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Second-Gen Starlink Satellites Have 4 Times More Capacity 2/28/2023 “This means Starlink can provide more bandwidth with increased reliability and connect millions of more people around the world with high-speed internet,” Qualcomm Pushes to Put 5G in Cars With Second-Gen Snapdragon Auto System 2/28/2023 Qualcomm says its new Snapdragon Auto 5G Modem-RF Gen 2 module will help bring media streaming, cloud gaming, and other connected services to cars. Samsung develops tiny new substrate for connected cars 2/28/2023 Samsung Electro-Mechanics has developed an automotive semiconductor package substrate tailored to driving assistance systems, in a move that extends the usable range of chip products for cars. Repairable Mobi phone design 2/28/2023 ust ahead of Mobile World Congress, HMD Global has announced a trio of Nokia phones, including the first one it built specifically with repairability in mind. The company has teamed up with iFixit to offer official repair guides and parts to help people fix issues such as a busted display, kaput battery or wonky charging port on the G22. European Commission have banned staff from using TikTok on government-issued devices 2/27/2023 Citing growing concerns about the Chinese-owned video sharing app, the policy-making institutions told a combined workforce of about 35,100 workers this week to remove TikTok from official handsets, as well as personal phones with access to EU Council services. NTT's prototype chip could boost internet speeds to 2 terabytes per second 2/27/2023 The company said its extremely compact new baseband amplifier integrated circuit module boasts an ultra-broadband performance of 100 gigahertz and is designed to be used with future all-photonics network technologies, Infineon Technologies introduced a design tool that can handle power factor correction for LED drivers 2/27/2023 The PFC plus LCC topology is said to be 5 to 6 percent more efficient than other commonly used two-stage topologies, but the design of LED drivers with this topology is highly time-consuming. Infineon’s new LCC tool, which is said to be a first in the market. Intel's Green-PC is 90% recyclable 2/27/2023 Intel announced the development of a "Green PC," featuring about 90% recyclable components. The chipmaker collaborated with Acer and Tsinghua Tongfang to design and produce the PC. AMD's Xilinx division launched new adaptive radio computing chips for the 5G telecom market 2/24/2023 AMD has also created a new Telco Solutions Testing Lab with VIAVI, enabling telco operators and telco solution providers to test scale computing resources to deliver on the increasing demands from RAN and edge-to-core computing. Nvidia stock rises after upbeat driven by A.I. chips 2/24/2023 Nvidia stock rose more than 8% in extended trading Wednesday after the company reported slightly higher revenue and net income for its fiscal fourth quarter than Wall Street expected, despite a year-over-year decrease in both categories. Gridspertise and STMicroelectronics sign MOU to expand on smart Meter technologiy 2/24/2023 The two companies’ collaboration started in the early 2000’s with one of Gridspertise’s shareholders Enel; today more than 65 million Gridspertise smart meters deployed in Spain, Eastern Europe, and Latin America leverage the power-line communication (PLC) technologies provided by ST. Keysight and SUTD Ink MoU on Open RAN, 6G Technology Collaboration 2/24/2023 Keysight and SUTD will conduct research in the areas of O-RAN security, sustainability, and standards, and 6G technologies. Server memory products are likely to overtake mobile memory in share of the overall DRAM bit output 2/23/2023 DRAM suppliers will instead keep growing the share of server memory in their portfolio, to the point where it will make up about 37.6 percent of the bit output this year, compared with about 36.8 percent for mobile DRAM. Ambarella Selects Samsung’s 5nm Technology for Automotive AI Controller 2/23/2023 This collaboration will help transform the next generation of autonomous driving vehicle safety systems by bringing new levels of AI processing performance, power and reliability. Chipletz selected Siemens packaging technologies for the design of their unique Smart advanced packages 2/23/2023 The company’s Smart Substrate products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Wireless SoC enhance IoT device designs 2/23/2023 These devices are comprised of a number of key components, including the processors, radios, power management, memory, interfaces and peripherals. EMP Shield to build new manufacturing plant in Burlington. KS 2/22/2023 EMP Shield, manufacturer of commercial and residential devices that protect against high-altitude electromagnetic pulses (EMP's), will build a $1.9 billion chip manufacturing facility in Burlington, Coffey County, Kansas, Gov. Laura Kelly announced. Renesas and AMD to Demo Full RF, Digital Front-End Design for 5G AAS Radios at MWC 2023 2/22/2023 The RF front end includes RF switches, low-noise amplifiers and pre-drivers. It offers a complete solution to meet the demand of the growing mobile network infrastructure market. TMYTEK and NI Partner on Rapid mmWave Prototyping Solution 2/22/2023 TMYTEK and NI have developed a rapid mmWave prototyping solution that integrates the NI Ettus USRP X410 and TMYTEK UD Box 5G frequency converter with BBox 5G beamformers. UMC and Cadence Partner on 3D-IC Hybrid Bonding Reference Flow 2/22/2023 UMC's hybrid bonding solutions are now ready to support the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communications. Amazon Mandates Return to Office 2/21/2023 Amazon's CEO argues that people 'tend to be better connected to one another when they see each other in person more frequently.' BEL has signed an MoU with the IISc Bengaluru to work on emerging technologies 2/21/2023 The MoU aims at leveraging the complementary strengths and capabilities of BEL and IISc, enabling both parties to develop various products and services wherein AI is embedded and integrated. Analog Devices to Showcase the Future of Connectivity at MWC 2023 2/21/2023 Analog Devices will feature interactive demonstrations and expert discussions at the upcoming Mobile World Congress (MWC) 2023. ReRAM technologies are expected to begin entering the mainstream this year 2/21/2023 All this investment is an opportunity for companies that supply technologies for advanced systems on chips (SoCs) such as EDA, equipment, and embedded technologies like Weebit’s ReRAM Non-Volatile Memory (NVM) IP. State of Oregon looking to spend $200M to boost its chip Industry 2/20/2023 Those investments could add 35,000 jobs and nearly $3 billion in new revenue over the next 20 years.  65  |  66  |  67  |  68  |  69  |  70  |  71  |  72  |  73  |  74

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