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NXP and Mahindra Ink MoU to Drive Next-Gen Smart E-Mobility 7/27/2023
Mahindra & Mahindra Ltd to jointly explore the electric and connected vehicle landscape, covering a wide range of vehicles including utility vehicles, light commercial vehicles, farm equipment, and tractors.
Intel Collaboraties with Ericsson to Advance Next-Gen Optimized 5G infrastructure 7/27/2023
Intel will manufacture custom 5G SoCs for Ericsson to create highly differentiated leadership products for future 5G infrastructure .
Foxconn and ADI looking to create more user-friendly automotive cockpits 7/26/2023
Foxconn CEO and Chair Young Liu and ADI CEO and Chair Vincent Roche signed the deal on July 20, according to Foxconn. The two companies will look to use ADI’s hardware and software solutions and Foxconn’s electronic design, system-level integration capabilities, and manufacturing expertise to create more user-friendly automotive cockpits.
TSMC plans to invest $2.87 billion in an advanced chip packaging plant in Taiwan 7/26/2023
The investment was sparked by “the rapid growth of the AI market” which has “driven a surge in demand for TSMC’s advanced packaging,”
Cadence to acquire Rambus PHY IP assets 7/26/2023
Cadence Design Systems and Rambus, a chip and silicon IP provider, have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business.
Cerebras and G42 Unveil 4-exaFLOP Supercomputer 7/26/2023
Cerebras and G42 have launched Condor Galaxy, a network of nine interconnected supercomputers that offers a new approach to AI compute.
Global semiconductor industry’s shortage of workers is likely the largest impediment to growth 7/25/2023
Compensation for fab workers has soared, but that’s not helping to increase the supply of qualified workers. As an aging generation of semiconductor engineers prepares to retire, chipmakers are having difficulty finding younger people to replace them.
Foxconn’s failed India chip venture shows it is tough it is for new player 7/25/2023
“Established players such as TSMC, Samsung or Microncount with several decades of R&D (research and development), process engineering and trillions of dollars in investment to reach their current capabilities.”
TrendForce: NAND Flash ASP to Continue to Slide in 3Q23 7/25/2023
Given that the trajectory of market demand is still unclear, it is expected that the NAND flash market will continue to be in a state of oversupply in the third quarter (Q3 2023), according to TrendForce. Cautious inventory management by buyers is preventing a stabilization in NAND flash prices even with an anticipated seasonal surge in demand for the second half (H2 2023).
How can we ensure the IoT's growth will continue? 7/25/2023
What must we do, as an industry, to take the IoT to the next level? To drive the IoT forward, we must focus on:

Accelerating software,

Securing products,

Connecting teams, and

Empowering data governance.

Cadence to Acquire Rambus SerDes, Memory Interface PHY IP Business 7/24/2023
Rambus will retain its digital IP business, including memory and interface controllers and security IP.
US, Panama work together to improve semiconductor supply chain 7/24/2023
“The United States views Panama as a partner in ensuring the semiconductor supply chain is diverse and resilient,”
Taiwan's Powerchip wants to build new plant in Japan 7/24/2023
Powerchip and Japanese financial firm SBI Holdings (8473.T) earlier this month said they aim to attract government subsidies to build the plant amid a wave of investment in Japan aimed at boosting its chip manufacturing capabilities.
AMD open to new foundry partnerships 7/24/2023
Advanced Micro Devices (AMD), a U.S.-based chipmaker and rival to companies like Intel and Nvidia, will consider diversifying its production and partner foundries, as they are currently dependent on Taiwan Semiconductor Manufacturing Co., a reliance that could cause supply disruptions in case of conflict between the U.S. and China.
Samsung said that it had completed the development of the industry's first GDDR7 memory chip 7/21/2023
The new device will feature a data transfer rate of 32 GT/s, use pulse-amplitude modulation (PAM3) signaling, and promise a 20% power efficiency improvement over GDDR6.
Kioxia and Western Digital's looming merger to threaten Korean chipmakers 7/21/2023
Japanese NAND chipmaker Kioxia is ranked second in the global market, while San Jose-based Western Digital is ranked fourth. They account for 21.5 percent and 15.2 percent of the market share, respectively,
TSMC Delays Arizona Chip Output to 2025 on Worker Shortages 7/21/2023
Chairman Mark Liu said there are several challenges that TSMC faces at the US facility, including a shortage of skilled workers and expenses running higher than in Taiwan. The company is shifting some employees to Arizona to help with the development.
Tesla is working with Samsung on a 4-nm chip for the carmaker's Hardware 5.0 computers 7/21/2023
The goal was to design a super powerful and efficient chip to achieve self-driving in consumer vehicles without additional hardware like in the custom-built autonomous vehicles operated by Waymo and Cruise.
ASMLposted a jump in revenue and profit in the second quarter 7/20/2023
The Dutch company makes expensive machines that are required to manufacture the world’s most advanced chips. It counts giants like TSMC, the world’s biggest contract semiconductor maker, among its customers.
UK's anti-trust regulator gave clearance to Broadcom's $61 billion acquisition of VMware 7/20/2023
Broadcom Inc.’s proposed $61 billion takeover of VMware Inc. was provisionally waved through by the UK’s antitrust watchdog, easing the path toward one of the largest technology deals in history.
onsemi and BorgWarner Expand SiC Collaboration 7/20/2023
BorgWarner plans to integrate onsemi EliteSiC 1200V and 750V power devices into its VIPER power modules.
Embedded developers need the right tools to optimize RISC-V's advantages 7/20/2023
Embedded developers need the right tools to optimize RISC-V's advantages, Yet without the right tools, embedded software developers at OEMS and suppliers cannot make full use of the energy efficiency, simplicity, security and flexibility that RISC-V offers.
Infineon offers two new Ferroelectric RAM (F-RAM) memory devices in 1Mbit and 4Mbit densities 7/19/2023
The announcement comes as the market for automotive event data recorders (EDR) is driving demand for specialised data-logging memory devices that can instantly capture and reliably store critical data for decades.
Fabs using 300mm wafers to reach 180 by next year 7/19/2023
At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, While the semiconductor market downturn persists, 13 new 300mm wafer fabs are still being brought online in 2023. These new fabs are mostly for the production of power transistors, advanced logic, and foundry services.
TSMC earnings to be down 27% in Q2 7/19/2023
Taiwan Semiconductor Manufacturing Co.'s second-quarter earnings are expected to be down 27% year over year, according to analysts, with performance forecast to improve in Q3 on demand for AI.
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