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Judge Okay'd Apple to sue Rivos 8/16/2023 US District Judge Edward Davila in San Jose said Apple had “sufficiently identified” a trade secret and alleged “sufficient harm” by three former employees. The judge rejected requests to dismiss a Defend Trade Secrets act claim against three former Apple employees as well as a breach of contract claim against five. Intel and Synopsys Developing Portfolio of IP for Advanced Process Nodes 8/16/2023 Intel and Synopsys are expanding their strategic partnership with the development of a portfolio of IP on Intel 3 and Intel 18A processes. CEVA Inc. joins the Samsung Advanced Foundry Ecosystem to streamline chip design 8/16/2023 CEVA Inc. has joined the Samsung Advanced Foundry Ecosystem (SAFE) to streamline chip design and accelerate time-to-market for CEVA licensees using Samsung’s advanced foundry processes. University of Arkansas to construct new chip prototype line 8/15/2023 “This new semiconductor research and fabrication facility will enable the government, businesses of all sizes, and universities to prototype in silicon carbide, introducing a capability that does not presently exist in the U.S.” SK Hynix has denied negotiations or collaboration with SRAM & MRAM Group on a chip plant in India 8/15/2023 "Hynix haven't had any negotiations with SRAM & MRAM Group and therefore, do not have any plans to collaborate with the company on a chip manufacturing plant and testing facility in India," Apple might have M3 shortage resolved 8/15/2023 It seems that Apple managed to secure TSMC’s entire stock of 3nm chips for a full year, according to Wccftech, who reports that these 3nm chipsets “will be found in various devices, starting with the A17 Bionic for the iPhone 15 Pro and iPhone 15 Pro Max, followed by the M3.” Artery offers MCU for automotive applications 8/15/2023 The AT32A403A series is suitable for automotive body control, advanced driver assistance systems (ADAS), car audio & video, automotive battery management system (BMS) and other automotive applications. Phison has demonstrated its fastest client solid-state drive 8/14/2023 The PS5026-E26 Max14um Gen5 SSD with an over 14 GB/s sequential read speed, which is higher than what the best SSDs offer today, at Flash Memory Summit 2023. The unit was cooled down using an innovative system from Frore. SK hynix has begun mass-production of of largest capacity mobile DRAM 8/14/2023 SK hynix said the 24-gigabyte low-power double data rate 5 eXtended (LPDDR5X) mobile DRAM was first supplied to Chinese Oppo’s latest flagship smartphone, AI Accelerator Chips Driving HBM3 Market 8/14/2023 As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year. Telink Semiconductor to showcasing cutting-edge IoT chip technology at the upcoming Nepcon Vietnam 2023 8/14/2023 Dedicated to the pioneering concept of “Inside Electronics 4.0,” Telink Semiconductor is unwavering in its commitment to offering the most advanced chip solutions to a global clientele. Samsung Electronic might announce collaboration with AMD in the field of system semiconductors 8/11/2023 According to Korean media ZDNet Korea,and Ddaily, Samsung is expected to make the said announcement on October 5 at Samsung Semiconductor Research Center. High-bandwidth memory production seeing a boost from AI demand 8/11/2023 TrendForce, the market research firm now projects that aggressive supplier expansion will raise the HBM sufficiency ratio from -2.4% in 2022 to 0.6% in 2024. Arrow Electronics hosted an EvTech and AIoT of the Future seminar in Hanoi, Vietnam 8/11/2023 The seminar exhibited a wide range of EV (Electric Vehicle) and AIoT (Artificial Intelligence of Things) technology products and solutions that will help advance the development of electric mobility and smart cities. Winbond now certified to ISO/SAE 21434 international standard certification 8/11/2023 “Road vehicles – cybersecurity engineering,” is developed by the International Organization for Standardization (ISO) and the SAE International. It focuses on protecting road users by outlining requirements to ensure the robustness of automotive systems against cyber-attacks. SK Hynix looks into 321-layer NAND production 8/10/2023 SK hynix unveiled the sample of the 321-layered NAND flash chip at the Flash Memory Summit 2023 that kicked off its three-day run in Santa Clara, California. This is the first time any chipmaker has revealed a specific development timeline of a NAND with more than 300 layers. OLED panels to secure more than 50% market share in the smartphone industry 8/10/2023 thanks to a continuous decrease in costs OLED panels will secure more than 50% market share in the smartphone industry by 2023 Lithium battery manufacturer EVE Energy to build new manufacturing facility in Kulim, Kedah, Malaysia 8/10/2023 The new factory, which will be EVE’s 53rd, will have an initial investment of $422 million and will focus on the production of cylindrical lithium-ion batteries to support power tools and electric two-wheelers manufacturing in the country and across Southeast Asia. TSMC, Bosch, Infineon, and NXP Set Up JV to Bring Advanced Semiconductor Manufacturing to Europe 8/10/2023 TSMC, Bosch, Infineon, and NXP plan to jointly invest in ESMC in Germany to provide advanced semiconductor manufacturing services. Intel CEO Gelsinger is lobbying for a large portion of the $52 billion Chip Act Fund 8/9/2023 Gelsinger: “If I have 25% or 30% less market, I need to build less factories. You can’t walk away from 25% to 30% and the fastest-growing market in the world and expect that you remain funding the R&D and the manufacturing cycle.” STMicroelectronics Launches IR Sensor for Presence and Motion Detection in Building Automation 8/9/2023 The STHS34PF80 sensor contains thermal transistors that can detect stationary objects, unlike conventional PIR detectors that require the detected object to be moving to produce a measurable response from the sensor. indie Semiconductor and SiLC Technologies are partnering on LiDAR platforms 8/9/2023 This partnership will deliver fully integrated vision system platforms deploying frequency modulated continuous wave (FMCW) detection, redefining benchmarks for rapidly emerging LiDAR applications. China lags in AI chip ambitions 8/8/2023 Beijing’s ambitions of joining the world’s top memory-chip makers could seriously hinder China’s ability to develop large artificial intelligence (AI) models when the country is already reliant on US suppliers such as Nvidia for sanctions-compliant versions of graphics processing units, or GPUs, Nvidia clarifies GPU volume challenges come from chip packaging 8/8/2023 the company's GPU volume issues the company's GPU volume issues. Instead, the bottleneck in manufacturing enough GPUs that can cater to both consumer and professional workloads lies with the chip packaging steps that come after. Fujitsu offers Automotive Grade 512kb FeRAM 8/8/2023 The MB85RC512LY is a non-volatile memory with 512kb memory density and operates at a low power supply voltage from 1.7V to 1.95V. It features extremely low operating current.  27  |  28  |  29  |  30  |  31  |  32  |  33  |  34  |  35  |  36

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