Home News Products Corporate Contact

Saturday, April 26, 2025

News Industry News Publications CST News Help/Support Software Tester FAQs

SK hynix has begun mass-production of of largest capacity mobile DRAM 8/14/2023 SK hynix said the 24-gigabyte low-power double data rate 5 eXtended (LPDDR5X) mobile DRAM was first supplied to Chinese Oppo’s latest flagship smartphone, AI Accelerator Chips Driving HBM3 Market 8/14/2023 As the demand for AI accelerator chips evolves, manufacturers plan to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become mainstream in the market next year. Telink Semiconductor to showcasing cutting-edge IoT chip technology at the upcoming Nepcon Vietnam 2023 8/14/2023 Dedicated to the pioneering concept of “Inside Electronics 4.0,” Telink Semiconductor is unwavering in its commitment to offering the most advanced chip solutions to a global clientele. Samsung Electronic might announce collaboration with AMD in the field of system semiconductors 8/11/2023 According to Korean media ZDNet Korea,and Ddaily, Samsung is expected to make the said announcement on October 5 at Samsung Semiconductor Research Center. High-bandwidth memory production seeing a boost from AI demand 8/11/2023 TrendForce, the market research firm now projects that aggressive supplier expansion will raise the HBM sufficiency ratio from -2.4% in 2022 to 0.6% in 2024. Arrow Electronics hosted an EvTech and AIoT of the Future seminar in Hanoi, Vietnam 8/11/2023 The seminar exhibited a wide range of EV (Electric Vehicle) and AIoT (Artificial Intelligence of Things) technology products and solutions that will help advance the development of electric mobility and smart cities. Winbond now certified to ISO/SAE 21434 international standard certification 8/11/2023 “Road vehicles – cybersecurity engineering,” is developed by the International Organization for Standardization (ISO) and the SAE International. It focuses on protecting road users by outlining requirements to ensure the robustness of automotive systems against cyber-attacks. SK Hynix looks into 321-layer NAND production 8/10/2023 SK hynix unveiled the sample of the 321-layered NAND flash chip at the Flash Memory Summit 2023 that kicked off its three-day run in Santa Clara, California. This is the first time any chipmaker has revealed a specific development timeline of a NAND with more than 300 layers. OLED panels to secure more than 50% market share in the smartphone industry 8/10/2023 thanks to a continuous decrease in costs OLED panels will secure more than 50% market share in the smartphone industry by 2023 Lithium battery manufacturer EVE Energy to build new manufacturing facility in Kulim, Kedah, Malaysia 8/10/2023 The new factory, which will be EVE’s 53rd, will have an initial investment of $422 million and will focus on the production of cylindrical lithium-ion batteries to support power tools and electric two-wheelers manufacturing in the country and across Southeast Asia. TSMC, Bosch, Infineon, and NXP Set Up JV to Bring Advanced Semiconductor Manufacturing to Europe 8/10/2023 TSMC, Bosch, Infineon, and NXP plan to jointly invest in ESMC in Germany to provide advanced semiconductor manufacturing services. Intel CEO Gelsinger is lobbying for a large portion of the $52 billion Chip Act Fund 8/9/2023 Gelsinger: “If I have 25% or 30% less market, I need to build less factories. You can’t walk away from 25% to 30% and the fastest-growing market in the world and expect that you remain funding the R&D and the manufacturing cycle.” STMicroelectronics Launches IR Sensor for Presence and Motion Detection in Building Automation 8/9/2023 The STHS34PF80 sensor contains thermal transistors that can detect stationary objects, unlike conventional PIR detectors that require the detected object to be moving to produce a measurable response from the sensor. indie Semiconductor and SiLC Technologies are partnering on LiDAR platforms 8/9/2023 This partnership will deliver fully integrated vision system platforms deploying frequency modulated continuous wave (FMCW) detection, redefining benchmarks for rapidly emerging LiDAR applications. China lags in AI chip ambitions 8/8/2023 Beijing’s ambitions of joining the world’s top memory-chip makers could seriously hinder China’s ability to develop large artificial intelligence (AI) models when the country is already reliant on US suppliers such as Nvidia for sanctions-compliant versions of graphics processing units, or GPUs, Nvidia clarifies GPU volume challenges come from chip packaging 8/8/2023 the company's GPU volume issues the company's GPU volume issues. Instead, the bottleneck in manufacturing enough GPUs that can cater to both consumer and professional workloads lies with the chip packaging steps that come after. Fujitsu offers Automotive Grade 512kb FeRAM 8/8/2023 The MB85RC512LY is a non-volatile memory with 512kb memory density and operates at a low power supply voltage from 1.7V to 1.95V. It features extremely low operating current. Renesas to Acquire Sequans 8/8/2023 The acquisition of Sequans will expand Renesas' presence in the WAN market space encompassing a broad range of data rates. Infineon to build new 200mm SiC fab in Malaysia 8/7/2023 Over and above the original investment announced in February 2022—Infineon will build the world’s largest 200-millimeter silicon carbide (SiC) Power Fab. The planned expansion is backed by customer commitments covering about €5 billion of new design-wins in automotive and industrial applications as well as about one billion euros in pre-payments. Intel's Arc A580 GPU keeps the market guessing 8/7/2023 The Arc A580 comes with 24 Xe cores, 8GB of GDDR6 memory across a 256-bit bus, and the same bandwidth as the Arc A750 and the 8GB version of the Arc A770 — 512GB/s. The maximum clock speed is said to be 1.7GHz, but the card surpassed it by far in the benchmark, maxing out at 2.4GHz. Hyundai, Kia, Samsung back AI chip startup Tenstorrent 8/7/2023 Tenstorrent, which before this funding had already raised $234.5 million was valued at $1 billion, is one of several upstarts looking to challenge Nvidia (NVDA.O), the market leader in supplying chips to develop artificial intelligence products like ChatGPT. Leading IC Firms Partner to Drive RISC-V Ecosystem Development 8/7/2023 Formed in Germany, this company will aim to accelerate the commercialization of future products based on the open-source RISC-V architecture. The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry. Initial application focus will be automotive. Greenpeace urged semiconductor companies to further embrace solar energy 8/4/2023 Survey found nearly half of respondents living near where Taiwan Semiconductor Manufacturing Co (TSMC) has or plans to establish operations would be willing to lease their roofs for solar panels. AMD say, to release two Navi 33-based graphics processing units: Radeon Pro W7600 and W7500. 8/4/2023 The GPUs are targeting professional and workstation users at an entry-level price. Teledyne LeCroy offers SSD Power and Sideband Test Capabilities 8/4/2023 SSD design and validation test engineers can now use the OakGate R350-G5-PowerPlus Rackmount Appliance to analyze voltage and current over time and under stress to determine SSD power utilization, efficiency, and consumption, and possibly find opportunities to improve SSD power consumption.  62  |  63  |  64  |  65  |  66  |  67  |  68  |  69  |  70  |  71

Copyright © 1994 - 2023 CST, Inc. All Rights Reserved