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UK's anti-trust regulator gave clearance to Broadcom's $61 billion acquisition of VMware 7/20/2023
Broadcom Inc.’s proposed $61 billion takeover of VMware Inc. was provisionally waved through by the UK’s antitrust watchdog, easing the path toward one of the largest technology deals in history.
onsemi and BorgWarner Expand SiC Collaboration 7/20/2023
BorgWarner plans to integrate onsemi EliteSiC 1200V and 750V power devices into its VIPER power modules.
Embedded developers need the right tools to optimize RISC-V's advantages 7/20/2023
Embedded developers need the right tools to optimize RISC-V's advantages, Yet without the right tools, embedded software developers at OEMS and suppliers cannot make full use of the energy efficiency, simplicity, security and flexibility that RISC-V offers.
Infineon offers two new Ferroelectric RAM (F-RAM) memory devices in 1Mbit and 4Mbit densities 7/19/2023
The announcement comes as the market for automotive event data recorders (EDR) is driving demand for specialised data-logging memory devices that can instantly capture and reliably store critical data for decades.
Fabs using 300mm wafers to reach 180 by next year 7/19/2023
At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly for the production of power transistors, advanced logic, and foundry services.
TSMC earnings to be down 27% in Q2 7/19/2023
Taiwan Semiconductor Manufacturing Co.'s second-quarter earnings are expected to be down 27% year over year, according to analysts, with performance forecast to improve in Q3 on demand for AI.
Chipmakers urge US officials to moderate China sanctions 7/19/2023
Top executives from US chipmaking firms Intel, Qualcomm and Nvidia held talks with leading US officials on Monday and urged them to moderate their stance on restricting exports to China, which accounted for an estimated $180 billion in purchases last year.
Apple's M3 SoC for personal computers is reportedly coming this October 7/18/2023
Apple has scheduled a launch event in October, and based on past history, the company is set to introduce new Macs there, Bloomberg asserts.
AMD, believes that AI-enabled tools will dominate chip design as the complexity of modern processors is 7/18/2023
Su, believes that AI will dominate certain areas of chip design, she said at the 2023 World Artificial Intelligence Conference (WAIC) held in Shanghai. She also emphasized the need for interdisciplinary collaboration to enable better hardware design in the future.
Western Digital aim to reach a merger agreement with Kioxia Holdings by August 7/18/2023
The deal would be structured as a tax-free spinoff of Western Digital’s flash business, which would merge with Kioxia, Western Digital shareholders would own slightly more than 50% of the merged entity
Chips executives headed for DC to discuss China policy 7/18/2023
The executives plan to hold meetings with U.S. officials to talk about market conditions, export controls and other matters affecting their businesses,
Total semiconductor manufacturing equipment sales projected contraction of 18.6% to $87.4 billion in 2023 7/17/2023
The expected 2024 recovery—to $100 billion—will be driven by both the front-end and back-end segments.
Biometric hardware devices are set to reach $9 billion worldwide by 2027 7/17/2023
Consumer electronics—smartphone, tablet, wearable—biometric capability will markedly increase in future years. Fingerprint sensor revenues will remain at a steady $1.5 billion annually, with attach rates for face, voice, vein, ECG, and gesture biometrics increasing rapidly.
AOS Announces New 650V and 750V Automotive aSiC MOSFETs for Industrial and Electric Vehicle Applications 7/17/2023
The 650V SiC MOSFETs are ideal switching solutions for industrial applications such as solar inverters, motor drives, industrial power supplies, and new energy storage systems, while the AEC-Q101 qualified 750V SiC MOSFET line is targeted for the high-reliability needs in electric vehicle (EV) systems such as the on-board charger (OBC) and the main traction inverter.
Microchip Launches Automotive-qualified 10BASE-T1S Ethernet Devices 7/17/2023
Microchip's automotive-qualified Ethernet PHYs are functional safety ready and designed for use in ISO 26262 applications.
Infineon Partners with Teledyne e2v on Processor Solutions for Edge Computing Space Systems 7/14/2023
Built around a Teledyne e2v QLS1046-Space edge computing module configured by the rad-hard Infineon SONOS based NOR Flash memory, enables high performance space processing applications.
Infineon Technologies Extended AI Capabilities for Bluetooth LE MCU 7/14/2023
Developers of AI-enabled IoT applications can now also build edge Machine Learning (ML) applications using the Edge Impulse Studio environment for deployment on high-performance, low-power PSoC 63 Bluetooth LE MCUs.
Design Automation Conference (DAC 2023) kicks off at the Moscone Center in San Francisco 7/14/2023
AI’s infiltration into many industries, including electronics engineering, is driving the growth of semiconductor consumption, the rise of domain-specific computing, the re-emergence of vertical integration and greater opportunity for EDA companies.
AI Can't Design Chips Without People 7/14/2023
AI needs human domain expertise to solve chip design challenges.
Microsoft Prevails Over FTC: US Judge Denies Bid to Block Activision Deal 7/13/2023
Although the EU already approved the acquisition, Microsoft still has to deal with regulators in the UK, who blocked the deal on concerns the merger will undermine competition. Microsoft President Brad Smith is now indicating the company is ready to negotiate with the UK's Competition and Markets Authority to a compromise.
Electronic system design (ESD) industry revenue increased by 12% from in the first quarter of 2023 7/13/2023
“The electronic design automation (EDA) industry continued to post double-digit gains in Q1 2023, with increases in all product categories and geographic regions,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.
Infineon Partners with Teledyne e2v on Processor Solutions for Edge Computing Space Systems 7/13/2023
Infineon Technologies AG and Teledyne e2v have developed a reference design for the implementation of compute-intensive space systems. The design, built around a Teledyne e2v QLS1046-Space edge computing module, which is configured by the radiation-hardened 64MB Infineon SONOS based NOR Flash memory,
Applied Materials offers New Hybrid Bonding and TSV Technologies Advance Heterogeneous Chip Integration 7/13/2023
Applied Materials Inc. has extended its technologies for heterogeneous integration (HI) by launching materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs).
DRAM ASP Decline Narrows for Q3 Amid Production Cuts, Seasonal Demand 7/12/2023
In line with this, TrendForce projects that the third quarter will see the average selling price (ASP) for DRAM converging towards a 0~5% decline. Despite suppliers’ concerted efforts, inventory levels persistently remain high, keeping prices low.
Keysight PathWave Design 2024 Features Automation, Collaboration Support for EDA Workflows 7/12/2023
Keysight's PathWave Design 2024 gives design engineers new software automation, design data and IP management, team collaboration, and development lifecycle transformation capabilities.
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