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Wave of used DDR4 DRAM are getting into new memory modules 8/3/2023 Besides putting additional downward pricing pressure on a market that has almost imploded compared to its historic levels, there's also a justified concern that products packing these chips might fail earlier than expected. Arm looks at IPO value of $60 billion 8/3/2023 The latest target for Arm’s valuation underscores a shift in market mood in favor of technologies linked to generative AI and chips. Singapore launched new R&D program to build local capabilities for manufacturing high-performance electric drivetrains 8/3/2023 The new program—Electric Traction Module Open Technology Platform Collaborative Industry Project (E-TraM OTP CIP)—is expected to grow and uplift the pool of industry partners in the electric drivetrain sector, as well as create new technological capabilities and value chains for Singapore’s EV ecosystem. Companies are steadily designing their own custom silicon 8/3/2023 This trend doesn’t benefit suppliers of standard CPUs and SoCs like AMD, Intel and Qualcomm. But it’s very beneficial for other industry players, such as developers of EDA software, IP houses, contract chip designers and, of course, foundries. TeamGroup offers JEDEC-compliant DDR5-6400 kit 8/2/2023 DDR5 memory specification allows for speeds as high as DDR5-6400, but to date we've only seen on-spec kits (and processors) as fast as DDR5-5600. But at last, it looks like things are about to change and DDR5 is set to live up to its full potential Worldwide semiconductor OSAT market size will drop by 13.3% year on year in 2023 8/2/2023 It is estimated that the worldwide semiconductor OSAT market size will drop by 13.3% year on year in 2023. SK hynix has achieved automotive semiconductor software quality certification by adoption of Siemens software 8/2/2023 ASPICE (Automotive Software Process Improvement Capability dEtermination) is an international standard for evaluating the quality of software development processes, adopted by leading automotive OEMs. SK hynix has achieved ASPICE Certification Level 2 at March this year and will continue to pursue Level 3 and above. Infineon has launched two automotive-qualified serial FRAM devices in 1Mb and 4Mb densities 8/2/2023 The new devices, which are AEC-Q100 Grade 1 qualified and support an extended temperature range (-40°C to 125°C), complement a portfolio of automotive FRAM products ranging from 4kb up to 16Mb densities. Micron committed to ship from India 8/1/2023 Micron on Friday reaffirmed its commitment to establish India's first semiconductor plant in Gujarat, creating 5,000 direct jobs and addressing demand from domestic and international markets. India aims to lure US chipmakers with incentives, alliances 8/1/2023 India’s chip strategy consists of two major parts. The first is luring in foreign firms to set up operations and invest in the country while the second is on forming alliances with other key semiconductor nations like the U.S. Intel invests in education to address worker shortfall 8/1/2023 Intel is preparing for the opening of two semiconductor plants east of Columbus, Ohio by 2025, according to WOSU Public Media. The company intends to hire around 3,000 employees initially and is investing $17.7 million in eight academic institutions over three years for course development, equipment, and recruitment of students. Microsoft sees outages ahead if AI chip demand isn't met 8/1/2023 Microsoft is warning about possible disruptions in services if it is unable to secure graphics processing units for data centers as demand rises with the popularity of generative AI. TSMC pledge loyal ty to the Taiwan government 7/31/2023 TSMC production lines have expanded beyond Taiwan as Western powers have raised concerns about the crucial industry being centred on an island that China claims as its territory -- having ramped up political and military pressure on it over the past year. Analog Devices expandx Ore. wafer fab with $1B investment 7/31/2023 The facility investment expands cleanroom space to about 118,000 sq-ft and nearly doubles internal manufacturing of products running on the 180-nanometer technology node and above. Toshiba Corp. expects $15 billion buyout offer by a group led by Japan Industrial Partners in August 7/31/2023 The Tokyo-based firm sees the take-private bid as a chance to recover from years of scandals, management overhauls, losses in its nuclear power operations and the sale of its prized memory-chip business. Intel is back in the black after two quarters 7/31/2023 Intel, after two quarters of losses, returned to profitability in the second quarter and is outpacing analyst expectations in its Q3 forecast. CEO Pat Gelsinger says the plan is to "build AI into every product that we build. Micron Technology has begun sampling the industry’s first 8-high 24GB HBM3 Gen2 memory 7/28/2023 Those stats are a 50% improvement over currently shipping HBM3 solutions and with a 2.5 times performance per watt improvement over previous generations, Micron is claiming that its HBM3 Gen2 is setting new records for AI data centre metrics such as performance, capacity and power efficiency. onsemi has secured long-term supply agreements with 8 out of 10 leading global manufacturers of solar inverters 7/28/2023 By offering superior die technology with optimized and customized module design and packaging, onsemi enables solar inverter providers to compete on time-to-market, product development, supply resilience and robust quality assurance. Applied Materials’ Vistara platform is its most significant wafer manufacturing platform innovation in a decade 7/28/2023 Vistara was developed over more than four years by hundreds of engineers from across Applied’s hardware, software, process technology and ecoefficiency design teams. Silicon Box to build advanced silicon fab in Singapore 7/28/2023 Silicon Box has launched the world's most advanced semiconductor factory in Singapore, positioning the country as a global leader in high-performance. SK Hynix posted a second-quarter operating loss of $2.24 billion as demand for memory chips remained sluggish 7/27/2023 “In the future, the AI related semiconductors or the DRAMs, are going to have a big impact,” Anthony Sassine, senior investment strategist at KraneShares told CNBC Wednesday. “These are expected to grow between 35% to 40%. US outmatched by Taiwan on chips 7/27/2023 Acer founder Stan Shih said, the computer brand pioneer said that regardless of cultural factors, the U.S. would be unable to replicate Taiwan’s formula, CNA reported. NXP and Mahindra Ink MoU to Drive Next-Gen Smart E-Mobility 7/27/2023 Mahindra & Mahindra Ltd to jointly explore the electric and connected vehicle landscape, covering a wide range of vehicles including utility vehicles, light commercial vehicles, farm equipment, and tractors. Intel Collaboraties with Ericsson to Advance Next-Gen Optimized 5G infrastructure 7/27/2023 Intel will manufacture custom 5G SoCs for Ericsson to create highly differentiated leadership products for future 5G infrastructure . Foxconn and ADI looking to create more user-friendly automotive cockpits 7/26/2023 Foxconn CEO and Chair Young Liu and ADI CEO and Chair Vincent Roche signed the deal on July 20, according to Foxconn. The two companies will look to use ADI’s hardware and software solutions and Foxconn’s electronic design, system-level integration capabilities, and manufacturing expertise to create more user-friendly automotive cockpits.  48  |  49  |  50  |  51  |  52  |  53  |  54  |  55  |  56  |  57

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