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FAA Approves Amazon Prime Air Drone Delivery Expansion 5/31/2024
Amazon's latest clearance lets its drones travel farther distances to deliver packages.
US Won't Impose Tariffs on Graphics Cards From China for Another Year 5/31/2024
The US Trade Representative will exempt graphics cards from the Trump-era tariffs to give companies more time to shift manufacturing away from China.
how China's EV makers aim to beat Tesla and legacy automakers in Europe 5/30/2024
Chinese EV titans BYD (002594.SZ), Chery (CHERY.UL) and Great Wall Motor (GWM) (601633.SS) are preparing a fusillade of product launches - about 20 over the next five years - and spending heavily on sales and marketing in their most important export market.
OLED Monitor Shipments Hit 200,000 Units in 1Q 2024 5/30/2024
The momentum is expected to continue into the second quarter, which is set to see quarterly growth of 52% as new models hit the market, bringing the total for the first half to 500,000 units.
QuickLogic Receives Supplier of the Year Award from BAE Systems 5/30/2024
QuickLogic has received a BAE Systems 'Partner 2 Win' Supplier of the Year award in the category of "FAST Labs Technology Innovation Partner Of The Year"
GDDR7 Adds Headroom to Meet AI Pressures 5/30/2024
GPU makers like Nvidia and AI workloads are driving the evolution of GDDR memory as HBM sells out.
Top 10 IC Design Houses’ Combined Revenue Up 12% in 2023 5/29/2024
world’s top ten IC design houses reached approximately $167.7 billion in 2023, marking a 12% annual increase, according to TrendForce.
Samsung developing 1,000-layer 3D NAND with "hafnia ferroelectrics" 5/29/2024
Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers of 3D NAND and achieving petabyte-level SSDs.
Malaysia seeks over $107B in chip investment 5/29/2024
Malaysia is aiming to increase its role in the global semiconductor supply chain and is targeting more than $107 billion in investments in advanced packaging, manufacturing equipment and integrated circuit design, according to Prime Minister Anwar Ibrahim. Malaysia expects to contribute $5.3 billion to meet the targets.
Tesla pushes suppliers to produce parts outside of China and Taiwan 5/29/2024
Tesla has told suppliers to start building components and parts outside of both China and Taiwan by as early as next year due to rising geopolitical uncertainties,
HBM Prices to Jump 5–10% in 2025 5/28/2024
HBM’s share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025.
Toshiba Completes 300mm Wafer Fab Facility for Power Chips 5/28/2024
The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024.
TSMC Launches Program to Enhance Green Conservation 5/28/2024
Moving forward on its commitment to protecting biodiversity, Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has launched the “Eco Plus! – Ecological Harmony Program”, which integrates internal and external resources to connect fragmented biological habitats, enhance species survival, and establish a reward system to support potential talents and important ecological research on biodiversity.
SiC Innovations Advance Space Power Technology 5/28/2024
Resilient power technology is critical to withstand space radiation hazards.
AMD aims to achieve 100x power efficiency boost by 2027 5/27/2024
Generative AI is driving the need for more performance using less energy, and AMD's strategy includes AI-specific architectures, tuning at the data center level and co-design efforts for hardware and software.
X-Fab offering Soitec's 150mm SmartSiC wafers at Texas foundry 5/27/2024
“The resulting substrate offers improved device performance and manufacturing yields,”
Samsung refutes report of failing Nvidia's AI memory chip test 5/27/2024
Samsung is currently testing its HBM chips with U.S. graphic chip giant Nvidia to supply the memory chips for Nvidia's AI processors, but Reuters reported that Samsung did not pass the test due to issues with heat and power consumption. Samsung Electronics refuted a Friday news report that it failed to pass a test of Nvidia's high-bandwidth memory (HBM) chips.
US to Resume Trump-Era Tariffs on Graphics Cards Assembled in China 5/27/2024
The tariffs add a 25% duty on graphics cards, motherboards, and desktop PC cases.
IGZO DRAM memory tech is coming from Imec for AI 5/24/2024
Imec is experimenting with indium-gallium-zinc-oxide technology for use in AI memory using an analog in-memory computing approach. The IGZO DRAM technology offers speed and energy efficiency.
AI helps buoy semiconductor growth this year and into next 5/24/2024
Major semiconductor companies had mixed results for 1Q 2024, report’s Semiconductor Intelligence.The revenue cha nge from 4Q 2023 to 1Q 2024 ranged from a 23% increase reported by Micron Technology to a 19% decline from STMicroelectronics.
Bill to control AI model exports advances in House 5/24/2024
Lawmakers in the House Foreign Affairs Committee advanced the Enhancing National Frameworks for Overseas Restriction of Critical Exports Act, which aims to expand authority to block the export of AI models to China.
Google Is Building Massive Fiber Optic Cable Network From Africa to Australia 5/24/2024
The cable route will be set up in Kenya, Uganda, Rwanda, Democratic Republic of the Congo, Zambia, Zimbabwe, and South Africa, ending on Australia's west coast. Umoja means "unity" in Swahili.
LPDDR competition heats up for energy efficiency 5/23/2024
Samsung Electronics, SK Hynix and Micron Technology are working to develop low power double data rate memory DRAM technology to boost energy efficiency for AI applications. Micron's Crucial LPCAM2 builds on Samsung's low power compression attached memory module released last year.
Subaru teams up with Toyota to mitigate EV ‘risks’ 5/23/2024
Subaru CEO and President Atsushi Osaki said after exploring various options for BEV development, the company has opted to partner with its friendly rival Toyota Motor Corp. The two automakers will jointly develop four battery electric SUVs,
TSMC's Lithography Machines Have a Remote Kill Switch in Case China Invades 5/23/2024
TSMC makes the world's most advanced chips at its Taiwan facilities, so the prospect of those fabs being taken over or controlled by a hostile force is not a pleasant scenario to consider. However, now it's been revealed for the first time that the machines have remote kill switches, which would render them idle in the case of Chinese aggression.
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