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Intel Foundry and Arm to Collaborate on Leading-Edge SoC Design 4/13/2023
The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications.
Rambus, SK Hynix add 10 years to patent license deal 4/12/2023
Effective July, 2024, the extension maintains similar financial terms and provides SK hynix with broad access to the full Rambus patent portfolio through mid-2034. Other terms and details are confidential.
EPC offers radiation-hardened GaN FET for power conversion solutions 4/12/2023
Two new devices rated at 100V and 200V to address a multitude of critical spaceborne and other high-reliability applications.
Cadence Design named one of the 100 Best Companies to Work For by Fortune and Great Place 4/12/2023
This is Cadence’s ninth year in a row being named to this prestigious list, coming in at #35 this year. Cadence is being honored for its core belief that culture drives business success.
Enfabrica's first chip allows I/O to scale, so AI inference isn't memory bound 4/12/2023
The ACF will, the company said, elastically bind CPUs and accelerators to memory and storage, eliminating I/O bottlenecks.
MRDIMMs (multi-ranked buffered DIMMs) could be the standard among buffered DIMMs by 203x 4/11/2023
AMD has voiced its commitment at MemCon 2023 to help push JEDEC's MRDIMM open standard, which will significantly boost bandwidth over standard DDR5 DIMMs.
Head of AMD’s influential research group left company after 15 years 4/11/2023
Alan Lee, the head of AMD Research, announced Friday on LinkedIn that he has decided to “move on” from the Santa Clara, Calif.-based company, where his group “created a large number of new technologies for the good of AMD, the compute ecosystem and humankind.”
Global Semiconductor Sales Down 4% in February 4/11/2023
“Global semiconductor sales continued to slow in February, decreasing year-to-year and month-to-month for the sixth consecutive month,” said John Neuffer, SIA president and CEO.
STMicroelectronics' latest N-channel power MOSFETs combine extremely low gate-drain and on-resistance 4/11/2023
The new MOSFETs leverage ST’s advanced STPOWER STripFET F8 technology, which introduces an oxide-filled trench that permits very low conduction losses combined with low gate charge for efficient switching performance.
Samsung cuts memory chip production 4/10/2023
Samsung said it would cut memory chip production to a “meaningful level,” a move competitors had been waiting for after a pileup of inventory hurt pricing and profits.
4Q22 Global NAND Flash Revenue Down 25% 4/10/2023
Enterprise SSD took the brunt of the fall with prices plummeting 23–28%. Despite manufacturers lowering prices in an attempt to drive up demand, clients are hesitant to purchase more components for fear of overstock. As a result, NAND Flash bit shipments rose by a mere 5.3% as ASP fell 22.8%.
GM–GlobalFoundries Partnership reduce risks for automotive OEMs and suppliers alike 4/10/2023
GM and GlobalFoundries last month made a “first of a kind” pact under which the New York–based chipmaker will manufacture for GM’s key chip suppliers. The partnership comes as shortages of car chips continue to constrain automobile production even as electrified and autonomous vehicles are expected to double vehicle chip content during this decade
6G Set to Primarily Be an Industrial IoT Network 4/10/2023
Cellular-based positioning technology for critical IoT industrial cases will be one of the key elements in future 6G networks.
Infineon leads the auto pack 4/7/2023
Infineon was the top supplier growing revenues 24.5% and taking 13% market share.
Billionaire Anil Agarwal’s wants to build a $19 billion chipmaking plant in India 4/7/2023
Seven months after Agarwal announced a chip partnership between his Vedanta Resources Ltd. and Taiwan’s Hon Hai Precision Industry Co., the venture is yet to tie up with a fabrication unit operator or license manufacturing-grade technology,
AMD and Samsung are renewing their GPU architecture licensing agreement for Exynos SoCs 4/7/2023
The latest multi-year deal between AMD and Samsung will see Samsung continuing to license AMD’s Radeon graphics architectures for use in the company’s Arm-based Exynos SoCs, with the two companies committing to work together over “multiple generations” of GPU IP.
APAC Tablet Market Forecast to Shrink in 2023 Amid Weakening Demand 4/7/2023
Tablet shipments are expected to decline by 11.5% in 2023 as demand slowed after the pandemic. Consumer shipments grew by 4.5% in 2022, totaling 45.4 million units.
Infineon and Delta Electronics expands their long-term cooperation to automotive applications 4/6/2023
The companies recently signed a Memorandum of Understanding (MoU) that will deepen their joint innovation activities to provide more efficient and higher-density solutions for the fast-growing market of electric vehicles (EV).
Lancaster University to develop a universal memory called ULTRARAM 4/6/2023
ULTRARAM is a novel type of memory that combines the non-volatility of a data storage memory, like flash, with the speed, energy-efficiency and endurance of a working memory, like DRAM.
EPC Releases Phase 15 Report on GaN Reliability 4/6/2023
EPC's Phase-15 Reliability Report documents continued work using test-to-fail methodology and adding specific reliability metrics and predictions for real world applications of GaN.
Amkor increases effort on silicon carbide (SiC) as it becomes a key candidate in automotive power solutions 4/6/2023
Amkor has a proven record of leadership in applications for automotive semiconductors, including body electronics and connectivity, vehicle controls, ADAS, and infotainment.
Plataine, Nepes to build world’s first chip AI factory in Korea 4/5/2023
Israel’s Plataine and Nepes signed a memorandum of understanding (MoU) on AI factory cooperation in Tel Aviv, Israel, on Sunday. Under the MoU, the two companies plan to establish a joint venture in the first half of this year and transform Nepes’ main production facility in Goesan, North Chungcheong Province into an AI factory.
sureCore has created a new range of ultra-low voltage SRAM solutions that can operate down to 0.45V 4/5/2023
ecause both the logic and memory can interface at the same voltages, they can be adjusted in tandem to increase and decrease performance and therefore power consumption simultaneously as required by the application.
Ga. Tech, GlobalFoundries plan workforce collaboration 4/5/2023
Chip industry may face a worsening shortage of engineers as the decade plays out.
Intel aims to recruit young workers with new plant 4/5/2023
Officials said Most of the positions are expected to be technicians, which require a two-year associate degree or less, and Intel officials say they are working on a shorter curriculum aimed at easing barriers to these careers.
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