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Cadence's Virtuoso Studio allows more than a 3X improvement in design throughput 4/25/2023 Virtuoso Studio addresses the challenges customers face with larger, more complex designs, empowering them to analyze and verify designs to ensure that design intent is maintained throughout the design cycle. This new platform features seamless integration with other Cadence solutions. Consider software test automation as one of the top technical challenges impacting the satellite industry 4/25/2023 “The satellite industry is undergoing a major transformation, driven by accelerating technology development in the commercial space sector and is now turning out new designs with vastly reduced cycle times,” Memory packaging revenues are estimated to be worth $31.8 billion in 2028 4/24/2023 DRAM will grow with a CAGR22-28 of around 13%, reaching around $20.7 billion in 2028, while NAND will grow at a faster pace, with a CAGR22-28 of around 17%, and its packaging revenue is forecast to reach around $8.9 billion by 2028. TSMC forecast sales to tumble 16% in Q2 4/24/2023 The world's largest chipmaker said industry inventories were higher than expected and would only rebalance to a healthier level in Q3. Silicon Production Expansion Driving Price Drops 4/24/2023 production capacity continues to expand, while silicon wafer makers struggle to absorb excess inventory. According to TrendForce, this imbalance has led to a gradual and persistent decline in prices. The lowest quoted price has already dipped to CNY180/kg ($26.10), with average market transaction prices hovering around CNY190/kg. GaN and SiC Technologies on Spotlight at PowerUP Asia Conference 4/24/2023 WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023. Intel Preps 2000W Coolers for Future Chips 4/21/2023 Firm will turn to “new materials and structures” to soothe its next-gen architectures. SK hynix to develop 12-layer HBM3 product with a 24 gigabyte (GB) memory capacity 4/21/2023 HBM or high bandwidth memory is a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to traditional DRAM products. HBM3 is the 4th generation of the previous products HBM, HBM2 and HBM2E. ASML's net profit in Q1 outpaces expectations 4/21/2023 ASML posted a threefold jump in net profit to 1.96 billion euros ($2.15 billion) on revenue up 91% at 6.74 billion euros. Analysts had forecast net profit of 1.62 billion euros on revenue of 6.31 billion euros, Refinitiv data shows. Hitachi High-Tech Corp to construct a new production facility in Kasado Area of Kudamatsu City 4/21/2023 This is to increase production capacity of etching systems for its semiconductor equipment manufacturing business, with production scheduled to begin in FY2025. Cadence Design Systems demonstrates interoperability between LPDDR5X memory interface IP and SK hynix’s LPDDR5T 4/20/2023 This development follows Cadence’s earlier announcement of the first LPDDR5X memory interface IP design operating at 8533Mbps and SK hynix’s first announcement of its LPDDR5T mobile DRAM technology operating at 9600Mbps. SK Hynix joins in providing high bandwidth memory 4/20/2023 SK Hynix will likely be the primary beneficiary of the HBM rally as it leads shipments of this type of memory, holding a 50% share in 2022, according to TrendForce. TI Launches Stand-alone Active EMI Filter ICs for High-density Power Supply Designs 4/20/2023 Texas Instruments Inc. (TI) has launched the industry’s first stand-alone active electromagnetic interference (EMI) filter integrated circuits (ICs), enabling engineers to implement smaller, lighter EMI filters, to enhance system functionality at reduced system cost while simultaneously meeting EMI regulatory standards. NexCOBOT is showcasing a new functional safety robot control solution in Hannover Messe 2023 4/20/2023 NexCOBOT’s PC-based robot control platform-SCB100, coupled with Synapticon’s smart servo drive and safe motion module form the next generation modularized collaborative application robot control ROBASafe solution, building the world’s first x86 SIL 2/SIL 3 robot control solution. China’s memory production is expected to decline over the next two years 4/19/2023 All in all, China’s share of global NAND Flash capacity is expected to drop from 31% to 18% by 2025. TSMC expected to post a 5% fall in first-quarter net profit 4/19/2023 The world's largest contract chipmaker and a major Apple Inc (AAPL.O) supplier, is likely to report net profit for the January-March period of T$192.5 billion ($6.30 billion), down from T$202.7 billion a year earlier, according to the average of 21 analysts polled by Reuters. STMicroelectronics BMS Controller Enhances Performance of Lithium Batteries 4/19/2023 The many built-in features include a dual pre-driver for controlling battery-pack safety relays, which can be programmed for high-side and low-side connection. An embedded non-volatile memory for configuration data relieves the microcontroller from reprogramming the device at each startup. An I2C interface handles configuration and host communication to share battery state-of-charge (SOC) and state-of-health (SOH). AI is just a few years away from replacing human car drivers 4/19/2023 “Somebody who buys a car in the next couple of years, when they get it, it might not be autonomous, but a software update in the future will make it autonomous,” Arm could become liable for $8.5 billion of Softbank debt 4/18/2023 If Arm does not file for its public offer by the end of September it could become liable for $8.5 billion of Softbank debt for which it was made a guarantor. CHIPS Program Office has received more than 200 Statements of Interest (SOIs) from potential applicants 4/18/2023 More than half of the statements indicate interest in the first funding opportunity covering commercial fabrication facilities, including for leading-edge, current-generation, and mature-node chips, as well as back-end packaging facilities. Renesas' Cloud Kits Now Support Microsoft Azure cloud services 4/18/2023 Renesas' cellular-to-cloud development kits powered by its 32-bit MCUs now fully support Microsoft's Azure cloud services. Keysight Launches Compact Network Test Solution for Automotive, Industrial IoT Applications 4/18/2023 Keysight's Novus mini network test platform addresses the needs of network engineers as they deploy automotive and IIoT devices. Apple has committed to using 100 percent recycled cobalt in all Apple-designed batteries by 2025 4/17/2023 It also expects to use completely recycled rare earth elements in its magnets by that point, and all in-house circuit board designs will use fully recycled gold plating and tin soldering. Bloomberg: US buys more IC gear from Taiwanese vendors 4/17/2023 Taiwan, a global hub for silicon fabrication advances, saw its chipmaking machine exports to the US rise 42.6% in March from a year earlier, reaching a new high of $71.3 million, Brewer Science has New Developments in Advancing EUV Lithography 4/17/2023 Director of Emerging Materials Technology, will present on new developments in underlayers and their role in advancing EUV lithography at this week’s Critical Materials Council (CMC) Conference 2023.  68  |  69  |  70  |  71  |  72  |  73  |  74  |  75  |  76  |  77

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