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Investors Rescue AI Chip Startup Mythic 3/27/2023 Former VP of engineering at Mythic, has announced a $13 million investment from existing and new investors. Co-founder Dave Fick has moved into the CEO position; he was previously CTO. Former CEO Mike Henry has left the business, the company told the press today. Renesas to Acquire Panthronics 3/27/2023 The acquisition will extend Renesas' reach into high-demand NFC applications in IoT, asset tracking, wireless charging, and automotive applications. Solomon Systech offers PM-MicroLED Display Driver 3/27/2023 MicroLED offers all the advantages of traditional displays but features longer lifetime, better durability, higher efficiency and brightness. Global fab equipment spending for front-end facilities is expected to rebound in 2024 3/24/2023 Global fab equipment spending for front-end facilities is expected to decrease 22% year-over-year (YoY) to $76 billion in 2023 from a record high of $98 billion in 2022 before rising by 21% YoY to $92 billion in 2024 to reclaim lost ground, Intel continue persue to acquire Tower Semiconductor 3/24/2023 Intel remains optimistic that it will take over Tower by end of June. SoftBank is seeking to raise prices on Arm IPO 3/24/2023 Arm intends to alter its royalty program, ceasing to charge chipmakers royalties for using its designs based on a chip's value, and instead charge device makers based on the value of the device, Toshiba accepts JIP's $15 billion buyout bid 3/24/2023 Toshiba's board gave the go-ahead to accept a buyout bid of $15.3 billion from an investing consortium headed by the Japan Industrial Partners fund, which includes Rohm, Orix, Chubu Electric Power and several Japanese banks. The group plans to relist the company, according to sources report. Qualcomm is accelerating the movement of its supply out of China in favor of Taiwan 3/23/2023 Orders that had previously been entrusted to Chinese wafer foundries or packaging and testing factories are steadily being transferred to firms in Taiwan. Winbond and ST are partnering to integrate Winbond's specialty memory ICs with MCUs and MPUs. 3/23/2023 The partnership formalizes collaboration between the two companies to optimize integration and performance and assure long-term availability of Winbond and ST devices, Infineon and UMC Extend Automotive Partnership 3/23/2023 Infineon and UMC are partnering to multiply capacity for the production of Infineon MCUs to serve the rapidly expanding automotive market. UMC Sets Up R&D Center for Waste Recycling 3/23/2023 UMC's R&D center for waste recycling in STSP will serve as an important contributor for sustainable circular economy in Taiwan. Intel to debut "Granite Rapids" chip 3/22/2023 The sixth-generation Xeon Scalable "Granite Rapids" processors will reportedly outperform the Sapphire Rapids and Emerald Rapids CPUs. Global EV Sales Top 10 Million in 2022 3/22/2023 Global passenger electric vehicle* (EV) sales in the fourth quarter (Q4 2022) rose by 53% year-on-year (YoY) to bring the 2022 total to over 10.2 million units, according to the latest research from Counterpoint Technology Market Research’s Global Passenger Electric Vehicle Model Sales Tracker. Hailo Adds Vision Processor SoCs for Smart Cameras 3/22/2023 Three new chips feature CPUs and DSPs alongside an improved Hailo microarchitecture. Automotive operating systems (OSes) are becoming increasingly popular in the EV industry 3/22/2023 Multiple open-source initiatives are defining the software-defined vehicle. However, there is neither a widely accepted definition of an automotive OS nor a consensus on the functionality that it provides or the concepts that it implements. It is not an operating system in the traditional sense. HPE is collaborating with AMD to better secure the supply chain and boost sustainability 3/21/2023 Cybersecurity Ventures predicted that the global annual cost of cybercrime will reach $8 trillion in 2023. One security trend survey conducted last year found that supply chain attacks were impacting 62% of organizations. South Korea's leading semiconductor makers are likely to post deficits of billions of won in the first quarter 3/21/2023 According to Samsung’s regulatory filing to DART, the Financial Supervisory Service’s electronic disclosure board, Sunday, its inventory assets reached an all-time high of 52.2 trillion won ($39.9 billion) as of the fourth quarter last year, compared with last year’s 41.4 trillion won. EPC design wins a 67W USB PD charger using its 100V GaN FET, EPC2218 3/21/2023 This All-GaN fast charger with higher efficiency, state-of-the-art power density and lower system cost. onsemi's acquisition constitutes a long-term goal of improving its 300-mm capabilities. 3/21/2023 onsemi's EFK Fab Purchase Ups Its Sustainability Game. >Infineon and Apex.AI have integrated Apex.AI’s SDK and Infineon’s AURIX TC3X microcontroller 3/20/2023 Apex.Grace develops application software for software-defined vehicles. Apex.Ida, previously known as Apex.Middleware, provides a complete and integrated solution for intra- and inter-electronic control unit (ECU) communication and communication to the cloud. Japan to Lift Restrictions on Chip Material Exports to South Korea 3/20/2023 Japan said it plans to ease licensing requirements on fluorinated polyimide, hydrogen fluoride and photoresists — all essential ingredients for the manufacture of displays and semiconductors that go into gadgets including Apple Inc. iPhones. As advances in memory continue to evolve, so too does cybercrime 3/20/2023 New technology comes new threats, and as memory evolves, so does the opportunity for cybercrime. USB Type-C likely to continue its growth 3/20/2023 The USB Type-C ecosystem will continue to grow, and VIA Labs will continue actively support and participate in technical organizations and standards bodies that are the basis for the next generation of products. India set to announce its first semiconductor fabrication facility 3/17/2023 The country is well-positioned to foster a vibrant chip industry in the next three to four years on the “back of enabling policies” and the government’s drive to boost its “manufacturing ecosystem," Apple is readying 3nm process technology in the upcoming A17 and M3 (series) 3/17/2023 More computational performance at lower wattage than before, essentially enabling Apple’s devices to do more work for less energy.  62  |  63  |  64  |  65  |  66  |  67  |  68  |  69  |  70  |  71

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