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Appeals court overturns $2.18B ruling in Intel patent case 12/6/2023
The US Court of Appeals for the Federal Circuit overturned a 2021 verdict in the patent case between Intel and VLSI Technology, which originally ruled that Intel had to pay a 2.18 billion patent-infringement fine. A new trial will determine damages involving a second VLSI patent.
TrendForce Expects Over 20% Surge in NAND Flash Revenue in Q4 2023 12/6/2023
As market leaders like Samsung implemented substantial production cuts, buyers’ attitudes shifted toward a more aggressive procurement strategy in anticipation of a market supply decrease.
Steering Clear of Danger — The Path to Safe Autonomous Vehicles 12/6/2023
The prevalence of intelligent software in vehicle and driver assistance systems will help minimize human error—creating safer vehicles.
Meta scientist: AI likely won't outsmart humans for decades 12/5/2023
Meta chief AI scientist Yann LeCun says AI won't reach sentience for decades and the world will see "dog-level" AI way ahead of human-level intelligence because of the limits of training on texts. "There's a lot of really basic things about the world that they just don't get through this kind of training," LeCun says.
BIWIN Launches New PCIe Gen4 SSD for PC OEMs 12/5/2023
BIWIN has extended a new DRAM-less PCIe 4.0 SSD, the AP860, which is suitable for desktops, laptops, and all-in-one computers. This new product offer high performance, large capacity, excellent compatibility, quality consistency, and supply stability.
Energy Collaborative to Help Accelerate Installation of Greener Energy Sources in APAC 12/5/2023
The Energy Collaborative aims to understand and clear roadblocks to the installation of low-carbon energy sources in APAC region.
BIWIN Packaging and Testing Center Achieves IATF 16949 Recognition 12/5/2023
BIWIN's Huizhou Manufacturing Center recently received IATF 16949:2016 certification for automotive industry quality management systems.
Huawei eyeing its own chip network amid US ban 12/4/2023
Huawei Technologies is reportedly building "a self-sufficient chip network" to bypass the US technology import restrictions. Huawei has allegedly transferred patents to SiCarrier, whose subsidiaries could give Huawei access to enterprises that develop lithography equipment, reports say.
Amkor plans $2B chip packaging and testing facility in Ariz. 12/4/2023
Amkor Technology is building an advanced packaging facility in Arizona with a $2 billion investment in the US semiconductor supply chain. Apple is expected to be the facility's first customer, with plans to test and package chips produced at a nearby Taiwan Semiconductor Manufacturing Co. site.
Cadence Powers Samsung Foundry’s Breakthrough Success on 5G Chip Design 12/4/2023
Samsung Foundry achieved a 2X productivity boost that led to faster design closure versus its previous design methodology.
Fabless Startup DEEPX Lands 3 CES Innovation Awards 12/4/2023
DEEPX has been recognized as a globally innovative technology by winning the CES Innovation Award in three categories.
Intel plans to spend $14B on its chips at TSMC 12/1/2023
Intel is expected to spend $4 billion on making its chips at Taiwan Semiconductor Manufacturing Co. next year and another $10 billion on orders in 2025, according to a report from analyst Andrew Lu. Intel is likely to displace Advanced Micro Devices as TSMC's second biggest 3-nanometer client, behind Apple,
Nvidia reigns as most profitable chip brand amid AI demand 12/1/2023
Nvidia's profits hit $10.42 billion in the third quarter as it worked to meet global demand for AI chips and serving big-name clients Meta and Microsoft. The strong quarter put it ahead of Intel and Samsung, but CEO Jensen Huang noted that US supply chain independence is still up to two decades away.
How Greener Packaging Can Help Eliminate Li-Ion Battery Liability 12/1/2023
One of the biggest threats is battery explosion that leads to thermal runaway.
TMYTEK Showcases Latest mmWave Testing Solution at MWE 2023 12/1/2023
TMYTEK's UD Box 5G and UD Box 0630 unleash enhanced production and testing flexibility for 5G/6G, satcom and radar sensing.
Solving HDR Challenges in Newest Driving Systems 11/30/2023
Makers of CMOS image sensors for automotive use cases face growing challenges.
Imec offers chip designers courses to close skills gaps 11/30/2023
Imec has devised three courses for chip designers. Launched by Professor Patrick Reynaert of KU Leuven the courses are designed to coach individuals to becoming proficient chip designers.
Nvidia recruiting AV talent in China 11/30/2023
Nvidia is looking to add to its autonomous vehicle team by recruiting in China to fill positions under Xinzhou Wu, the head of automotive, who was hired in August. Nvidia introduced its automotive-grade Thor chips last year that boast 2,000 teraflops of performance.
HBM chip competition expected to grow in the new year 11/30/2023
Samsung Electronics, Micron Technology and SK Hynix are set to compete for Nvidia orders as demand for high bandwidth memory picks up for generative AI applications, according to reports. SK Hynix has led the way, but Samsung's upcoming HBM3 and Micron's HBM3E are seen as contenders
Rapidus seeks engineers to revive Japan's chip industry 11/29/2023
Government-backed Japanese chip foundry venture Rapidus is hunting high and low - including among industry veterans and overseas - to find engineers to help it revive a chip industry that was once the envy of the world.
5G chipset market on pace to hit $92B 11/29/2023
The market for 5G chipsets is likely to increase at a compound annual growth rate of 21% by 2030 to reach a valuation of $92 billion, according to Adroit Market Research. Automotive, health care and entertainment are among the industries driving the growth of specialized 5G chipsets.
NXP Launches Next-gen Automotive Ultra-Wideband ICs 11/29/2023
NXP's Trimension NCJ29D6 automotive single-chip UWB combines next-gen secure and precise real-time localization with short-range radar.
MediaTek's Ming-Kai Tsai to Receive IEEE Robert N. Noyce Medal 11/29/2023
MediaTek Chairman Ming-Kai Tsai will receive one of the most prestigious awards in the electronics industry.
Strong quarter drives SK Hynix to all-time high in DRAM 11/28/2023
Samsung Electronics remains atop the world DRAM market with a 39.4% third-quarter market share, with SK Hynix in second place at 35%, its all-time high after a gain of 4 percentage points, Omdia reports. The company generated $4.63 billion in DRAM revenue in the third quarter.
Industry's revenue up for 2nd straight quarter 11/28/2023
Revenue in the semiconductor industry was up 8.3% in the third quarter compared to the prior quarter, with SK Hynix and Nvidia notable beneficiaries, according to industry tracker Omdia. Revenue was spurred by AI demand, reaching an estimated $139 billions.
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