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Samsung Research America, Princeton U. team up for R&D in 6G 2/14/2024
The program was launched by the university's School of Engineering and Applied Science last year to accelerate the adoption of new technologies and enhance innovation across various sectors, including cloud and edge networks, intelligence sensing and network resilience.
HBM market growth likely to outpace DRAM 2/14/2024
The high bandwidth memory sector is forecast to increase by $14 billion in 2024, according to Yole Developpement, and likely outgrow the DRAM market. AI and high-performance computing are fueling the HBM market growth
Most Volkswagen autoworkers in Tennessee want to join union, UAW says 2/14/2024
With a majority of workers having signed union cards, the United Auto Workers lauded the moment as a positive sign for its industry unionization drive.
BorgWarner inks manufacturing deal with BYD subsidiary 2/14/2024
The auto supplier will use FinDreams Battery’s LFP battery pack design and manufacturing process in Europe, the Americas and parts of the Asia Pacific.
SK Hynix and TSMC have established an Alliance' in high-bandwidth memory (HBM) market 2/13/2024
SK Hynix has established a "one-team strategy" including cooperation with TSMC on development related to HBM4, the sixth-generation HBM. The two companies, along with Nvidia, which dominates the AI semiconductor market, are increasing their influence in their respective markets.
Nvidia plans to build custom AI chips with new unit 2/13/2024
Nvidia is reportedly allocating $30 billion to the custom AI chip market through a dedicated business unit for cloud computing companies. The leader in AI chips is looking to protect itself from companies wanting alternatives to its products, reports say.
Doowan Climate Control America’s new Georgia factory to supply Hyundai 2/13/2024
The $30 million facility will produce climate control systems for both EVs and gas-powered vehicles.
GM hires former Tesla exec to lead EV battery strategy 2/13/2024
Kurt Kelty was heavily involved in launching Tesla's first gigafactory and has been tasked with boosting GM's battery technology.
Ford created a secret team to build an affordable EV 2/12/2024
The automaker plans to launch multiple EVs based on the platform as part of its revamped electrification strategy, CEO Jim Farley said.
Toyota investing $1.3B for EV production in Kentucky 2/12/2024
The automaker Toyota will install a battery pack assembly line at the Georgetown plant and build a new three-row electric SUV for the U.S. market starting in 2025.
White House invests $5B in semiconductor R&D efforts 2/12/2024
The money will go towards launching a national center to boost domestic breakthroughs in chip technology.
Solid State Disks offering replacement drive with increased speeds 2/9/2024
The drive can be used in computer-based systems used in a variety of sectors, including aerospace, defence, manufacturing, medical and telecommunications.
TSMC takes top spot in semiconductor revenue 2/9/2024
Taiwan Semiconductor Manufacturing Co. is the world leader in revenue and operating profit, according to analyst Dan Nystedt. TSMC's 2023 earnings reached $69.3 billion, topping Intel's $54.23 billion and Samsung's $50.99 billion, Nystedt notes.
GM, LG Chem ink $19B cathode material supply deal 2/9/2024
The South Korea-based chemical maker will supply the automaker with enough CAM to power five million EVs.
New York busts lithium-ion battery manufacturing operation in Queens 2/9/2024
Kavanagh said on Tuesday the FDNY's Lithium-Ion Task Force discovered the business was building battery packs from individual battery cells and replacing old ones in violation of the fire code, creating "Frankenstein batteries."
Semiconductor sales to see 13% increase in 2024 2/8/2024
Global semiconductor sales are expected to rise 13% year over year to nearly $600 billion in 2024, according to a forecast from SIA. SIA CEO John Neuffer points to government investments in R&D and the workforce and policies to reduce trade barriers as drivers for the double-digit growth forecast.
TSMC building another chip factory in Japan 2/8/2024
Taiwan Semiconductor Manufacturing Co. is increasing its investment in Japan to more than $20 billion and plans to build a second chip factory there. The fab, expected to begin operation within three years, has support from Toyota and Sony.
Honda Motor reported a sharp rise in operating profit 2/8/2024
The automaker raised its full-year operating profit forecast by 4.2% to 1.25 trillion yen ($8.4 billion), versus an earlier estimate of 1.2 trillion yen and an average analyst forecast of 1.271 trillion yen, according to LSEG data.
SoftBank posts first profit in five quarters with $6.6 billion net income 2/8/2024
Net profit totalled 985.5 billion yen ($6.6 billion) in the three months to December, versus a 744.7 billion yen loss in the same period a year earlier.
Foxconn expects AI chip supply to be tight this year 2/7/2024
Foxconn's outlook for 2024 is "slightly better" than 2023, according to Chairman Liu Young-way. A shortage of AI server chips is also likely as demand remains high, Liu says.
SK Hynix weighing US chip facility investment 2/7/2024
The South Korea-based chipmaker’s new packaging plant is slated for Indiana, according to a Financial Times report.
Renesas Enables Economical Surround View Applications for Automotive Cameras 2/7/2024
Renesas' 4-channel AHL video decoder processes four input sources simultaneously..
Cadence Launches the Millennium Platform 2/7/2024
The Millennium Platform is the industry's first HW/SW accelerated digital twin solution for multiphysics system design and analysis
Samsung to unveil 280-layer QLC NAND flash memory chip 2/6/2024
Samsung Electronics is set to debut new products at the International Solid-State Circuits Conference, including its record-setting 280-layer QLC V9 NAND flash memory chip. The technology boasts a 3.2Gb/s transfer speed and could lead to solid-state drives with higher capacity and more affordable pricing.
SK Hynix set to pick Ind. instead of Ariz. for $15B packaging plant 2/6/2024
The project will be a significant step forward for advanced packaging in the U.S., which has become a bottleneck in Washington’s efforts to revitalize the domestic semiconductor industry. The U.S. has only 3% of the world’s packaging capacity, meaning that firms manufacturing chips in America have to ship them to Asia to be assembled for use.
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