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| HBM market growth likely to outpace DRAM |
2/14/2024 |
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The high bandwidth memory sector is forecast to increase by $14 billion in 2024, according to Yole Developpement, and likely outgrow the DRAM market. AI and high-performance computing are fueling the HBM market growth
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| Nvidia plans to build custom AI chips with new unit |
2/13/2024 |
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Nvidia is reportedly allocating $30 billion to the custom AI chip market through a dedicated business unit for cloud computing companies. The leader in AI chips is looking to protect itself from companies wanting alternatives to its products, reports say.
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| TSMC takes top spot in semiconductor revenue |
2/9/2024 |
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Taiwan Semiconductor Manufacturing Co. is the world leader in revenue and operating profit, according to analyst Dan Nystedt. TSMC's 2023 earnings reached $69.3 billion, topping Intel's $54.23 billion and Samsung's $50.99 billion, Nystedt notes.
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| Semiconductor sales to see 13% increase in 2024 |
2/8/2024 |
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Global semiconductor sales are expected to rise 13% year over year to nearly $600 billion in 2024, according to a forecast from SIA. SIA CEO John Neuffer points to government investments in R&D and the workforce and policies to reduce trade barriers as drivers for the double-digit growth forecast.
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| TSMC building another chip factory in Japan |
2/8/2024 |
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Taiwan Semiconductor Manufacturing Co. is increasing its investment in Japan to more than $20 billion and plans to build a second chip factory there. The fab, expected to begin operation within three years, has support from Toyota and Sony.
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| Honda Motor reported a sharp rise in operating profit |
2/8/2024 |
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The automaker raised its full-year operating profit forecast by 4.2% to 1.25 trillion yen ($8.4 billion), versus an earlier estimate of 1.2 trillion yen and an average analyst forecast of 1.271 trillion yen, according to LSEG data.
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| Samsung to unveil 280-layer QLC NAND flash memory chip |
2/6/2024 |
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Samsung Electronics is set to debut new products at the International Solid-State Circuits Conference, including its record-setting 280-layer QLC V9 NAND flash memory chip. The technology boasts a 3.2Gb/s transfer speed and could lead to solid-state drives with higher capacity and more affordable pricing.
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| SK Hynix set to pick Ind. instead of Ariz. for $15B packaging plant |
2/6/2024 |
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The project will be a significant step forward for advanced packaging in the U.S., which has become a bottleneck in Washington’s efforts to revitalize the domestic semiconductor industry. The U.S. has only 3% of the world’s packaging capacity, meaning that firms manufacturing chips in America have to ship them to Asia to be assembled for use.
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