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Cadence Launches Neo NPU IP and NeuroWeave SDK for Silicon Design 9/18/2023 Cadence's next-generation AI IP and software tools address the escalating demand for on-device and edge AI processing. Taiwan to be the biggest semiconductor fab equipment buyer next year at $23 billion 9/15/2023 South Korea ranks second at $22 billion, China at third with $20 billion and the US comes in at fourth with $14 billion. Chip industry to faces overcapacity 9/15/2023 Future Horizons CEO Malcolm Penn says the semiconductor industry is deep in "Pig Cycle economics," with overcapacity glutting the market. Capital expenditures in the first quarter hit a record high, and Penn notes, "If it all goes into capacity, the industry will choke on it. It is just not possible for the industry to absorb it all. Microchip and IHWK Team Up to Accelerate Edge AI/ML Inferencing 9/15/2023 Microchip is assisting IHWK with the development of its neuromorphic computing platform by providing an evaluation system based on its NVM technology. High-power computing solutions are needed to support modern innovations 9/15/2023 Handling the Challenges of Building HPC Systems for the future. TSMC grabs 10% stake in IMS Nano, earmarks $100M for Arm IPO 9/14/2023 Taiwan Semiconductor Manufacturing Co. is buying a 10% stake in IMS Nanofabrication from Intel for $430 million. TSMC is also investing as much as $100 million in Arm's initial public offering. Atm developing system-on-chip designs for various high-growth markets 9/14/2023 Arm confirmed that it was offering its customers to license 'SoC solutions' rather than just IP in its IPO filing with the SEC. DRAM and NAND Flash Bit Demand Forecast to Jump 13% and 16% in 2024 9/14/2023 TrendForce anticipates year-on-year (YoY) bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively, in 2024. Cadence AI-based Tool Enables 5X Faster PCB Design 9/14/2023 Cadence's OrCAD X Platform streamlines the system design process and empowers designers through cloud scalability and AI-powered placement automation ... Samsung has made a 50% production cut in NAND production from September 9/13/2023 Other suppliers are expected to follow suit and increase their production cutbacks in Q4 to accelerate inventory reduction. Wi-Fi 7 to Play Fundamental Role in Transforming How People Live, Work and Play 9/13/2023 WBA has released a new report exploring how Wi-Fi 7 will transform how people worldwide live, work and play. GlobalFoundries Officially Opens Expansion Facility in Singapore 9/13/2023 The expansion fab will boost GF Singapore's overall capacity to approximately 1.5 million wafers (300mm) each year. Arm IPO gets more complicate 9/13/2023 Japanese tech conglomerate SoftBank aimed for the IPO after an attempt to sell Arm for $40 billion to Nvidia last year failed because U.S. and European regulators cited antitrust concerns. SoftBank aims to sell a 10% stake in Arm in the IPO, for as much as $70 billion, according to Reuters. That would make it one of the world’s largest IPOs this year while allowing SoftBank to keep a controlling stake in Arm. US and Vietnam Partner to Explore Semiconductor Supply Chain Opportunities 9/12/2023 The partnership will help create a more resilient, secure, and sustainable global semiconductor value chain. Optimizing Servers for Lower Operating Costs and Reduced Carbon Footprint 9/12/2023 Data centers need to implement practices that reduce energy demand to help governments and businesses reach their environmental goals. South Korean manufacturer SKC Co.to invest in U.S. semiconductor packaging startups 9/12/2023 The investment in Chipletz, an Austin-based fabless company, will give SKC an approximately 12 percent stake in the U.S. firm through a Series B funding, the Seoul-based company said in a release. Huawei is put on watch for a possible come back 9/12/2023 Huawei was put into the spotlight after it launched the Mate 60 Pro powered by a secretive SMIC-made SoC. However, it is too early to be optimistic about Huawei's breakthrough from US sanctions. Qualcomm thinks AI could give the smartphone market a fresh lease on life 9/11/2023 Qualcomm CEO Cristiano Amon said he sees significant opportunity in AI ahead, and that the company’s upcoming Snapdragon Summit in October could lead to major developments in mobile technology. China chipmakers to get more government help to boost semiconductor industry 9/11/2023 Beijing has been pushing its firms to develop local technologies as the country’s top chipmakers, including Semiconductor Manufacturing International Corp. and Hua Hong Semiconductor Ltd., rely on foreign-made equipment. China domestic EV markeet slows down 9/11/2023 Battery electric vehicle (BEV) unit sales in China grew by 37% year-on-year (YoY) in the second quarter, lower than the global average of 50%, highlighting a slowdown in domestic growth as the frail Chinese economy impacted demand in the world’s biggest EV market, Cadence Completes Acquisition of Rambus' PHY IP Business 9/11/2023 Cadence has completed the acquisition of Rambus's SerDes and memory interface PHY IP business. GTA Semiconducto of Shanghai, China raises $1.8bn 9/8/2023 GTA Semiconductor of Shanghai, the Chinese auto IC manufacturer, has raised $1.8 billion to bring the amount it has raised in the last two years to $2.7 billion with most of it coming from the government. SK hynix to investigate why the Huawei Mate 60 contain LPDDR5 that supposed to be in sanction 9/8/2023 "SK hynix no longer does business with Huawei since the introduction of the U.S. restrictions against the company and with regard to the issue, we started an investigation to find out more details," the chipmaker said. Micron CEO Sanjay Mehrotra to Receive Noyce Award 9/8/2023 Micron President and CEO Sanjay Mehrotra is the 2023 recipient of SIA's highest honor, the Robert N. Noyce Award. Startups Alitheon and Cybord tackle the problem of counterfeit chips in the electronics supply chain 9/8/2023 The two startups are using different methods of “fingerprinting” to improve traceability and eliminate potentially disastrous system failures caused by the adoption of outdated or sub-standard components.  46  |  47  |  48  |  49  |  50  |  51  |  52  |  53  |  54  |  55

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