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Samsung highlighted the shortage of semiconductor technology talent in the U.S. as a major obstacle 6/13/2023 The U.S. government has provided Samsung with considerable assistance, "however, it is not easy to solve the problem of insufficient technical talents and engineers needed by Samsung in the future." German officials refused Intel's request for increased subsidies 6/13/2023 Intel had planned to build a €17 billion fab complex but costs of energy and materials have now pushed that up to €20 billion. Originally Germany offered €6.8 billion in subsidies but Intel is now said to be asking for €10 billion Samsung Electronics management committee confirms approval of memory chip investment on May 17 6/13/2023 The company’s leadership appears to be putting strength in their outlook for a turnaround in the semiconductor market in the second half of this year. Marvell’s introduce high-speed silicon interconnects made on the new 3-nm process 6/13/2023 Marvell’s introduction of high-speed silicon interconnects made on the new 3-nm process at Taiwan Semiconductor Manufacturing Co. (TSMC) promises to stitch together chiplets that cut power consumption in data centers, Global semiconductor industry sales reached $40 billion during the month of April 2023 6/12/2023 SIA has announced global semiconductor industry sales of $40 billion during the month of April 2023, up by 0.3% compared to the March 2023 total of $39.8 billion and 21.6% less than the April 2022 total of $50.9 billion. TSMC Opens Advanced Backend Fab 6 6/12/2023 The company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. STMicroelectronics and Sanan Optoelectronics to Set Up SiC JV in China 6/12/2023 STMicroelectronics and Sanan Optoelectronics will create a new 200mm SiC device manufacturing joint venture in Chongqing, China. Kioxia sampling UFS 4.0 6/5/2023 UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2Gbps per lane or 46.4Gbps per device. Japan and South Korea ramp up chip collaboration amid U.S.-China tensions 6/5/2023 With the fate of their businesses in China — their biggest market — becoming hazier, South Korean makers such are Samsung Electronics and SK Hynix are expected to beef up cooperation with Japan to maintain a competitive edge and get through the tough times ahead. Broadcom forecasts third-quarter revenue above estimates thanks to AI 6/5/2023 The viral success of ChatGPT has sparked a surge in orders for chips that underpin the technology at big data centers, driving a rally in shares of semiconductor companies that cater to the hottest slice of the market. Kioxia, Western Digital in merger talks 6/5/2023 The move that could create a new memory chip company with a global share on par with its leading rivals. Amazon $25 million for violating the Children’s Online Privacy Protection Act 6/2/2023 "Amazon’s history of misleading parents, keeping children’s recordings indefinitely, and flouting parents’ deletion requests violated COPPA and sacrificed privacy for profits," DRAM shipments declined in Q1 6/2/2023 TrendForce has reported a dramatic 21.2% quarter-on-quarter (QoQ) decline in the first quarter (Q1 2023) revenues for the DRAM industry, bringing total revenue down to $9.663 billion. Amprius opens its first factory to help send electric aircraft aloft 6/2/2023 The 15-year-old company has won customers that include British defense giant BAE Systems and Airbus, the world’s largest aircraft maker. Within a few years, Amprius expects its batteries to power flying vehicles. ADATA launched a wide range of comprehensive new products at COMPUTEX 2023 6/2/2023 ADATA's new products are sustainable and extraordinarily innovative, including the Gen5 SSD, CXL (Compute Express Link) memory module, CAMM (Compression Attached Memory Module), XPG titanium power supply (XPG FUSION 1600W), and professional industrial solutions. SK hynix is developing NAND flash memory with more than 300 layers 6/1/2023 SK hynix plans to begin the mass production of the 238-layer NAND in the first half of 2023. STMicroelectronics introduced the market’s first MEMS water/liquid-proof absolute pressure sensor 6/1/2023 “Our latest waterproof MEMS pressure sensors provide the environmental robustness needed to power digital transformation everywhere, with the long-term availability needed to protect customers’ designs.” Analog Devices Inc. added new facility in Singapore 6/1/2023 ADI established its first location in Singapore in 1995 and has steadily grown its operations and workforce since then. This new strategic investment aligns with the company’s global expansion plans, which include enhancing its capabilities in the Asia Pacific region. Jesen Huang delivered CompuTex keynote on AI boom 6/1/2023 His message was clear: AI, and particularly generative AI, is the next big thing with nearly every industry wanting it and potentially benefiting from it. TrendForce has reported a dramatic 21.2% QoQ decline in Q1 revenues for the DRAM industry 5/31/2023 Described as a significant drop, it represents the third consecutive quarter where revenues have fallen. According to TrendForce, a closer look reveals that increased shipment volumes were exclusive to Micron, with other suppliers seeing a decrease. The ASP fell for all three major suppliers. Smith, a global distributor of electronic components and semiconductors to exhibiting at COMPUTEX 2023 5/31/2023 Smith’s global industry outlook and vast, multichannel supplier network provide our customers with the tools and resources they need to manage their supply chains as markets continue to shift. This year marks the first in-person COMPUTEX since the pandemic 5/31/2023 Renowned for its cutting-edge expertise in areas such as foundry, PCB, and satellite positioning, Taiwan aims to leverage this year’s tradeshow to enhance its global presence and foster stronger international collaborations. Infineon couples two proven memory technologies to Meet Automotive Demands 5/31/2023 The semiconductor manufacturer claims to be the first in the industry to combine LPDDR with a non-volatile memory other than DRAM, making it a new category of product, Dyson to accelerate its international advanced manufacturing capabilities and global R&D footprint 5/30/2023 Dyson’s next generation battery technology will drive a major revolution in the performance and sustainability of Dyson’s machines,” MediaTek partners with NVIDIA Corp. to deliver in-vehicle AI cabin solutions for next generation EV 5/30/2023 “Through this special collaboration with NVIDIA, we will together be able to offer a truly unique platform for the compute intensive, software-defined vehicle of the future.”  57  |  58  |  59  |  60  |  61  |  62  |  63  |  64  |  65  |  66

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