Infineon Technologies AG has announced plans to build a new R&D center in Taiwan. Under the “Infineon Advanced Automotive and Wireless Communication Semiconductor Future Research Partnership Development Plan,” Infineon will upgrade its existing wireless communication R&D laboratory and establish the “Infineon Advanced Automotive and Wireless Communication Semiconductor R&D Center,” which will collaborate with local industry-academic research partners to develop automotive-grade communication chips and innovative application solutions.

The project, with total investment expected to reach NT$1.2 billion, has received support from the Ministry of Economic Affairs’ (MOEA) A+ Project, and is projected to boost Taiwan’s automotive electronics industry output to NT$60 billion.

Infineon’s project includes the complete development of next-generation automotive Bluetooth chip products in Taiwan. By introducing international automotive electronics R&D experts, facilitating exchanges with local researchers and industry clients, it aims to cultivate expertise in the automotive field, completing the full process of design, production, and testing of next-generation Bluetooth chips in the country.

Infineon will collaborate with institutions such as the Industrial Technology Research Institute (ITRI), National Taiwan University (NTU), National Cheng Kung University (NCKU), and National Taipei University of Technology, along with several local network communication module manufacturers and automotive system developers. They will develop application scenarios and solutions for wireless communication technologies like Wi-Fi and Bluetooth in automotive applications, including wireless battery management systems (BMS), next-generation smart cabins, and intelligent car access systems.

In a statement, MOEA Minister of Economic Affairs Jyh-Huei Kuo said the establishment of the R&D center will help introduce advanced automotive wireless control technology in Taiwan, enhance technical cooperation between domestic manufacturers and international automotive electronics experts, and accelerate Taiwanese firms’ entry into the global automotive industry supply chain.

Sam Geha, Infineon’s Executive Vice President of IoT, Compute, and Wireless, said that the company continues to be impressed with Taiwan’s vibrant innovation ecosystem, including its highly skilled R&D talent and strong industrial clusters.

Geha added that Infineon is continuously enhancing its R&D capabilities and looks forward to further enriching and expanding its collaboration with local partners.

By: DocMemory
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