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| TSMC eyes Japan for advanced packaging |
3/19/2024 |
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Taiwan Semiconductor Manufacturing Co. is considering building advanced chip packaging capacity in Japan, sources say. Early deliberations are underway that could bring its chip on wafer on substrate packaging tech to Japan, according to the sources.
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| Top 5 IC Equipment Makers’ Revenue Down 1% YoY in 2023 |
3/18/2024 |
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Out of these five WFE vendors, ASML and Applied Materials managed to post YoY growth in 2023 while Lam Research, Tokyo Electron and KLA’s revenues declined by 25%, 22%, and 8% YoY, respectively. Strong DUV and EUV sales drove ASML to the top position in 2023.
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| 3M appoints new CEO |
3/18/2024 |
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The manufacturing giant named former L3Harris Technologies CEO William Brown as its chief executive, effective May 1.
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| Chipmakers focus on growing talent with apprenticeships |
3/18/2024 |
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Taiwan Semiconductor Manufacturing Co. and NXP Semiconductor are scaling up apprenticeship programs to fill the skills gap as more chip facilities are built in the US. The National Institute for Innovation and Technology, which is contracted by the Labor Department to expand apprenticeships in the semiconductor industry and related supply chain, is active in 22 states and is working on a national network of training providers.
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| Swisscom to buy Vodafone Italia for 8 billion euros |
3/15/2024 |
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Swisscom said it will buy Vodafone Italia for 8 billion euros and merge the business with its Italian subsidiary Fastweb. The deal will create Italy's second-biggest fixed-line broadband operator behind TIM, with a strong presence in the prized business segment.
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| Enterprise SSD revenues surged 47.6% in Q4 |
3/14/2024 |
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Prices surged, lifting Q4 revenues by 47.6% compared with Q3 to $23.1 billion. SK Group (SK Hynix + Solidigm), Samsung Electronics and Micron Technology topped the sales ranking
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| AI chip race: Samsung reportedly turns to MUF tech |
3/14/2024 |
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Samsung Electronics is going to use the molded underfill chipmaking technique for its high bandwidth memory chips ad interest in generative AI heats up, sources say. Rival SK Hynix made the switch to mass reflow molded underfill to address production issues with non-conductive film.
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| Hyundai developing auto chips on 5nm process |
3/13/2024 |
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Hyundai Motor is designing auto chips based on the 5-nanometer process for advanced driver assistance systems in software defined vehicles, according to one report. Hyundai is said to be working with design solution providers and is expected to collaborate with Samsung Electronics or Taiwan Semiconductor Manufacturing Co.
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| ADI and BMW Group Partner on 10MB Ethernet for Automotive |
3/13/2024 |
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Automotive Ethernet connectivity is a key enabler of new, zonal architectures in automotive design and supports automotive megatrends such as software-defined vehicles. The BMW Group will be a leading original equipment manufacturer (OEM) to implement the technology, leveraging ADI’s E²B for their ambient lighting system design in the vehicles of the BMW Group in the future.
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| Nordic Semiconductor Expands Cellular IoT Device Lineup |
3/12/2024 |
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The nRF9151 further enhances Nordic’s end-to-end cellular IoT solution, which encompasses hardware, software, tools, and nRF Cloud Services, providing advanced capabilities and seamless integration to significantly simplify the development process.
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| Huawei, SMIC used US tech for 7nm chip |
3/11/2024 |
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Huawei Technologies and Semiconductor Manufacturing International Corp. reportedly used technology from US companies Applied Materials and Lam Research to make a 7-nanometer chip in 2023, sources say. Huawei's Mate 60 Pro was seen as a breakthrough as China looks to replace foreign components for semiconductors.
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