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Industry's revenue up for 2nd straight quarter 11/28/2023
Revenue in the semiconductor industry was up 8.3% in the third quarter compared to the prior quarter, with SK Hynix and Nvidia notable beneficiaries, according to industry tracker Omdia. Revenue was spurred by AI demand, reaching an estimated $139 billions.
Siemens, Arm and AWS to Unlock Next-generation Automotive Innovations 11/28/2023
Expanding on the strong partnership between Siemens and AWS, PAVE360 helps foster innovation in the automotive industry through hardware and software parallel development.
Synopsys Expands EDA Suite to Bring Generative AI Across Full Stack 11/28/2023
Synopsys has expanded its Synopsys.ai EDA suite to bring the power of GenAI across the full stack to improve engineering productivity for the chip ind...
NTU Singapore and Durapower Partner on Cloud-based AI Tech to Enhance Safety and Lifetime of Li-Ion Batteries 11/27/2023
Scientists from Nanyang Technological University, Singapore (NTU Singapore) and Durapower Technology Singapore Pte Ltd have developed a cloud-based technology that can greatly enhance the lifespan and safety of lithium-ion (Li-ion) batteries.
NXP Launches Motor Control Solution for Software-defined Vehicle Edge Nodes 11/27/2023
NXP's S32M2 is a purpose-built motor control solution optimized for efficiency improvement across vehicle applications.
BIWIN’s C1008 SSD Solves In-Vehicle Video Surveillance Problems 11/27/2023
BIWIN's C1008 SSDs address vehicle surveillance challenges with large capacities, stable data writing, and robust designs. Ideal for security monitori...
MediaTek's Dimensity 9300 brought on Improved Mobile SoC Performance 11/27/2023
Mediatek's "bigger.big" approach packs Dimensity 9300 with improved efficiency and performance over its predecessor.
MediaTek upgrades Wi-Fi 7 portfolio with 6-nm chips 11/23/2023
MediaTek unveiled a pair of 6-nanometer-based Wi-Fi 7 chipsets designed to boost speed and performance. The Filogic 860 is aimed at enterprise access points, Ethernet gateways and mesh nodes among other router applications, while the Filogic 360 is designed for consumer electronics, including edge and streaming devices.
Samsung prepping low latency wide dynamic DRAMs for AI, expanding in Texas 11/23/2023
Samsung Electronics is planning next year to release low latency wide dynamic random access memory for use in AI devices and debut advanced 3D chip packaging. The company is expanding its operations in Taylor, Texas, adding a 2.7 million-square-foot facility.
Siemens Expanding Chip Reliability Verification Offering Through Insight EDA Acquisition 11/23/2023
Siemens has acquired Insight EDA to expand its Calibre integrated circuit reliability verification offering.
Himax Technologies to Enable the Next Level in Ultra-low Power Endpoint AI Processing 11/23/2023
Specialized AI processors that push efficiency boundaries will be key to enabling many AI applications at the endpoint.
Asus wants to build a US facility for its server business amid AI demand 11/22/2023
Taiwanese computer, phone, and electronics maker Asus said last week that it intends to build a server production line in the U.S. The company has begun its U.S. production project in Silicon Valley where they are looking to assemble semi-finished parts for its growing server system business,
27 tech firms OK'd to manufacture hardware in India 11/22/2023
Lenovo, HP and Dell join two dozen companies that have received approval under India's incentive plan to increase domestic production of IT hardware. The ministry of electronics and IT says the companies plan to invest $360 million and create 200,000 jobs, which is expected to increase India's IT hardware market to $22.77 billion within four years.
SCHURTER Expands Manufacturing Facility in Romania 11/22/2023
The expansion of SCHURTER's production plant in Romania increases capacities and strengthens customer service.
onsemi Opens EV Systems Application Lab in Europe 11/22/2023
onsemi has opened an application test lab in Slovakia, focused on the advancement of system solutions for EVs.
SK Hynix, Nvidia working on 3D HBM redesign 11/21/2023
SK Hynix is said to be teaming up with logic designers including Nvidia to stack HBM4 directly on processors, according to reports. The design, which is similar to AMD's 3D V-Cache, would eliminate interposers.
Mini LED Market to Rebound in 2024, Continue Growth Until 2027 11/21/2023
Due to declining demand in consumer electronics, shipments of Mini LED products are expected to decrease to 13.337 million units in 2023, according to TrendForce’s “2024 New Mini LED BLU Display Trend Analysis” report. However, the market is projected to rebound in 2024, with shipments estimated at 13.792 million units
Ansys and Sony to Partner on Next-Gen Simulation of Automotive Image Sensors 11/21/2023
Ansys collaborated with Sony to enhance high-fidelity image sensor simulation and camera-based features in new automotive applications.
Rapidus and Tenstorrent to Jointly Develop IP for AI Edge Devices on 2nm Logic 11/21/2023
Rapidus is partnering with Tenstorrent to develop semiconductor IP in the field of AI edge devices based on 2nm logic semiconductors.
Intel commits to 2050 upstream supplier net-zero goal 11/20/2023
Intel is adding to its company sustainability targets by setting a goal to help its suppliers reach net-zero upstream greenhouse gas emissions by 2050. Intel is asking suppliers to aim for 100% renewable electricity and net-zero goals, while Intel looks downstream for carbon footprint reduction and increased energy efficiency.
US probes Applied Materials over shipment of equipment to SMIC 11/20/2023
Semiconductor equipment maker Applied Materials (AMAT.O) is under U.S. criminal investigation for potentially evading export restrictions on China's top chipmaker SMIC,
Qualcomm Transforms Smartphones to Genius-Phones 11/20/2023
Qualcomm's Snapdragon 8 Gen 3 mobile SoC is purpose-built for on-device generative AI.
Infineon and Archetype AI to Collaborate on Sensor Solutions with AI Functionalities 11/20/2023
Infineon will pilot a new AI model that can uncover the hidden patterns of behavior in unstructured sensor data.
Samsung’s increased spending on mobile AP chips attracts attention 11/17/2023
Samsung Electronics spent $6.89 billion on mobile application processor chips as of the end of third quarter -- significantly more than AP purchases over the same period in 2022, data shows. Samsung is also recruiting top talent as it looks to secure its place in AI and chip technologies, according to its quarterly report.
IDC Expects 20% Semiconductor Market Growth in 2024 11/17/2023
International Data Corp. (IDC) has upgraded its semiconductor market outlook by calling a bottom and return to growth that accelerates next year. IDC raised its September 2023 revenue outlook from $518.8 billion to $526.5 billion in a new forecast.
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