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| Chipmakers likely to see revenue upswing in H2 |
11/3/2023 |
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Nvidia, Advanced Micro Devices and Intel should expect a bump in revenue in the second half of 2023 as notebook/PC and server markets stabilize and demand for high-performance computing chips rises, according to estimates from DigiTimes Research analyst Eric Chen. The chipmakers are launching GPU/CPU products amid demand for AI model training.
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| Samsung plans to up NAND prices, lower production |
11/2/2023 |
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Samsung Electronics Co. has formed a strategy to increase NAND prices by 20 percent each quarter until the second quarter of 2024. The move is the company’s bid to reverse the market in the first half of next year by stabilizing NAND prices.
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| AMD touts MI300 series, expects $2B from AI chips in 2024 |
11/2/2023 |
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Advanced Micro Devices expects to launch its MI300 series of AI chips soon and reports surging demand for graphics processing units that can train generative AI models. AMD says data center GPU revenue in the fourth quarter will likely hit $400 million and could top $2 billion in 2024.
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| Intel divests its silicon photonics line to Jabil |
11/1/2023 |
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Intel has signed an agreement with Jabil to divest its silicon photonics module line, Intel's third divestiture in recent months. Jabil executive Matt Crowley sees the move as a way for Jabil to increase its support in the data center ecosystem.
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| Vietnam in early talks to build country's first fab |
11/1/2023 |
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The Southeast Asian electronics manufacturing hub already hosts U.S. giant Intel's (INTC.O) largest semiconductor packaging and testing plant worldwide and is home to several chip designing software firms. It is working on a strategy to attract more semiconductor investment, including from foundries, which focus on manufacturing chips.
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| Samsung to focus on AI chips in 2024 amid recovery |
11/1/2023 |
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Samsung Electronics is planning to boost its production of high-bandwidth memory next year as demand for AI chips continues. The company's operating loss narrowed in the third quarter, and sources say Samsung has secured an order for Google's Tensor G4 chipset for next year's Pixel 9 smartphone.
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| Nvidia: Feds immediately halting AI chip exports to China |
10/31/2023 |
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The restrictions were supposed to be introduced 30 days from 17 October. That was when President Joe Biden's administration announced measures to block countries, including China, Iran and Russia, from buying high-end AI chips designed by Nvidia and others.
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| SK Hynix books 2024 capacity of HBM3/3E |
10/31/2023 |
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SK Hynix says it has fully booked its HBM3 and HBM3E capacity for next year with customers asking for more. High bandwidth memory is forecast to increase 60% to 80% each year over the next five years.
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| Mouser Electronics Inks Distribution Agreement with Siemens for Industrial Automation Solutions |
10/31/2023 |
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Mouser Electronics Inc. is partnering with Siemens on its distribution of industrial automation solutions. Siemens’ operations encompass factory automation and digitalization in the process and manufacturing industries, intelligent infrastructure for buildings and distributed energy systems, rail transport solutions, as well as health technology and digital healthcare services.
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| Huawei's Mate 60 Pro with 5G lifts its market share |
10/30/2023 |
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Huawei Technologies has seen success in China with its Mate 60 Pro smartphone with 5G connectivity and advanced chip technology, with sales up 37% year over year, Counterpoint Research reports. Its market share rose to 12.9% from 9.1% last year, while Apple, Oppo and Vivo saw declines in the double digits.
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| Western Digital, Kioxia halt merger talks |
10/30/2023 |
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Sources say Western Digital and Kioxia have ended negotiations over a planned merger amid opposition from SK Hynix, an investor in Kioxia. The companies were also in disagreement about the semiconductor memory business merger conditions set by Kioxia shareholder Bain Capital.
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| HPC, AI, and HBM Driving the Future of Medical Research |
10/30/2023 |
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High-performance computing (HPC), designed for computationally intensive workloads, is helping life sciences and medical researchers get answers faster and more cost-efficiently. When combined with accelerated computing, AI, high-bandwidth memory (HBM) and other advanced memory architectures.
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| SK Hynix prioritizes DDR5, HDM chips |
10/27/2023 |
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SK Hynix is planning to increase investments in DDR5 and high bandwidth memory chips amid growing demand for AI. The chipmaker also announced its opposition to the proposed Kioxia-Western Digital merger.
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| Expedera Expands Global Presence with New R&D Office in Singapore |
10/27/2023 |
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“The new subsidiary will develop complementary technologies and services that improve customer experience. We aim to position Expedera as the solution provider of choice for system architects and chip designers who demand the highest-performing, lowest-power edge inference engine.”
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| Renesas Launches Induction Motor Position Sensing Technology |
10/27/2023 |
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Renesas Electronics Corp. has developed an inductive position sensor (IPS) technology for highly accurate motor position sensor ICs for robotics, industrial and medical applications. Utilizing non-contact coil sensors, the position sensing technology can replace expensive magnetic and optical encoders now commonly used in motor control systems
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| Micron embedded products power Qualcomm's XR platform |
10/26/2023 |
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Micron Technology asserts that its low-power double data rate 5X DRAM and Universal Flash Storage 3.1 bring speed and performance to Qualcomm Technologies' extended-reality platform. The Snapdragon XR2 Gen 2 processor offers untethered mixed reality and virtual reality, and the LPDDR5X boosts power efficiency 24% over previous generations, Micron says.
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