co. is detailing the first in its A-series of process technology. The A16, named for angstroms, is seen as a move toward high-performance computing applications and will be available commercially in 2026.
TSMC adds N4C process to 4nm portfolio at a lower cost 4/29/2024
Taiwan Semiconductor Manufacturing Co. is expanding its 4-nanometer class with its N4C fabrication process, which offers fewer masking layers and a smaller die size for up to 8.5% the cost. The N4C builds on TSMC's N4P technology and features the power, performance and area sought by many clients.
Sicona to build first US battery anode plant in Southeast 4/29/2024
The company claims the expansion will make it the largest anode producer in the U.S., powering more than 3.25 million electric vehicles annually.
Jabil CEO placed on paid leave amid investigation 4/29/2024
CFO Michael Dastoor is stepping in as interim CEO amid an SEC probe into the manufacturer's corporate policies.
Qualcomm debuts Snapdragon X Plus for laptops 4/26/2024
Qualcomm, following last fall's announcement of the Snapdragon X Elite, is adding the Snapdragon X Plus to its next-generation laptop chip line. Both use a 4-nanometer process and Arm-based Oryon CPU architecture and offer 45 TOPS of machine learning performance, but the X Plus is slightly more affordable, with fewer CPU cores (10 vs. 12 in the X Elite) and lower clock speeds (3.4Ghz vs. 3.8Ghz).
SK Hynix saw operating profit, HBM chip sales increase in Q1 4/26/2024
Operating profit jumped 734 percent to 2.88 trillion won ($2.1 billion) during the January-March period. Sales rose 10 percent over the same period to 12.43 trillion won, marking an all-time high for the quarter.
FTC to ban noncompete agreements 4/26/2024
The agency said the rule, expected to take effect as soon as late August, received overwhelming public support during a comment period.
Micron lands $6.1B in CHIPS funding 4/26/2024
The chipmaker will use the money to help build semiconductor plants in New York and Idaho.
Competition expected to drive HBM prices down in the second half of 2024 4/25/2024
As Nvidia's market value plummeted, many people began to doubt that Nvidia's control of 70-80% of the AI semiconductor market advantage can be sustained. They speculate that perhaps in the second half of 2024, the HBM market will undergo a round of price adjustments.
SK Hynix putting $3.86B into DRAM chip factory 4/25/2024
SK Hynix plans to invest $3.86 billion in a new factory in South Korea by the end of next year, where it will produce dynamic random access memory chips. The M15X fab is just part of the company's domestic investments, which include the Yongin Semiconductor Cluster, which will open in 2027.
Microchip Helps Simplify Aviation Industry’s Transition to More Electric Aircraft 4/25/2024
To provide the aviation industry with a comprehensive electric actuation solution, Microchip Technology Inc. has launched a new integrated actuation power solution that combines companion gate driver boards with its expansive Hybrid Power Drive (HPD) modules in silicon carbide (SiC) or silicon technology with a power range of 5kVA to 20kVA.
SK hynix and TSMC Ink MoU on HBM Technology 4/25/2024
SK hynix and TSMC will collaborate on next-generation HBM and enhance logic and HBM integration through advanced packaging technology.
Samsung leads with mass-production of latest V-NAND 4/24/2024
Samsung Electronics is the first to mass-produce ninth-generation vertical NAND flash memory chips. Samsung the product's bit density is 50% higher than the previous generation and channel hole-etching technology allowed it to maximize the cell layer in a double-stack structure.
AI-Driven HBM Uptake is Power-Sensitive 4/24/2024
Despite its high price tag, HBM3 memory is selling fast to help power AI-focused data centers.
Tesla CEO Elon Musk wanted to lay off 20% of the company 4/24/2024
“There is nothing I hate more, but it must be done,” the Tesla CEO wrote to staff. “This will enable us to be lean, innovative and hungry for the next growth phase cycle.”
Jabil CEO placed on paid leave amid investigation 4/24/2024
CFO Michael Dastoor is stepping in as interim CEO amid an SEC probe into the manufacturer's corporate policies.
Intel taps AI to optimize chip design, reducing process time 4/23/2024
Intel claims the AI tools for optimizing SoC layouts have slashed the time required by some of the firm’s semiconductor design processes from six weeks to just "minutes."
STMicro, Rohm's SiCrystal sign new SiC wafer supply deal 4/23/2024
STMicroelectronics and Rohm's SiCrystal are expanding a supply agreement for 150 mm silicon carbide substrate wafers. The wafers will be manufactured in Germany, and the deal is expected to be worth at least $230 million.
Commerce chief points to Huawei chip as sanctions win 4/23/2024
Commerce Secretary Gina Raimondo is downplaying Huawei Technologies' latest chip as evidence US export controls on China are working. The Mate 60 Pro technology is "years behind what we have in the United States," Raimondo says.
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