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Rising Prices and Volume Drive Nearly 30% Revenue Growth for DRAM Industry in 4Q 2023 3/26/2024
TrendForce reports a 29.6% quarter-on-quarter (QoQ) revenue growth for the DRAM industry in the fourth quarter (4Q 2023), reaching $17.46 billion, propelled by revitalized stockpiling efforts and strategic production control by leading manufacturers.
Micron is poised to grab a sizeable HBM market share 3/25/2024
"Our HBM is sold out for calendar 2024, and the overwhelming majority of our 2025 supply has already been allocated," said Sanjay Mehrotra, chief executive of Micron,
APAC PC Market Down 16% in 2023 3/25/2024
The traditional PC market in APAC (including Japan and China) posted a 16.1% decline in 2023 to 97.4 million units, according to IDC.
Chinese car makers will be in the spotlight at the Bangkok International Motor Show this week 3/25/2024
Underscoring the growing challenge to Japanese auto giants that have long dominated Thailand's vehicle market.
Big Tech is facing its biggest challenge in decades 3/25/2024
Big Tech is facing its biggest challenge in decades as antitrust regulators on both sides of the Atlantic crack down on alleged anti-competitive practices that could result in break-up orders to Apple and Alphabet's Google, a first for the industry.
Nvidia CEO touts chipmaker's data center market potential 3/22/2024
Nvidia CEO Jensen Huang says the company's Blackwell architecture AI GPU series has the potential to boost its data center market scale as much as 25%, or up to $250 billion. Huang sees a place for humans in AI systems to guide software and develop algorithms, and says Nvidia is focused on "this one niche called accelerated computing and AI" in the wider semiconductor landscape.
Micron posted an unexpected profit on AI demand 3/22/2024
Micron Technology is pointing to an increase in AI adoption for its above-estimate third-quarter revenue forecast and a per-share quarterly profit after five quarters of losses. The company's high bandwidth memory chips are sold out for this year and next year's supply has mostly been allocated, CEO Sanjay Mehrotra reports.
Mercedes-Benz to pilot humanoid robots in its manufacturing facilities 3/22/2024
The automaker plans to use the robots to perform physically demanding or repetitive tasks that are often more hazardous to humans.
Boeing to spend $4B plus to fix safety, manufacturing woes 3/22/2024
The aerospace company is slowing 737 Max production and limiting traveled work into the factory as it strains to address longstanding issues.
JEDEC publishes GDDR7 Graphics Memory Standard 3/21/2024
JEDEC has published JESD239, a GDDR7 Graphics Memory Standard for AI, graphics and gaming applications. The new standard doubles the bandwidth of GDDR6 for up to 192 GB/s per device.
US considers sanctions for Huawei-linked firms 3/21/2024
The US is weighing sanctions against semiconductor companies with ties to Huawei Technologies, sources say. "Adding more Chinese companies to the US Entity List is a highly likely event," according to Jefferies analyst Edison Lee, who wrote, "It is easy to implement and justify, and it will further block certain key Chinese companies from being able to exploit current loopholes in export restrictions.
300mm Chip Equipment Spending Forecast to Hit Record 7B in 2027 3/21/2024
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record $137 billion in 2027 after topping $100 billion for the first time by 2025 on the strength of the memory market recovery and strong demand for high-performance computing and automotive applications.
Intel awarded $8.5B in CHIPS funding 3/21/2024
The award is the largest yet from the Biden administration and will help advance the chipmaker's plants in Arizona, New Mexico, Ohio and Oregon.
Huawei's storage system touts 90% lower power consumption than HDDs 3/20/2024
Huawei is reportedly developing a new archival storage system using magnet-electrical disks that will reduce power consumption by 90% compared to standard hard drives (HDDs).
SK Hynix mass producing HBM chips for AI chipsets 3/20/2024
SK Hynix has started mass producing its HBM3E high-bandwidth memory chips and plans to send shipments to Nvidia for AI chipsets this month, sources say. Micron Technology and Samsung Electronics are also developing HBMs, though only SK Hynix supplies Nvidia.
GE Aerospace to invest $650M in global facilities, US suppliers 3/20/2024
The Boeing engine supplier’s spending will include new machines, equipment, building upgrades and improved safety measures.
Fisker to halt production, raise $150M with future in doubt 3/20/2024
Fisker is taking advantage of a 30-day grace period to work with “certain stakeholders in the Company’s capital structure,” the company said in the filing.
Q4 revenue for top 10 foundries hit $30B, up 7.9% 3/19/2024
Growth was primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs.
TSMC eyes Japan for advanced packaging 3/19/2024
Taiwan Semiconductor Manufacturing Co. is considering building advanced chip packaging capacity in Japan, sources say. Early deliberations are underway that could bring its chip on wafer on substrate packaging tech to Japan, according to the sources.
China Smartphone Sales Down 7% YoY in First 6 Weeks of 2024 3/19/2024
Key vendors like Apple Inc., OPPO and vivo seeing double-digit declines, according to Counterpoint Technology Market Research’s latest China Smartphone Weekly Sell-through Tracker.
TI to Highlight Tech for Safer, Smarter and More Sustainable Future at embedded world 2024 3/19/2024
At embedded world 2024, TI will showcase the latest advancements in application ...
Top 5 IC Equipment Makers’ Revenue Down 1% YoY in 2023 3/18/2024
Out of these five WFE vendors, ASML and Applied Materials managed to post YoY growth in 2023 while Lam Research, Tokyo Electron and KLA’s revenues declined by 25%, 22%, and 8% YoY, respectively. Strong DUV and EUV sales drove ASML to the top position in 2023.
3M appoints new CEO 3/18/2024
The manufacturing giant named former L3Harris Technologies CEO William Brown as its chief executive, effective May 1.
Samsung set to receive more than $6B in CHIPS Act funds for US expansion 3/18/2024
The money from the 2022 Chips and Science Act would be one of several major awards that the Commerce Department is expected to announce in coming weeks, including a grant of more than $5 billion to Samsung’s Asian rival, Taiwan Semiconductor Manufacturing Co.
Chipmakers focus on growing talent with apprenticeships 3/18/2024
Taiwan Semiconductor Manufacturing Co. and NXP Semiconductor are scaling up apprenticeship programs to fill the skills gap as more chip facilities are built in the US. The National Institute for Innovation and Technology, which is contracted by the Labor Department to expand apprenticeships in the semiconductor industry and related supply chain, is active in 22 states and is working on a national network of training providers.
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