Home News Products Corporate Contact

Monday, December 23, 2024

News Industry News Publications CST News Help/Support Software Tester FAQs

Major CSPs Boosting Demand for AI Chips, HBM 6/30/2023 Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for high bandwidth memory (HBM) during 2023 to 2024 but is also expected to boost growth in advanced packaging capacity by around 30 to 40% in 2024. Keysight to Acquire ESI Group 6/30/2023 The acquisition will expand Keysight's application layer portfolio with simulation capabilities that are critical to accelerate innovation in multiple... 3 major governments are investing in their Semiconductor industries 6/30/2023 The United States, the European Union, and Japan are looking to revamp the global chip supply chain. onsemi announced positioning system that simplifies power-efficient asset tracking solutions 6/29/2023 The system is based on the company’s RSL15 MCU, a low power Bluetooth 5.2 MCU, and which incorporates software algorithms and components provided by Unikie and CoreHW, delivering a fully integrated solution with components that have been optimised to work together. Hyundai Motor and Kia invested an extra 2 billion won ($1.53 million) in startup BOS Semiconductors 6/29/2023 BOS Semiconductors is a fabless company that designs and develops system semiconductors tailored to the software and requirements of customers in the automotive industry. Samsung sets strategy to complete with TSMC 6/29/2023 Samsung has now given a more detailed road map, saying it will begin mass production of the 2-nm process for mobile applications in 2025, then expand to high-performance computing in 2026 and to automotive in 2027. STMicroelectronic offers automotive-qualified integrated hot-swap and ideal-diode controller 6/29/2023 The ideal-diode controller drives an external MOSFET replacing a Schottky diode conventionally used for reverse-input protection and output-voltage holdup. The reduced voltage drop across the MOSFET reduces power dissipation during normal operation, compared to the forward voltage of the Schottky diode. Toshiba offers MCUs with expanded flash memory 6/28/2023 With the newly released products, Toshiba has expanded the maximum code flash memory capacity of the M3H group from the previous 512KB to 1MB and RAM capacity from 66KB to 130KB. Within its M3H group of products, Toshiba now offers four code flash options with combinations of seven different packages. U.S. says there will be a funding opportunity for semiconductor projects worth less than $300 million 6/28/2023 Up to now the funding opportunities have been for more expensive projects. Micron Technology Inc. plans to build a new assembly and test facility in Gujarat, India 6/28/2023 Phase 1, which will include 500,000 square feet of planned cleanroom space, will start to become operational in late 2024, and Micron will ramp capacity gradually over time in line with global demand trends. Intel has set its sights on a new material for chip substrates: glass. 6/28/2023 Glass’s stiffness and lower coefficient ratio of thermal expansion make it superior to organic substrates because it doesn’t expand and warp as much. Samsung Electronics to begin mass-producing HBM chips for the booming artificial intelligence (AI) market 6/27/2023 As the market for generative AI services continues to grow, HBM chips used for AI servers are gaining traction in the memory chip industry, which has been struggling with falling demand. Global Cellular IoT Connections to Reach 6bn by 2030 6/27/2023 Counterpoint expects the market to grow at a compound annual growth rate (CAGR) of 10.8% to reach an installed base of over 6 billion by 2030. China held more than two-thirds of total cellular IoT connections in 2022, followed by Europe and North America. NFC Forum has unveiled its Technology Roadmap outlining key plans and research efforts through 2028 6/27/2023 This comprehensive roadmap includes five key initiatives and offers a unique glimpse into the future of Near Field Communication (NFC) technology, highlighting its direction and anticipated product development, market, and business opportunities for the next two to five years. Arrow Electronics established a Robotics Center of Excellence to help customers for their development 6/27/2023 Arrow has teamed with Analog Devices Inc. (ADI), NVIDIA, and onsemi image sensors to develop reference designs and proof of concepts that robotics customers can leverage to improve product design. Samsung, AMD to develop GPU for automotive use 6/26/2023 Samsung Electronics and Advanced Micro Devices are working together on a graphics processing unit for the Exynos Auto V920 chip. The Samsung Xclipse GPU will go into the auto chip with AMD's RDNA 2 architecture. SK hynix,show case server memory solutions at at an IT conference in Las Vegas 6/26/2023 SK said it also presented its latest advanced memory solutions at the showroom, including the High Bandwidth Memory 3, which has recently attracted attention with the rise of generative artificial intelligence. DigiKey and GroupGets Collaborate to Help Hardware Startups to Bring Products to Market 6/26/2023 Through the “Get Made” program, GroupGets and DigiKey will cross promote qualifying devices through content, design, distribution and partial funding through DigiKey. Upon successful funding, GroupGets will work with the creators to manufacture the platforms and then DigiKey will list the platforms for sale on its website. In the case of AMD AI against Nvidia AI 6/26/2023 One thing is for sure: The size of this opportunity is more than big enough for two players. TSMC leads in AI and HPC GPU productions 6/23/2023 Nvidia and AMD benefit from the AI and HPC trends, but TSMC controls chip production Micron offers its first UFS 4.0-compliant storage devices 6/23/2023 Micron offering a combination of improvements coming from the UFS specification itself, along with including newer, faster NAND within the storage devices. Micron expects its UFS 4 devices to be used by upcoming flagship smartphones, tablets, and ultra-low-power notebooks already this year. Q1 revenue of the top ten fabless companies was flat at $33.86 billion 6/23/2023 Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged. India Prime Minister Modi has invited American chip makers to boost semiconductor manufacturing in India 6/23/2023 Modi in his meeting here with President and CEO of Applied Materials Gary E Dickerson discussed the potential of the company's collaboration with academic institutions in India to create a skilled workforce. Cisco Systems launched networking chips for AI supercomputers 6/22/2023 Chips from its SiliconOne series are being tested by five of the six major cloud providers, Cisco said, without naming the firms. Key cloud players include Amazon Web Services, Microsoft Azure and Google Cloud, which together dominate the market for cloud computing, according to Bofa Global Research. STMicroelectronocs (ST) and Airbus to cooperate on wide bandgap chip materials 6/22/2023 According to a jointly published press release, both ST and Airbus have already conducted evaluations to explore the benefits of wide bandgap (WBG) semiconductor materials for aircraft electrification  55  |  56  |  57  |  58  |  59  |  60  |  61  |  62  |  63  |  64

Copyright © 1994 - 2023 CST, Inc. All Rights Reserved