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| TSMC March revenue rebounced, up 30.9% |
4/11/2019 |
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TSMC's consolidated sales for the first quarter of 2019 totaled NT$218.7 billion, down 11.8% on year and 24.5% sequentially, but meeting the company's guidance.
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| Consumer prices up 0.4% with sharp jump in gasoline |
4/11/2019 |
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The Labor Department said Wednesday that the consumer price index rose a healthy 1.9 percent last month from a year ago, a sharp jump from the annual pace of 1.5 percent in February. Inflation has been relatively modest even as the job market has strengthened and wage gains have accelerated over the past several years.
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| Adoptation goes up as fingerprint-on-display prices drop |
4/11/2019 |
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FOD solutions are to become the mainstream technology for smartphone fingerprint recognition in 2022 as penetration rates for optical and ultrasonic FOD solutions are predicted to surpass that of traditional capacitive solutions.
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| Micron feels possitive on long term memory market |
4/10/2019 |
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Emerging technologies and applications, such as artificial intelligence (AI), autonomous driving, 5G and machine learning, will be driving the memory-chip market growth for as long as 10 to 20 years,
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| Semi sales continue to retreat in February |
4/10/2019 |
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The three-month average of semiconductor sales slipped to $32.9 billion in February, down 7.3% compared to January and down 10.6% compared to February 2018, according to the WSTS. February's decline was steeper than the industry experienced in January, when the three-month average fell by 7.2% sequentially and 5.7% year-over-year.
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| Infineon to expand research site in Austria |
4/9/2019 |
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DICE (Danube Integrated Circuit Engineering) has broken ground in Linz for a new facility.The new building, which is due to be completed in 2020, will provide room for 400 employees. The existing site currently employs 180 people working for the development center. Its main focus is on 77 GHz radar chips for driver assistance systems.
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| First data distribution platform certified for Avionics applications |
4/9/2019 |
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The Open Group FACE consortium announced on March 27. The conformance certification specifically applies to the “edge computing” vendor’s Java programing language application programming interface (API). The company’s data distribution service dubbed Vortex also supports C++.
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| Austin researcher disclosed design that beats a Nvidia V100 neual network |
4/9/2019 |
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A researcher from UT Austin described mini-batch serialization (MBS), a method to slash memory accesses needed to train convolutional neural networks (CNNs) so that more work fits in on-chip buffers. When implemented on its own WaveCore chip, the technique reduced DRAM traffic 75%, improved performance 53%, and saved 26% of system energy compared to conventional approaches and accelerators.
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| Intel's Optane DIMMs for server so far a disappointment |
4/8/2019 |
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Intel and Micron launched 3D XPoint with great fanfare in July 2015 as the first new memory architecture in decades. Nearly five years later, the chips are finally shipping in both solid-state drives (SSDs) and dual-inline memory modules (DIMMs), but their sparkle has dimmed.
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| 802.11Ah WiFi for IoT comes into market |
4/8/2019 |
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The Wi-Fi Alliance announced HaLow at CES 2016 as the outcome of the 802.11ah process kicked off with significant help from Qualcomm engineers in 2014.The so-called 'HaLow' products promise delivery of up to Mbits/s over distances of tens of meters to a kilometer and support for thousands of nodes on an access point.
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| Toyota to offer licensing of hybride car technology |
4/8/2019 |
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Toyota Motor Corp. announced a plan to start granting royalty-free licenses on the company’s closely guarded hybrid electric vehicle (HEV) patents.It will also offer “fee-based” technical support to purchasers of their powertrain electrification systems, including Toyota motors, batteries, PCUs and control ECUs.
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| Semiconductor materials sales hit record in 2018 |
4/5/2019 |
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The global semiconductor materials market grew 10.6% in 2018, propelling semiconductor materials revenues to US$51.9 billion to eclipse the previous high of US$47.1 billion set in 2011.
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| Cadence Design moves into system analysis with an electromagnetic field solver |
4/5/2019 |
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The tool boasts electromagnetic simulation capability that delivers up to 10 times the performance of Cadence’s previous-generation field solver. The Clarity 3D Solver also offers a distributed multiprocessing architecture that gives it “virtually unlimited capacity” along with “gold-standard accuracy,” according to Cadence.
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| SIA calls on the government to boost funding on chip research |
4/4/2019 |
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The Semiconductor Industry Association, which represents firms such as Intel Corp, Micron Technology Inc and Nvidia Corp, is asking U.S. officials to raise federal funding for chip research from a current $1.5 billion to $5 billion over the next five years and double funding for related fields such as materials science.
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| 7nm order picks up at TSMC |
4/4/2019 |
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With handset chip clients stepping up their pace of advanced chip orders, TSMC is expected to see its 7nm manufacturing processes run at full utilization in the third quarter of 2019.
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