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Fabless Startup DEEPX Lands 3 CES Innovation Awards


Monday, December 4, 2023

AI chip company DEEPX has been recognized as a globally innovative technology by winning the CES Innovation Award in three categories, including computer hardware, embedded technology, and robotics, for its independently developed AI chip technology, ahead of Consumer Electronics Show 2024 to be held in Las Vegas, USA, in January.

CES is the world’s largest electronics exhibition since 1967, and the CES Innovation Awards, organized by The Consumer Technology Association (CTA), have served as a beacon for global innovative technologies. DEEPX’s CES Innovation Award is the first achievement of AI chip companies in the world, and DEEPX’s products and technologies that have won the Innovation Award will receive various business support from the CTA, such as finding international partners and attracting investment.

DEEPX was recognized with three CES Innovation Awards in the following categories: in the Embedded Technology category, the “All-in-4 AI Total Solution” consisting of four AI chips optimized for AI capabilities and performance was selected for applying AI technology to various embedded systems; in the Computer Hardware category, the DX-H1 technology that specializes in minimizing energy consumption in high-performance AI computation processing in servers and data centers to reduce carbon emissions; and in the Robotics category, the DX-M1 module, which makes edge devices such as robots even more intelligent for unmanned industrial sites and social infrastructure as well as daily life.

The award is based on DEEPX’s ultra-gap source technology. DEEPX’s AI chip source technologies include the latest AI algorithm support technology for edge AI applications, GPU-level high AI accuracy, the world’s highest effective power-to-performance ratio, the only AI chip company in the world to offer an all-in-4 AI total solution consisting of four products optimized for various AI applications, technology that minimizes on-chip SRAM and off-chip DRAM usage requirements to minimize AI technology implementation costs, and DEEPX Software Development Environment (DXNN) technology that can unify and support four AI chip products for various AI application development. In addition, DEEPX is currently applying for more than 200 patents in the U.S., China, and Korea, the most in the world for edge AI chip development, to develop original AI chip technology and capture the early market for cutting-edge technology.

“DEEPX declared at the outset that we would dominate the global market by developing the world’s best AI chip source technology. We have planned, developed, and produced chip products to create super-gap innovations in all sectors that become the standard for AI chip technology. As a startup, it took tremendous pressure and hard work during the development period to secure the original AI chip technology. I believe that winning three CES Innovation Awards for the first product developed by a company that developed the original technology is an honor like the best newcomer award that can only be given once. We will continue to challenge ourselves to constantly develop new technologies so that the name ‘DEEPX’ will be synonymous with ‘the world’s best original technology company’,” said DEEPX CEO Lokwon Kim.

The winning source technologies and products will be showcased at CES 2024, January 9-12, 2024, in Las Vegas, Nevada, as innovative technologies that will shape the future.

By: DocMemory
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