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| Worldwide Chip Sales Up 21% YoY in August |
10/9/2024 |
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“The global semiconductor market continued to grow substantially in August, hitting its highest-ever sales total for the month of August, and month-to-month sales increased for the fifth consecutive month. Year-to-year sales increased by the largest percentage since April 2022,
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| TSMC and Amkor link up to bring advanced packaging stateside |
10/8/2024 |
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The advanced packaging facility is set to be built in Peoria, Arizona. Notably, fan-out wafer packaging, a technology used by companies like Apple to connect memory to processors in iPhones and MacBooks, will be a focal point at the site.
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| JEDEC Releases New Standard for LPDDR5/5X Serial Presence Detect (SPD) Contents |
10/7/2024 |
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JEDEC has announced the publication of the JESD406-5 LPDDR5/5X Serial Presence Detect (SPD) Contents V1.0, which outlines the content of the SPD non-volatile configuration device included in standard memory modules using LPDDR5/5X SDRAMs. This allows application software and BIOSes to determine the module capacity, speed, I/O configuration, and content revision level. The release aims to expand the market for these components and ensure consistent support for incorporating LPDDR5 devices into systems, particularly for notebook computers.
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| Samsung begins mass production of SSD for AI PCs |
10/7/2024 |
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Samsung Electronics has started mass production of its PM9E1 solid-state drive, designed for AI PCs. The SSD features 8th-generation V-NAND technology and a 5-nanometer-based controller for performance and power efficiency.
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| Samsung preps for industry downturn, plans global job cuts |
10/3/2024 |
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Reports suggest that the electronics giant is seeking to slash jobs at its global outposts, while brokerages are casting pessimistic outlooks on the company’s third-quarter earnings, stoking fears that Samsung is facing a crisis
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| Biggest dockworker strike in nearly half a century |
10/3/2024 |
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Long lines of container ships are queueing up outside major US ports as the biggest dockworker strike in nearly half a century enters its third day, preventing unloading and threatening shortages of everything from auto parts to hamburgers.
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| First silicon-proven 3nm 24 Gbps UCIe subsystem validated |
10/2/2024 |
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Built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology this complete PHY and controller subsystem, developed in close collaboration with TSMC, is tailored for high-demand applications such as hyperscale data centres, high-performance computing (HPC), and AI.
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