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| JEDEC publishes GDDR7 Graphics Memory Standard |
3/21/2024 |
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JEDEC has published JESD239, a GDDR7 Graphics Memory Standard for AI, graphics and gaming applications. The new standard doubles the bandwidth of GDDR6 for up to 192 GB/s per device.
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| US considers sanctions for Huawei-linked firms |
3/21/2024 |
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The US is weighing sanctions against semiconductor companies with ties to Huawei Technologies, sources say. "Adding more Chinese companies to the US Entity List is a highly likely event," according to Jefferies analyst Edison Lee, who wrote, "It is easy to implement and justify, and it will further block certain key Chinese companies from being able to exploit current loopholes in export restrictions.
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| 300mm Chip Equipment Spending Forecast to Hit Record 7B in 2027 |
3/21/2024 |
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Global 300mm fab equipment spending for front-end facilities is forecast to reach a record $137 billion in 2027 after topping $100 billion for the first time by 2025 on the strength of the memory market recovery and strong demand for high-performance computing and automotive applications.
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| Intel awarded $8.5B in CHIPS funding |
3/21/2024 |
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The award is the largest yet from the Biden administration and will help advance the chipmaker's plants in Arizona, New Mexico, Ohio and Oregon.
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| SK Hynix mass producing HBM chips for AI chipsets |
3/20/2024 |
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SK Hynix has started mass producing its HBM3E high-bandwidth memory chips and plans to send shipments to Nvidia for AI chipsets this month, sources say. Micron Technology and Samsung Electronics are also developing HBMs, though only SK Hynix supplies Nvidia.
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| TSMC eyes Japan for advanced packaging |
3/19/2024 |
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Taiwan Semiconductor Manufacturing Co. is considering building advanced chip packaging capacity in Japan, sources say. Early deliberations are underway that could bring its chip on wafer on substrate packaging tech to Japan, according to the sources.
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| Top 5 IC Equipment Makers’ Revenue Down 1% YoY in 2023 |
3/18/2024 |
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Out of these five WFE vendors, ASML and Applied Materials managed to post YoY growth in 2023 while Lam Research, Tokyo Electron and KLA’s revenues declined by 25%, 22%, and 8% YoY, respectively. Strong DUV and EUV sales drove ASML to the top position in 2023.
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| 3M appoints new CEO |
3/18/2024 |
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The manufacturing giant named former L3Harris Technologies CEO William Brown as its chief executive, effective May 1.
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| Chipmakers focus on growing talent with apprenticeships |
3/18/2024 |
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Taiwan Semiconductor Manufacturing Co. and NXP Semiconductor are scaling up apprenticeship programs to fill the skills gap as more chip facilities are built in the US. The National Institute for Innovation and Technology, which is contracted by the Labor Department to expand apprenticeships in the semiconductor industry and related supply chain, is active in 22 states and is working on a national network of training providers.
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| Swisscom to buy Vodafone Italia for 8 billion euros |
3/15/2024 |
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Swisscom said it will buy Vodafone Italia for 8 billion euros and merge the business with its Italian subsidiary Fastweb. The deal will create Italy's second-biggest fixed-line broadband operator behind TIM, with a strong presence in the prized business segment.
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| Enterprise SSD revenues surged 47.6% in Q4 |
3/14/2024 |
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Prices surged, lifting Q4 revenues by 47.6% compared with Q3 to $23.1 billion. SK Group (SK Hynix + Solidigm), Samsung Electronics and Micron Technology topped the sales ranking
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| AI chip race: Samsung reportedly turns to MUF tech |
3/14/2024 |
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Samsung Electronics is going to use the molded underfill chipmaking technique for its high bandwidth memory chips ad interest in generative AI heats up, sources say. Rival SK Hynix made the switch to mass reflow molded underfill to address production issues with non-conductive film.
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