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| AI chip race: Samsung reportedly turns to MUF tech |
3/14/2024 |
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Samsung Electronics is going to use the molded underfill chipmaking technique for its high bandwidth memory chips ad interest in generative AI heats up, sources say. Rival SK Hynix made the switch to mass reflow molded underfill to address production issues with non-conductive film.
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| Hyundai developing auto chips on 5nm process |
3/13/2024 |
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Hyundai Motor is designing auto chips based on the 5-nanometer process for advanced driver assistance systems in software defined vehicles, according to one report. Hyundai is said to be working with design solution providers and is expected to collaborate with Samsung Electronics or Taiwan Semiconductor Manufacturing Co.
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| ADI and BMW Group Partner on 10MB Ethernet for Automotive |
3/13/2024 |
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Automotive Ethernet connectivity is a key enabler of new, zonal architectures in automotive design and supports automotive megatrends such as software-defined vehicles. The BMW Group will be a leading original equipment manufacturer (OEM) to implement the technology, leveraging ADI’s E²B for their ambient lighting system design in the vehicles of the BMW Group in the future.
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| Nordic Semiconductor Expands Cellular IoT Device Lineup |
3/12/2024 |
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The nRF9151 further enhances Nordic’s end-to-end cellular IoT solution, which encompasses hardware, software, tools, and nRF Cloud Services, providing advanced capabilities and seamless integration to significantly simplify the development process.
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| Huawei, SMIC used US tech for 7nm chip |
3/11/2024 |
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Huawei Technologies and Semiconductor Manufacturing International Corp. reportedly used technology from US companies Applied Materials and Lam Research to make a 7-nanometer chip in 2023, sources say. Huawei's Mate 60 Pro was seen as a breakthrough as China looks to replace foreign components for semiconductors.
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| Micron works on workforce diversity as it enters N.Y. |
3/11/2024 |
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Micron Technology has pledged $100 billion to its upcoming chip fabrication plants in Central and Upstate New York. Fran Dillard, chief diversity inclusion officer at Micron, says the company is working on its workforce diversity strategy and hopes to see more women joining the industry.
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| SK Hynix looks to solidify HBM market lead with $1B investment |
3/8/2024 |
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Lee Kang-Wook, a former Samsung Electronics Co. engineer who now heads up packaging development at SK Hynix. Innovation with that process is at the heart of HBM’s advantage as the most sought-after AI memory, and further advances will be key to reducing power consumption, driving performance and cementing the company’s lead in the HBM market.
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| JEDEC publishes GDDR7 graphics memory standard |
3/8/2024 |
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JEDEC has published memory standard specifications for the GDDR7, which is expected to see a major boost in bandwidth over previous generations. Nvidia's Blackwell and Advanced Micro Devices' RDNA 4 are likely to use GDDR7 in upcoming releases.
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| AI chipsets to top 1.8B shipments by 2030 |
3/7/2024 |
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Shipments of AI chipsets are expected to grow to more than 1.8 billion by the end of the decade, spurred by generative AI demand, according to ABI Research. Heterogeneous AI chipsets will be needed as AI applications move to devices and away from the cloud, says ABI analyst Paul Schell.
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| Intel spinning off FPGA company Altera |
3/6/2024 |
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Intel has spun off its field-programmable gate array company, Altera, which will operate independently while maintaining a strategic collaboration with Intel. Altera plans to focus on FPGA solutions for traditional sectors plus AI, cloud and edge computing.
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| Global Chip Sales Up 15% YoY in January |
3/6/2024 |
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Global semiconductor industry sales totaled $47.6 billion during the month of January 2024, an increase of 15.2% compared to the January 2023 total of $41.3 billion, but a decrease of 2.1% from the December 2023 total of $48.7 billion.
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