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Huawei plans to mass-produce 3nm chips by 2026


Friday, June 6, 2025

Chinese tech giant Huawei is reportedly planning to begin mass production of 3-nanometer (3nm) process-based chips starting next year. Industry observers suggest that the company is preparing for supply chain independence based on domestic Chinese technology, given the impossibility of importing existing extreme ultraviolet (EUV) lithography equipment.

On June 2, Chinese local media reported that Huawei is accelerating the development of gate-all-around (GAA) based 3nm chips in collaboration with SMIC, China’s largest foundry, based on its own design. GAA is a next-generation transistor structure that can minimize current leakage and maximize performance. Samsung Electronics was the first to utilize GAA technology from the 3nm node, while TSMC first introduced it at 2nm.

Huawei aims to complete the tape-out (final design confirmation for mass production) of 3nm chips by next year, with the goal of starting mass production as early as 2026.

The key issue is yield. Industry experts estimate that SMIC’s current yield for 7nm and 5nm processes is below 50%.

Unable to introduce EUV equipment, Huawei and SMIC are conducting processes by applying multi-patterning to deep ultraviolet (DUV) based lithography equipment. The SSA800 equipment in use is a product of Shanghai Micro Electronics Equipment (SMEE).

Previously, Huawei had already released high-performance chips such as Kirin 9000S and Kirin X90 without EUV. While the actual process is close to 7nm, it was evaluated to have secured 5nm-level performance by utilizing chiplet design and advanced packaging technology.

For this 3nm development, it is known that experimental approaches such as carbon nanotube-based semiconductors are being pursued alongside GAA. This is seen as a move to complement the limitations of existing silicon transistors and secure leadership in next-generation material-based chip technology.

Huawei’s efforts are an extension of its frontal breakthrough strategy towards advanced semiconductor independence, which seemed impossible after being placed on the U.S. Entity List in 2019. Since being cut off from transactions with Google, Intel, Qualcomm, and others, it has focused on developing its own operating system (HarmonyOS) and chips, and recently started applying its own chips to laptops and PCs.

By: DocMemory
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