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Texas Instruments begins construction on 300-mm fab in Utah 11/8/2023
In February, TI announced its $11 billion investment in Utah, marking the largest economic investment in state history. LFAB2 will create approximately 800 additional TI jobs as well as thousands of indirect jobs, with first production in 2026.
Baidu orders $61.83M in AI chips from Huawei 11/8/2023
Baidu has ordered 1,600 910B Ascend AI chips from Huawei Technologies for about $61.83 million to be delivered by the end of the year. The chips were developed as an alternative to the A100 chip from Nvidia.
NXP and Zendar Collaborate to Accelerate Development of High-resolution Radar 11/8/2023
NXP and Zendar will collaborate on enhanced high-resolution radar systems for automotive applications by leveraging Zendar's DAR technology.
Canon Litho Tool is Years behind from ASML's EUV equipment 11/8/2023
“Defectivity and alignment have been perpetual problems and limitations of nanoimprint,” Maire said. “We do applaud Canon in making excellent progress, by the relentless engineering that Japanese firms are known for, but basic technical limitations still remain.”
Siemens to invest a further $290 million (271 million euros) in the United States 11/7/2023
It will invest $140 million in two electrical-products manufacturing plants in Grande Prairie, Texas, and Pomona, California, the company said.
China’s Share in Mature Process Capacity Predicted to Climb to 33% by 2027 11/7/2023
Leading the charge are giants like SMIC, HuaHong Group, and Nexchip, while Taiwan’s share is estimated to consolidate from 49% down to 42%.
DuPont and ST Develop Smart Wearable Device Concept for Monitoring Biosignals 11/7/2023
By collaborating with others across the healthcare ecosystem—from technology developers and material suppliers to device fabricators and OEMs—DuPont is developing more patient-centric solutions that contribute to better patient outcomes.
Bluetooth: Keep finding new applications 11/7/2023
Bluetooth's spread and evolution continue and suppliers of the omnipresent tech are innovating across applications once unimagined.
NXP to implement distributed aperture radar for automated driving 11/6/2023
NXP is investing in startup Zendar's distributed aperture radar software for its automated driving ICs. NXP says the technology "fuses information from multiple radar sensors on a vehicle to create a larger effective antenna" and eliminates the need for multiple antenna channels.
China Chipmaker YMTC Spent $7 Billion to Overcome U.S. Sanctions 11/6/2023
Yangtze Memory Technologies Corp. spent $7 billion in a year's time after losing money from US sanctions against China's semiconductor industry. The company, which makes 3D NAND memory, recently secured billions of dollars in funding.
Global Shipments of Tablets and Chromebooks Continue Downtrend in 3Q 2023 11/6/2023
Worldwide tablet shipments posted a decline of 14.2% year-on-year in the third quarter of 2023 (3Q 2023), totaling 33.2 million units, according to preliminary data from the International Data Corp. (IDC)
Taiwan and Japan to Build JSMC’s First Fab in Miyagi Prefecture 11/6/2023
PSMC, SBI, Japan's Miyagi Prefecture, and JSMC signed an MoU confirming that JSMC's first fab will be selected in Japan.
Chinese Memory Maker Gets $2 Billion Govt Fund Infusion 11/3/2023
Changxin Xinqiao has received funding from the China Integrated Circuit Industry Investment Fund.
Chipmakers likely to see revenue upswing in H2 11/3/2023
Nvidia, Advanced Micro Devices and Intel should expect a bump in revenue in the second half of 2023 as notebook/PC and server markets stabilize and demand for high-performance computing chips rises, according to estimates from DigiTimes Research analyst Eric Chen. The chipmakers are launching GPU/CPU products amid demand for AI model training.
Japan Gearing Up to Strengthen Semiconductor Industry 11/3/2023
Based on Japan’s geographical characteristics, TrendForce has identified three potential semiconductor hubs that might emerge in Japan, located in Kyushu, Tohoku, and Hokkaido respectively.
Blue Solutions and Foxconn to Collaborate on Solid-state Battery Ecosystem 11/3/2023
Blue Solutions and Foxconn will jointly develop a solid-state battery ecosystem for the electric two-wheeler market.
YMTC offers 3D QLC NAND memory touts 232 layers, highest density 11/2/2023
The new 3D NAND memory devices boast the industry's highest recording density of as well as extreme performance due to Xtacking 3.0 architecture.
Samsung plans to up NAND prices, lower production 11/2/2023
Samsung Electronics Co. has formed a strategy to increase NAND prices by 20 percent each quarter until the second quarter of 2024. The move is the company’s bid to reverse the market in the first half of next year by stabilizing NAND prices.
AMD touts MI300 series, expects $2B from AI chips in 2024 11/2/2023
Advanced Micro Devices expects to launch its MI300 series of AI chips soon and reports surging demand for graphics processing units that can train generative AI models. AMD says data center GPU revenue in the fourth quarter will likely hit $400 million and could top $2 billion in 2024.
Modi Wants India to Take Global Leadership in 6G 11/2/2023
At IMC 2023, PM Narendra Modi raised the clarion call for India to take a leadership role globally in 6G.
Intel divests its silicon photonics line to Jabil 11/1/2023
Intel has signed an agreement with Jabil to divest its silicon photonics module line, Intel's third divestiture in recent months. Jabil executive Matt Crowley sees the move as a way for Jabil to increase its support in the data center ecosystem.
Vietnam in early talks to build country's first fab 11/1/2023
The Southeast Asian electronics manufacturing hub already hosts U.S. giant Intel's (INTC.O) largest semiconductor packaging and testing plant worldwide and is home to several chip designing software firms. It is working on a strategy to attract more semiconductor investment, including from foundries, which focus on manufacturing chips.
Samsung to focus on AI chips in 2024 amid recovery 11/1/2023
Samsung Electronics is planning to boost its production of high-bandwidth memory next year as demand for AI chips continues. The company's operating loss narrowed in the third quarter, and sources say Samsung has secured an order for Google's Tensor G4 chipset for next year's Pixel 9 smartphone.
UMC Launches Wafer-to-Wafer 3D IC Project 11/1/2023
UMC has initiated the W2W (wafer-to-wafer) 3D IC project to help customers accelerate production of their 3D products.
Nvidia: Feds immediately halting AI chip exports to China 10/31/2023
The restrictions were supposed to be introduced 30 days from 17 October. That was when President Joe Biden's administration announced measures to block countries, including China, Iran and Russia, from buying high-end AI chips designed by Nvidia and others.
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