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India aims to lure US chipmakers with incentives, alliances 8/1/2023
India’s chip strategy consists of two major parts. The first is luring in foreign firms to set up operations and invest in the country while the second is on forming alliances with other key semiconductor nations like the U.S.
Intel invests in education to address worker shortfall 8/1/2023
Intel is preparing for the opening of two semiconductor plants east of Columbus, Ohio by 2025, according to WOSU Public Media. The company intends to hire around 3,000 employees initially and is investing $17.7 million in eight academic institutions over three years for course development, equipment, and recruitment of students.
Microsoft sees outages ahead if AI chip demand isn't met 8/1/2023
Microsoft is warning about possible disruptions in services if it is unable to secure graphics processing units for data centers as demand rises with the popularity of generative AI.
TSMC pledge loyal ty to the Taiwan government 7/31/2023
TSMC production lines have expanded beyond Taiwan as Western powers have raised concerns about the crucial industry being centred on an island that China claims as its territory -- having ramped up political and military pressure on it over the past year.
Analog Devices expandx Ore. wafer fab with $1B investment 7/31/2023
The facility investment expands cleanroom space to about 118,000 sq-ft and nearly doubles internal manufacturing of products running on the 180-nanometer technology node and above.
Toshiba Corp. expects $15 billion buyout offer by a group led by Japan Industrial Partners in August 7/31/2023
The Tokyo-based firm sees the take-private bid as a chance to recover from years of scandals, management overhauls, losses in its nuclear power operations and the sale of its prized memory-chip business.
Intel is back in the black after two quarters 7/31/2023
Intel, after two quarters of losses, returned to profitability in the second quarter and is outpacing analyst expectations in its Q3 forecast. CEO Pat Gelsinger says the plan is to "build AI into every product that we build.
Micron Technology has begun sampling the industry’s first 8-high 24GB HBM3 Gen2 memory 7/28/2023
Those stats are a 50% improvement over currently shipping HBM3 solutions and with a 2.5 times performance per watt improvement over previous generations, Micron is claiming that its HBM3 Gen2 is setting new records for AI data centre metrics such as performance, capacity and power efficiency.
onsemi has secured long-term supply agreements with 8 out of 10 leading global manufacturers of solar inverters 7/28/2023
By offering superior die technology with optimized and customized module design and packaging, onsemi enables solar inverter providers to compete on time-to-market, product development, supply resilience and robust quality assurance.
Applied Materials’ Vistara platform is its most significant wafer manufacturing platform innovation in a decade 7/28/2023
Vistara was developed over more than four years by hundreds of engineers from across Applied’s hardware, software, process technology and ecoefficiency design teams.
Silicon Box to build advanced silicon fab in Singapore 7/28/2023
Silicon Box has launched the world's most advanced semiconductor factory in Singapore, positioning the country as a global leader in high-performance.
SK Hynix posted a second-quarter operating loss of $2.24 billion as demand for memory chips remained sluggish 7/27/2023
“In the future, the AI related semiconductors or the DRAMs, are going to have a big impact,” Anthony Sassine, senior investment strategist at KraneShares told CNBC Wednesday. “These are expected to grow between 35% to 40%.
US outmatched by Taiwan on chips 7/27/2023
Acer founder Stan Shih said, the computer brand pioneer said that regardless of cultural factors, the U.S. would be unable to replicate Taiwan’s formula, CNA reported.
NXP and Mahindra Ink MoU to Drive Next-Gen Smart E-Mobility 7/27/2023
Mahindra & Mahindra Ltd to jointly explore the electric and connected vehicle landscape, covering a wide range of vehicles including utility vehicles, light commercial vehicles, farm equipment, and tractors.
Intel Collaboraties with Ericsson to Advance Next-Gen Optimized 5G infrastructure 7/27/2023
Intel will manufacture custom 5G SoCs for Ericsson to create highly differentiated leadership products for future 5G infrastructure .
Foxconn and ADI looking to create more user-friendly automotive cockpits 7/26/2023
Foxconn CEO and Chair Young Liu and ADI CEO and Chair Vincent Roche signed the deal on July 20, according to Foxconn. The two companies will look to use ADI’s hardware and software solutions and Foxconn’s electronic design, system-level integration capabilities, and manufacturing expertise to create more user-friendly automotive cockpits.
TSMC plans to invest $2.87 billion in an advanced chip packaging plant in Taiwan 7/26/2023
The investment was sparked by “the rapid growth of the AI market” which has “driven a surge in demand for TSMC’s advanced packaging,”
Cadence to acquire Rambus PHY IP assets 7/26/2023
Cadence Design Systems and Rambus, a chip and silicon IP provider, have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business.
Cerebras and G42 Unveil 4-exaFLOP Supercomputer 7/26/2023
Cerebras and G42 have launched Condor Galaxy, a network of nine interconnected supercomputers that offers a new approach to AI compute.
Global semiconductor industry’s shortage of workers is likely the largest impediment to growth 7/25/2023
Compensation for fab workers has soared, but that’s not helping to increase the supply of qualified workers. As an aging generation of semiconductor engineers prepares to retire, chipmakers are having difficulty finding younger people to replace them.
Foxconn’s failed India chip venture shows it is tough it is for new player 7/25/2023
“Established players such as TSMC, Samsung or Microncount with several decades of R&D (research and development), process engineering and trillions of dollars in investment to reach their current capabilities.”
TrendForce: NAND Flash ASP to Continue to Slide in 3Q23 7/25/2023
Given that the trajectory of market demand is still unclear, it is expected that the NAND flash market will continue to be in a state of oversupply in the third quarter (Q3 2023), according to TrendForce. Cautious inventory management by buyers is preventing a stabilization in NAND flash prices even with an anticipated seasonal surge in demand for the second half (H2 2023).
How can we ensure the IoT's growth will continue? 7/25/2023
What must we do, as an industry, to take the IoT to the next level? To drive the IoT forward, we must focus on:

Accelerating software,

Securing products,

Connecting teams, and

Empowering data governance.

Cadence to Acquire Rambus SerDes, Memory Interface PHY IP Business 7/24/2023
Rambus will retain its digital IP business, including memory and interface controllers and security IP.
US, Panama work together to improve semiconductor supply chain 7/24/2023
“The United States views Panama as a partner in ensuring the semiconductor supply chain is diverse and resilient,”
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