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| China's Tsinghua Unigroup forms new DRAM business unit |
7/3/2019 |
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DRAM, or dynamic random access memory, has proven especially difficult for Chinese companies to produce at scale. U.S.-based Micron Technology Inc and South Korea’s Samsung Electronics Co Ltd and SK Hynix Inc together account for over 95% of global DRAM market share.
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| Microchip offers controllers for automotive touchscreens |
7/2/2019 |
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The TD family of touch controllers features a new differential mutual signal acquisition method that significantly increases the Signal-to-Noise Ratio (SNR). This allows the use of very thick glass or plastic cover lenses and multi-finger thick gloved touch support up to the equivalent of 4.5 mm polymethyl methacrylate (PMMA).
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| Amazon Prime replaces others as the largest shiping carrier for Amazon |
7/1/2019 |
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Amazon was delivering nearly half of its own packages by the end of May, according to Rakutan Intelligence, by way of a report in Axios. The e-commerce leader was responsible for 48% of its shipments, while the U.S. Postal Service delivered 33%, and United Parcel Service (NYSE:UPS) carried 17%. FedEx rounded out the list with less than 2%.
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| China's ZTE to ship 5G chips this year after Huawei |
7/1/2019 |
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At the 5G Summit held alongside MWC Shanghai 2019, Xu cited company statistics as saying that ZTE's patent applications had amounted to 73,000 cases as of the end of 2018, including over 35,000 globally-licensed patents and more than 3,000 strategic patents for 5G technologies.
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| UK move to reduce eWaste |
7/1/2019 |
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Globally, according to the committee, 44.7 million tonnes of e-waste was produced in 2017, 90% of which landfilled, incinerated, illegally traded or treated in a sub-standard way. Europe and the US account for almost half of all e-waste globally, with the EU predicted to produce 12 million tonnes by 2020.
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| ARM Lead CPU Architect joins Apple 5G developement |
6/28/2019 |
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Former ARM Lead CPU Architect Mike Filippo joined up with Apple last month, following a 10 year stint with the semiconductor company. The move notably follows the exit of Apple chip design lead Gerard Williams III, back in March. Filippo appears perfectly suited for the role, having played a key part in a many of ARM’s virtually ubiquitous designs.
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| Toshiba Machinery appointed outsiders to new board |
6/28/2019 |
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The board reached a proportion of outsiders unheard of among Japanese peers with the new lineup, which Toshiba proposed last month in response to shareholder pressure. The 10 outside directors are up from seven on the previous board, while four of the 10 hail from outside Japan.
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| U.S. first quarter GDP grew 3.1% |
6/27/2019 |
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But signs are mounting that growth has slowed sharply in the current quarter amid slower global growth and a confidence-shaking trade battle between the United States and China.
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| EU warns Broadcom of possible antitrust on TV and modem chips |
6/27/2019 |
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The European Commission said the so-called interim measures, the first in 18 years, were warranted because of Broadcom’s likely dominance in the TV and modem chipset markets and deals between the company and seven major customers that resulted in the latter buying chips only from Broadcom.
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| Micron redices Capex spending |
6/27/2019 |
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Micron said that it would slash capital spending for its fiscal 2019, which closes in August, to about $9 billion, down about 10% from the company’s estimate of about $10.5 billion at the start of the fiscal year. Micron said that it expects its fiscal 2020 capital expenditures to be “meaningfully lower” than fiscal 2019.
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| Micron Technology has resumed some shipments to Huawei Technologies |
6/26/2019 |
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Micron had stopped all shipments to Huawei after the Commerce Department in May added the Chinese company to a blacklist, a move the Trump administration said would prevent U.S. technology from being used to undermine U.S. security and policy interests. The company, however, found that it could actually ship a subset of its products that weren’t subject to restrictions on blacklisted companies
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| Qualcomm to face another European Union antitrust fine |
6/26/2019 |
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The EU’s current Qualcomm investigation targets 3G chips for internet mobile dongles sold between 2009 and 2011. Regulators allege these were sold below cost in order to push Icera, now owned by Nvidia Corp., out of the market.
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| Foxconn to pair 8K camera with 5G on next generation handsets |
6/26/2019 |
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Following two years of efforts, Foxconn has completed the 8K+5G ecosystems, covering SoCs for 8K cameras, compression and decompression technologies for 8K image transmission, wired and 5G wireless transmission environments, as well as terminal displays and applications.
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| ARM to crank up investment in Taiwan |
6/26/2019 |
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Masayoshi Son told reporters that ARM would expand its investments in Taiwan in areas such as the Internet of Things and autonomous vehicles, and would hire more engineers, as well as research and development specialists.
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| Massive expansion at Seattle to quintuple Apple's headcount there |
6/25/2019 |
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The company announced at a Monday news conference that it would be bringing 2,000 jobs to the city by 2024 -- twice the number it initially planned. The new roles would focus on software and hardware and effectively multiply Apple's existing workforce by five.
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