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| Reports: Samsung to convert some lines to 236 layers |
9/4/2023 |
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Samsung Electronics is reportedly planning to convert some of its P1 facility production lines to 236-layer NAND for advanced products, sources say. The company is also launching an automated chip packaging line, intending to eliminate human labor from its packaging facilities by the end of the decade.
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| Qualcomm wants to boost its automotive chip market share |
9/4/2023 |
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Qualcomm hopes generative AI will help boost its chip share in the automotive sector, currently at just 3% of its revenue. The company estimates its automotive chip sales will surpass $9 billion in 2031, up from $1.32 billion in fiscal 2022.
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| Copper may be the next in shortage |
9/4/2023 |
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there are materials experiencing an increase in demand with little to no increase in availability, such as copper. Yes, that easy-to-refine metal that has been used for thousands of years is now on the “worry list.”
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| ASML to invest $313M in Taiwan |
9/1/2023 |
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Taiwan Investment Commission of the Ministry of Economic Affairs said on Tuesday that it has approved an application by ASML to infuse about NT$5.65 billion and 140 million euros (US$152 million), which is in excess of NT$10 billion in total, into ASML Taiwan, a subsidiary that specializes in rolling out wafer measuring equipment and provides its clients with technological support and training.
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| Gelsinger Concerns About U.S. Chip Fund and export controls |
9/1/2023 |
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“On one hand, they [Intel] are being asked to invest billions in advanced fab construction in the U.S. On the other, the U.S. Department of Commerce is prepared to slap further controls on Intel’s ability to ship commodity semiconductors to China that could significantly cut into its already-reduced revenue from the China market—in essence, a major double whammy.”
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| MediaTek working with Verizon, Ericsson on 5G devices |
8/30/2023 |
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MediaTek, Verizon and Ericsson have advanced technology for New Radio devices and internet of things solutions on Verizon's 5G network. The companies say the technology, which uses Ericsson's RedCap software and MediaTek's RedCap testing platform, is less complex and more economical.
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| MRigidCSP packaging increasing mechanical strength for battery management |
8/30/2023 |
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Alpha and Omega Semiconductor Ltd’s (AOS) MRigidCSP packaging technology decreases on-resistance while increasing mechanical strength of devices designed for battery management applications. AOS’s robust package technology is particularly suited to battery applications in smartphones, tablets, and ultra-thin notebooks.
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| South Korea to crack down on chip technology leaks |
8/29/2023 |
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South Korea plans to bolster regulations and sentencing around technology leaks for chips and displays as the country looks to keep ahead of competitors. Details on stricter punishments and sentencing guidelines will likely be released next
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| Sony Semiconductor to Launch Large-size, HD 1.3-type 4K OLED Microdisplay |
8/29/2023 |
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The new OLED Microdisplay is mainly intended for virtual reality (VR) and augmented reality (AR) head-mounted display applications. It delivers 4K resolution with a 1.3-type large-size display by employing miniaturization processes that SSS has achieved while developing camera electronic viewfinders (EVFs), as well as its own pixel drive circuits.
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| Synopsys acquired PikeTec for its automotive testing software |
8/25/2023 |
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PikeTec is a provider of testing and verification solutions for automotive software used in control unit systems. The strategic acquisition positions Synopsys as a key player in addressing the growing challenges faced by the automotive industry in testing and verifying software-defined vehicles
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