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| Silicon Motion memory technologies are helping transform the retail space |
9/5/2023 |
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most supermarkets have installed self-check-out stations to cut the number of required till operators. These initiatives have proven so successful that they are now looking to take this concept further and use technology to run the shop floor entirely, freeing up staff for more productive roles.
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| Tape drives to stay |
9/5/2023 |
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Nostalgia is driving the return of audio cassettes, but tape for data storage has never gone away: All the cool kids are using it, including the hyperscalers.
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| Reports: Samsung to convert some lines to 236 layers |
9/4/2023 |
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Samsung Electronics is reportedly planning to convert some of its P1 facility production lines to 236-layer NAND for advanced products, sources say. The company is also launching an automated chip packaging line, intending to eliminate human labor from its packaging facilities by the end of the decade.
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| Qualcomm wants to boost its automotive chip market share |
9/4/2023 |
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Qualcomm hopes generative AI will help boost its chip share in the automotive sector, currently at just 3% of its revenue. The company estimates its automotive chip sales will surpass $9 billion in 2031, up from $1.32 billion in fiscal 2022.
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| Copper may be the next in shortage |
9/4/2023 |
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there are materials experiencing an increase in demand with little to no increase in availability, such as copper. Yes, that easy-to-refine metal that has been used for thousands of years is now on the “worry list.”
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| ASML to invest $313M in Taiwan |
9/1/2023 |
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Taiwan Investment Commission of the Ministry of Economic Affairs said on Tuesday that it has approved an application by ASML to infuse about NT$5.65 billion and 140 million euros (US$152 million), which is in excess of NT$10 billion in total, into ASML Taiwan, a subsidiary that specializes in rolling out wafer measuring equipment and provides its clients with technological support and training.
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| Gelsinger Concerns About U.S. Chip Fund and export controls |
9/1/2023 |
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“On one hand, they [Intel] are being asked to invest billions in advanced fab construction in the U.S. On the other, the U.S. Department of Commerce is prepared to slap further controls on Intel’s ability to ship commodity semiconductors to China that could significantly cut into its already-reduced revenue from the China market—in essence, a major double whammy.”
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| MediaTek working with Verizon, Ericsson on 5G devices |
8/30/2023 |
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MediaTek, Verizon and Ericsson have advanced technology for New Radio devices and internet of things solutions on Verizon's 5G network. The companies say the technology, which uses Ericsson's RedCap software and MediaTek's RedCap testing platform, is less complex and more economical.
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| MRigidCSP packaging increasing mechanical strength for battery management |
8/30/2023 |
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Alpha and Omega Semiconductor Ltd’s (AOS) MRigidCSP packaging technology decreases on-resistance while increasing mechanical strength of devices designed for battery management applications. AOS’s robust package technology is particularly suited to battery applications in smartphones, tablets, and ultra-thin notebooks.
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